Patents by Inventor Gong-Kai Lin

Gong-Kai Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240061455
    Abstract: A voltage tracking circuit is provided. The voltage tracking circuit includes first and second P-type transistors and a control circuit. The drain of the first P-type transistor is coupled to a first voltage terminal. The gate and the drain of the second P-type transistor are respectively coupled to the first voltage terminal and a second voltage terminal. The control circuit is coupled to the first and second voltage terminals and generates a control voltage according to the first voltage and the second voltage. The sources of the first and second P-type transistors are coupled to an output terminal of the voltage tracking circuit, and the output voltage is generated at the output terminal. In response to the second voltage being higher than the first voltage, the control circuit generates the control signal to turn off the first P-type transistor.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 22, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shao-Chang HUANG, Yeh-Ning JOU, Ching-Ho LI, Kai-Chieh HSU, Chun-Chih CHEN, Chien-Wei WANG, Gong-Kai LIN, Li-Fan CHEN
  • Patent number: 11574997
    Abstract: A semiconductor structure including a substrate, a first well, a second well, a first doped region, a second doped region, a gate electrode, an insulating layer, a field plate, and a tunable circuit is provided. The first and second wells are formed on the substrate. The first doped region is formed in the first well. The second doped region is formed in the second well. The gate electrode is disposed over the substrate. The gate electrode, the first doped region, and the second doped region constitute a transistor. The insulating layer is disposed on the substrate and overlaps the gate electrode. The field plate overlaps the insulating layer and the gate electrode. The tunable circuit provides either a first short-circuit path between the field plate and the gate electrode, or a second short-circuit path between the field plate and the first doped region.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 7, 2023
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Shao-Chang Huang, Li-Fan Chen, Ching-Ho Li, Gong-Kai Lin, Chieh-Yao Chuang
  • Publication number: 20230034420
    Abstract: A semiconductor structure including a substrate, a first well, a second well, a first doped region, a second doped region, a gate electrode, an insulating layer, a field plate, and a tunable circuit is provided. The first and second wells are formed on the substrate. The first doped region is formed in the first well. The second doped region is formed in the second well. The gate electrode is disposed over the substrate. The gate electrode, the first doped region, and the second doped region constitute a transistor. The insulating layer is disposed on the substrate and overlaps the gate electrode. The field plate overlaps the insulating layer and the gate electrode. The tunable circuit provides either a first short-circuit path between the field plate and the gate electrode, or a second short-circuit path between the field plate and the first doped region.
    Type: Application
    Filed: August 2, 2021
    Publication date: February 2, 2023
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shao-Chang HUANG, Li-Fan CHEN, Ching-Ho LI, Gong-Kai LIN, Chieh-Yao CHUANG
  • Patent number: 11164979
    Abstract: A semiconductor device includes a semiconductor substrate, a Schottky layer, a plurality of first doped regions, a plurality of second doped regions, a first conductive layer and a second conductive layer. The semiconductor substrate includes a first conductive type, and the Schottky layer is disposed on the semiconductor substrate. The first doped regions and the second doped regions include a second conductive type, and which are disposed within the semiconductor substrate. The first doped regions are in parallel and extended along a first direction, and the second doped regions are in parallel and extended along a second direction to cross the first doped regions, thereby to define a plurality of grid areas. The first conductive layer is disposed on the Schottky layer, and the second conductive layer is disposed under the semiconductor substrate.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: November 2, 2021
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shao-Chang Huang, Kai-Chieh Hsu, Chun-Chih Chen, Li-Fan Chen, Ching-Ho Li, Ting-You Lin, Gong-Kai Lin, Yeh-Ning Jou, Chien-Hsien Song, Hsiao-Ying Yang, Chien-Chi Hsu, Fu-Chun Tseng