Patents by Inventor Gongxian Jia

Gongxian Jia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11748294
    Abstract: A retimer application system is provided, which includes a primary chip, a retimer, and a secondary chip. After first link training is completed, the retimer is configured to store, in a first storage area, an equalization parameter corresponding to each rate during the first link training, and data stored in the first storage area is not lost when the retimer performs a reset operation. The retimer is further configured to: receive a reset indication, and perform the reset operation according to the reset indication. The primary chip and the secondary chip are configured to perform second link training triggered by the reset indication. During the second link training, the retimer is further configured to: invoke the equalization parameter, and transparently transmit a training sequence in the second link training to the primary chip or the secondary chip based on the equalization parameter.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: September 5, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongyao Li, Fei Luo, Jiankang Li, Jie Wan, Gongxian Jia
  • Publication number: 20210263879
    Abstract: A retimer application system is provided, which includes a primary chip, a retimer, and a secondary chip. After first link training is completed, the retimer is configured to store, in a first storage area, an equalization parameter corresponding to each rate during the first link training, and data stored in the first storage area is not lost when the retimer performs a reset operation. The retimer is further configured to: receive a reset indication, and perform the reset operation according to the reset indication. The primary chip and the secondary chip are configured to perform second link training triggered by the reset indication. During the second link training, the retimer is further configured to: invoke the equalization parameter, and transparently transmit a training sequence in the second link training to the primary chip or the secondary chip based on the equalization parameter.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongyao LI, Fei LUO, Jiankang LI, Jie WAN, Gongxian JIA
  • Patent number: 9154230
    Abstract: The present invention provides an optical signal control method, an optical signal control system and an optical backplane system, which belongs to the field of optical communications technologies. The method includes: detecting whether a circuit board is pulled out from an optical backplane; if the circuit board is pulled out, querying a transmitting port of another circuit board connected to a slot where the pulled out circuit board is located, transmitting a first control instruction to the transmitting port, and notifying of closing the transmitting port or adjusting output power of the transmitting port to make it below a preset threshold. The optical signal control system includes: a detection module and a control module. The optical backplane system includes the optical signal control system.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: October 6, 2015
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Gongxian Jia, Weixia Liu, Baoqi Wang
  • Publication number: 20120213469
    Abstract: Embodiments of the present invention provide an optical backplane interconnection system and a communication device. The optical backplane interconnection system includes a backplane, a front board, a rear board and a connector. The front board and the rear board locate on two sides of the backplane and are orthogonal to each other. The front board and the rear board are both disposed with an optical waveguide path which is interconnected through a connector connected to the backplane to form an optical path, so that optical signals can be transmitted through the optical path.
    Type: Application
    Filed: May 2, 2012
    Publication date: August 23, 2012
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Gongxian JIA, Weixia LIU, Zewen WANG
  • Patent number: 8018733
    Abstract: A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: September 13, 2011
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Gongxian Jia
  • Publication number: 20110080719
    Abstract: A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention.
    Type: Application
    Filed: December 10, 2010
    Publication date: April 7, 2011
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Gongxian JIA
  • Patent number: 7878842
    Abstract: A busbar device includes a conductive body. The conductive body is provided with a number of mounting holes corresponding to the mounting holes of a mount device for mounting the busbar device. The conductive body is a flexible conductive body, and the distance between every two adjacent mounting holes in the conductive body is larger than or equal to the distance between two corresponding adjacent mounting holes in the mount device.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: February 1, 2011
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Gongxian Jia, Guodong Zhang, Chunxing Huang, Lun Wang
  • Publication number: 20100046182
    Abstract: A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention.
    Type: Application
    Filed: October 28, 2009
    Publication date: February 25, 2010
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Gongxian Jia
  • Publication number: 20090153213
    Abstract: The present invention discloses a system and method for reducing delay difference of differential transmission, a certain delay difference between waveforms of the P signal and N signal is generated through controlling delay adjustment to P signal or N signal of the differential signals and controlling delay adjustment value simultaneously, to compensate for the delay difference of differential transmission due to the channels. Therefore, the present invention can reduce the delay difference of differential transmission due to property discrepancy of board materials and delay inconsistency among pins of the connectors, and at same time simplify the scheme design.
    Type: Application
    Filed: February 20, 2009
    Publication date: June 18, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Gongxian JIA, Lun WANG, Chunxing HUANG
  • Patent number: 7538594
    Abstract: The present invention discloses a system and method for reducing delay difference of differential transmission, a certain delay difference between waveforms of the P signal and N signal is generated through controlling delay adjustment to P signal or N signal of the differential signals and controlling delay adjustment value simultaneously, to compensate for the delay difference of differential transmission due to the channels. Therefore, the present invention can reduce the delay difference of differential transmission due to property discrepancy of board materials and delay inconsistency among pins of the connectors, and at same time simplify the scheme design.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: May 26, 2009
    Assignee: Huawei Technologies Co., Ltd
    Inventors: Gongxian Jia, Lun Wang, Chunxing Huang
  • Publication number: 20090111303
    Abstract: A busbar device includes a conductive body. The conductive body is provided with a number of mounting holes corresponding to the mounting holes of a mount device for mounting the busbar device. The conductive body is a flexible conductive body, and the distance between every two adjacent mounting holes in the conductive body is larger than or equal to the distance between two corresponding adjacent mounting holes in the mount device.
    Type: Application
    Filed: December 18, 2008
    Publication date: April 30, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Gongxian JIA, Guodong ZHANG, Chunxing HUANG, Lun WANG
  • Publication number: 20070121734
    Abstract: The present invention discloses a system and method for reducing delay difference of differential transmission, a certain delay difference between waveforms of the P signal and N signal is generated through controlling delay adjustment to P signal or N signal of the differential signals and controlling delay adjustment value simultaneously, to compensate for the delay difference of differential transmission due to the channels. Therefore, the present invention can reduce the delay difference of differential transmission due to property discrepancy of board materials and delay inconsistency among pins of the connectors, and at same time simplify the scheme design.
    Type: Application
    Filed: September 12, 2006
    Publication date: May 31, 2007
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Gongxian Jia, Lun Wang, Chunxing Huang