Abstract: Small amounts, typically from about 0.001 to about 0.05 percent by weight, of certain aliphatic and cycloaliphatic mono-, di- and triamines have been shown to retard the heat-induced discoloration to materials prepared by curing unfilled organosiloxane compositions comprising a specified class of vinyl-substituted polyorganosiloxanes, an organohydrogensiloxane and a platinum-containing hydrosilation catalyst. Preferred amines will also function as platinum catalyst inhibitors, and impart long term storage stability to these curable organosiloxane compositions when packaged in a single container.

Abstract: The substantial and upredictable increases in viscosity and cure time observed during storage of curable organosiloxane compositions obtained by blending large quantities of the ingredients disclosed in U.S. Pat. No. 4,584,631 are reduced by blending to homogeniety a mixture comprising at least one member from the classes of organohydrogensiloxanes, platinum catalysts and platinum catalyst inhibitors disclosed in this patent and allowing the resultant mixture to age from 14 days to about 4 months before being combined with a vinyl-containing polymer to form one of said curable compositions.

Abstract: Compositions containing at least one liquid polydiorganosiloxane having an average of two ethylenically unsaturated hydrocarbon radicals per molecule, an organohydrogensiloxane curing agent, a platinum catalyst and a thermally conductive filler consisting, at least in part, of zinc and magnesium oxides are curable to yield elastomers. The high abrasion resistance, low durometer hardness and high heat conductivity of the elastomers make them particularly useful as coatings for the fuser rolls of electrostatic copiers.

Abstract: A specified group of monoalkylamines and alkylenediamines wherein the alkyl or alkylene group contains from two to four carbon atoms imparts long term storage stability at temperatures of up to 40.degree. C. to one part polyorganosiloxane compositions curable by a platinum catalyzed hydrosilation reaction. The inhibitors do not interfere with the ability of these compositions to cure rapidly at temperatures of 135.degree. C. to form gels that are useful encapsulating materials for delicate devices, including electronic circuits.