Abstract: Apparatus is for additive layer manufacturing of an article from a material which can be rendered solid locally by application of a focused beam of laser radiation at a planar focal plane. The apparatus includes at least two laser beams, respective scanners for each laser beam for scanning the respective laser beams over a planar field, and a support movable stepwise to allow successive manufacturing layer cycles and for supporting material within the field. The entire planar field is common to each scanner and at least one scanner is tilted with respect to the planar field, and the at least one scanner is provided with a lens arranged to generate a focal plane tilted with respect to that scanner.

Abstract: Apparatus is for additive layer manufacturing of an article from a material which can be rendered solid locally by application of a focused beam of laser radiation at a planar focal plane. The apparatus includes at least two laser beams, respective scanners for each laser beam for scanning the respective laser beams over a planar field, and a support movable stepwise to allow successive manufacturing layer cycles and for supporting material within the field. The entire planar field is common to each scanner and at least one scanner is tilted with respect to the planar field, and the at least one scanner is provided with a lens arranged to generate a focal plane tilted with respect to that scanner.

Abstract: A microfluidic structure includes a first layer (1) containing an active fluidic device (4); a second layer (3) containing an interconnect channel (6) for connecting the device (4) to a fluid source and/or outlet and/or another device and an intermediate layer (2) for defining at least one via (5) defining a fluid passage way between the device (4) and the interconnect channel (6) wherein the flow paths through the device (4) and the interconnect channel (6) are generally parallel.

Abstract: This invention relates to magnetic assemblies and, in particular, to assemblies which are useful for inducing magnetic fields within vacuum chambers. Thus a magnetic assembly, generally indicated at 10, includes the rectangular magnetically soft core 11 carrying windings 12, which together form the main planar electromagnet, generally indicated at 13, and immediately adjacent the edges of the magnet 13 are placed auxiliary coils 14. Coils 14 are each formed from windings 15 wound around oblate cores 16 and it would be noted that they project upwardly above the upper surface of the planar magnet 13. Pole pieces 17 are attached to the ends of the planar magnet 13 and these two project above the upper surface of the planar magnet 13. The assembly is completed by mounting brackets 18.

Abstract: In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. Gas is then supplied from a suitable pressure source via a pipe (17) into void (10), thereby to subject the workpiece to elevated pressure. Heating means may be provided to permit the workpiece to be subject to elevated temperature.

Abstract: In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. Gas is then supplied from a suitable pressure source via a pipe (17) into void (10), thereby to subject the workpiece to elevated pressure. Heating means may be provided to permit the workpiece to be subject to elevated temperature.