Abstract: Systems for optically detecting single-analytes, such as cells, nucleic acids, and polypeptides, are described. The described optical detection systems are suitable for multiplexed detection of single-analytes, including single-analytes provided in an array-based format. Methods for identifying single-analyte properties and interactions utilizing optical detection systems are provided.

Abstract: A thermal forcing system for controlling a temperature of a device under test (DUT) includes a thermal plate, heater, temperature sensor, cold head, actuator, and controller. The thermal plate is thermally coupleable to the DUT. The temperature sensor senses a temperature of the thermal plate. The cold head has a temperature which is lower than that of the thermal plate. The controller is configured to: receive information of the temperature sensed by the temperature sensor; determine a temperature difference between a setpoint temperature and the temperature sensed by the temperature sensor; and command the actuator to move the cold head relative to the thermal plate or command the heater to heat the thermal plate, in response to the temperature difference, so as to facilitate adjusting the temperature of the thermal plate, and consequently the DUT, to the setpoint temperature.

Abstract: A test socket has a housing structure that holds conductor pins which provide mechanical and electrical connections between vertically aligned contacts of a device under test and a PCB. The housing structure comprises a top housing and a bottom housing. The top housing has counterbore holes to receive and vertically constrain top ends of the conductor pins. The bottom housing comprises a sheet and an optionally attached supporting frame. The sheet has through-holes that are vertically aligned with the counterbore holes of the top housing to receive and vertically constrain bottom ends of the conductor pins when the top and bottom housings are attached to each other.

Abstract: An IC socket is pneumatically actuated and has an integrated heat sink. Thermally conductive elements of the heat sink extend through an opening of a pneumatically actuated element shaped as a closed curve of finite width so that heat radiating from the thermally conductive elements may dissipate through a top opening of the IC socket. Downward force exerted by the pneumatically actuated element is transferred through a gimbaled multi-plate and spring arrangement to provide even pressure on the die and substrate of an IC device being held in place by the IC socket. A spring-loaded ground tab on the bottom of the IC socket simplifies grounding of the IC socket to avoid damaging the held IC device by static discharge.

Abstract: An IC socket is pneumatically actuated and has an integrated heat sink. Thermally conductive elements of the heat sink extend through an opening of a pneumatically actuated element shaped as a closed curve of finite width so that heat radiating from the thermally conductive elements may dissipate through a top opening of the IC socket. Downward force exerted by the pneumatically actuated element is transferred through a gimbaled multi-plate and spring arrangement to provide even pressure on the die and substrate of an IC device being held in place by the IC socket. A spring-loaded ground tab on the bottom of the IC socket simplifies grounding of the IC socket to avoid damaging the held IC device by static discharge.