Patents by Inventor Glenn Ratificar

Glenn Ratificar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy
    Patent number: 7199342
    Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: April 3, 2007
    Assignee: Intel Corporation
    Inventors: Glenn Ratificar, Carlos Gonzalez, Lejun Wang
  • Underfill system for die-over-die arrangements
    Publication number: 20050196907
    Abstract: A system may include a first integrated circuit die, no-flow underfill material, and a second integrated circuit die. A first side of the first integrated circuit die may include a first plurality of electrical contacts, and the underfill material may contact the first side of the first integrated circuit die. A first side of the second integrated circuit die may include a second plurality of electrical contacts, and the first side of the second integrated circuit die may also contact the no-flow underfill material.
    Type: Application
    Filed: September 19, 2003
    Publication date: September 8, 2005
    Inventors: Glenn Ratificar, Song-Hua Shi, Edward Ramsay
  • Solder reflow with microwave energy
    Publication number: 20040016752
    Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
    Type: Application
    Filed: July 21, 2003
    Publication date: January 29, 2004
    Inventors: Glenn Ratificar, Carlos Gonzalez, Lejun Wang
  • Solder reflow with microwave energy
    Patent number: 6644536
    Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: November 11, 2003
    Assignee: Intel Corporation
    Inventors: Glenn Ratificar, Carlos Gonzalez, Lejun Wang
  • Solder reflow with microwave energy
    Publication number: 20030121958
    Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 3, 2003
    Inventors: Glenn Ratificar, Carlos Gonzalez, Lejun Wang