Patents by Inventor Gnanalingam Arjavalingam

Gnanalingam Arjavalingam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5534094
    Abstract: A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: July 9, 1996
    Assignee: IBM Corporation
    Inventors: Gnanalingam Arjavalingam, Alina Deutsch, Fuad E. Doany, Bruce K. Furman, Donald J. Hunt, Chandrasekhar Narayan, Modest M. Oprysko, Sampath Purushothaman, Vincent Ranieri, Stephen Renick, Jane M. Shaw, Janusz S. Wilczynski, David F. Witman
  • Patent number: 5502392
    Abstract: A method for completely characterizing coupled transmission lines by short-pulse propagation is described. The complex frequency-dependent propagation matrix, impedance matrix and admittance matrix for a set of n parallel transmission lines can be determined by comparing the properties of two sets of coupled transmission lines of different length. Each transmission line set has two conductors of unequal length and ground conductors to form a coupled transmission line system. Each transmission line set can have uncoupled ends. An input pulse is provided at at least one node of each transmission line set. The complex frequency dependent propagation matrix of each transmission line set is determined by a comparison of the output pulses at the remaining nodes of each transmission line set which involves ratioing to cancel out the effect of the pad-to-probe discontinuity and the uncoupled ends which make it unnecessary to do any embedding.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: March 26, 1996
    Assignee: International Business Machines Corporation
    Inventors: Gnanalingam Arjavalingam, Alina Deutsch, Gerard V. Kopcsay, James K. Tam
  • Patent number: 5258236
    Abstract: A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
    Type: Grant
    Filed: May 3, 1991
    Date of Patent: November 2, 1993
    Assignee: IBM Corporation
    Inventors: Gnanalingam Arjavalingam, Alina Deutsch, Fuad E. Doany, Bruce K. Furman, Donald J. Hunt, Chandrasekhar Narayan, Modest M. Oprysko, Sampath Purushothaman, Vincent Ranieri, Stephen Renick, Jane M. Shaw, Janusz S. Wilczynski, David F. Witman