Patents by Inventor Gon Jae LEE

Gon Jae LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10347451
    Abstract: A printed circuit board (PCB) assembly according to one embodiment of the present disclosure includes a first pad; a second pad disposed to be spaced apart from the first pad; and a thermal fuse provided with a first terminal and a second terminal which are each coupled to the first pad and the second pad by soldering. Here, a contact area between the first pad and the first terminal is smaller than that between the second pad and the second terminal.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: July 9, 2019
    Assignee: MANDO CORPORATION
    Inventors: Moon Jung Park, Gon Jae Lee
  • Patent number: 10217594
    Abstract: The present invention relates to a bridge assembly. The bridge assembly according to an exemplary embodiment of the present invention includes: a bridge configured to include a first leg fixed to an upper surface of a printed circuit board, a second leg fixed to the printed circuit board to be spaced apart from the first leg, and an elastic part connecting between the first leg and the second leg and applying an elastic force to any one of the first and second legs; and a cover configured to be positioned at an upper side of the bridge to receive the elastic part.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: February 26, 2019
    Assignee: MANDO CORPORATION
    Inventors: Gon Jae Lee, Moon Jung Park
  • Publication number: 20180114657
    Abstract: A printed circuit board (PCB) assembly according to one embodiment of the present disclosure includes a first pad; a second pad disposed to be spaced apart from the first pad; and a thermal fuse provided with a first terminal and a second terminal which are each coupled to the first pad and the second pad by soldering. Here, a contact area between the first pad and the first terminal is smaller than that between the second pad and the second terminal.
    Type: Application
    Filed: October 26, 2017
    Publication date: April 26, 2018
    Inventors: MOON JUNG PARK, GON JAE LEE
  • Patent number: 9791338
    Abstract: Disclosed is to a pressure sensor including: a metal diaphragm configured to have a pressure sensing part disposed thereover; a first support configured to be coupled with the metal diaphragm; a first printed circuit board configured to be disposed over the pressure sensing part while being supported to the first support and electrically connected to the pressure sensing part; a connector configured to have a lower portion press-fitted with the first printed circuit board; a second printed circuit board configured to be electrically connected to the first printed circuit board through the connector while being press-fitted with an upper portion of the connector and supported by the connector; a second support configured to be disposed over the second printed circuit board; and a spring electrode configured to have an upper end protruding upward of the second support and have a lower end connected to the second printed circuit board.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: October 17, 2017
    Assignee: MANDO CORPORATION
    Inventor: Gon Jae Lee
  • Publication number: 20160379791
    Abstract: The present invention relates to a bridge assembly. The bridge assembly according to an exemplary embodiment of the present invention includes: a bridge configured to include a first leg fixed to an upper surface of a printed circuit board, a second leg fixed to the printed circuit board to be spaced apart from the first leg, and an elastic part connecting between the first leg and the second leg and applying an elastic force to any one of the first and second legs; and a cover configured to be positioned at an upper side of the bridge to receive the elastic part.
    Type: Application
    Filed: June 20, 2016
    Publication date: December 29, 2016
    Inventors: Gon Jae LEE, Moon Jung PARK
  • Publication number: 20160123827
    Abstract: Disclosed is to a pressure sensor including: a metal diaphragm configured to have a pressure sensing part disposed thereover; a first support configured to be coupled with the metal diaphragm; a first printed circuit board configured to be disposed over the pressure sensing part while being supported to the first support and electrically connected to the pressure sensing part; a connector configured to have a lower portion press-fitted with the first printed circuit board; a second printed circuit board configured to be electrically connected to the first printed circuit board through the connector while being press-fitted with an upper portion of the connector and supported by the connector; a second support configured to be disposed over the second printed circuit board; and a spring electrode configured to have an upper end protruding upward of the second support and have a lower end connected to the second printed circuit board.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 5, 2016
    Inventor: Gon Jae LEE
  • Patent number: 9228862
    Abstract: Provided is an ultrasonic transducer including: a housing including a bottom surface and side members, the side members facing each other and extending upwardly with a space part therebetween, the housing having an opened upper part; a piezoelectric resonator disposed at an upper portion of the bottom surface; a housing auxiliary member disposed at upper portions of the side members and inserted into the space part; and a signal connection pin part disposed at an upper portion of the housing auxiliary member. In particular, the housing auxiliary member is formed of material having a lower density than the housing, thereby improving isotropic radiation characteristics.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: January 5, 2016
    Assignee: MANDO CORPORATION
    Inventor: Gon Jae Lee
  • Publication number: 20140060180
    Abstract: Provided is an ultrasonic transducer including: a housing including a bottom surface and side members, the side members facing each other and extending upwardly with a space part therebetween, the housing having an opened upper part; a piezoelectric resonator disposed at an upper portion of the bottom surface; a housing auxiliary member disposed at upper portions of the side members and inserted into the space part; and a signal connection pin part disposed at an upper portion of the housing auxiliary member. In particular, the housing auxiliary member is formed of material having a lower density than the housing, thereby improving isotropic radiation characteristics.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 6, 2014
    Applicant: MANDO CORPORATION
    Inventor: Gon Jae LEE