Abstract: An integrated circuit package (10) comprises a semiconductor die (14), and a substrate (16) for receiving the semiconductor die. The substrate has an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. The semiconductor die is wirebonded to the substrate. An encapsulant (12) seals the top surface of the semiconductor die and serves to bond the semiconductor die to the substrate. The encapsulant also covers portions of the top side of the substrate.

Abstract: An integrated circuit package (10) comprises a semiconductor die (12), and a substrate (14) having a through-cavity opening (22) for receiving the semiconductor die. The bottom side of the substrate has solder pads (24) arranged as a peripheral pad grid array. The semiconductor die is wire bonded (26) to the to the top side of the substrate. An encapsulant (16) seals the top surface of the semiconductor die and circuitry, and portions of the top side of the substrate. The bottom surface of the semiconductor die remains exposed to the atmosphere, eliminating moisture-related die attach delamination issues and improving heat transfer away from the semiconductor die. Furthermore, the reduced contribution of the semiconductor die to overall package height results in an ultra low profile package.

Abstract: An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.

Abstract: An encapsulated electronic package (10) is made by bonding one or more semiconductor devices or integrated circuits (16) to a printed circuit board with an adhesive (14), and covering with a glob top encapsulant (15). The printed circuit board has a metal circuit pattern (12) on one side, and, optionally, solder pads (27) on the second side. The glob top encapsulant covers the integrated circuit, portions of the metal circuit pattern, and portions of the printed circuit board surface. The printed circuit board, the adhesive, and the encapsulant are all made from the same type of resin. In the preferred embodiment of the invention, the resin used to make the printed circuit board, the adhesive, and the encapsulant is an organosilicon polymer comprised substantially of alternating polycyclic hydrocarbon residues and cyclic polysiloxane or siloxysilane residues linked through carbon-silicon bonds.