Patents by Inventor Govind Dayal Singh

Govind Dayal Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9627840
    Abstract: Techniques described herein are generally related to metamaterial structures for Q-switching in laser systems. The various described techniques may be applied to methods, systems, devices or combinations thereof. Some described metamaterial structures may include a substrate and a first conductive layer disposed on a first surface of the substrate. A dielectric layer may be disposed on a first surface of the first conductive layer and a second conductive layer having a substantially symmetric geometric shape may be disposed on a first surface of the dielectric layer. The second conductive layer may cover a portion of the first surface of the dielectric layer.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: April 18, 2017
    Assignee: INDIAN INSTITUTE OF TECHNOLOGY KANPUR
    Inventors: Ramakrishna Subramaniam Anantha, Govind Dayal Singh
  • Publication number: 20150367452
    Abstract: A method of forming a shadow mask is provided. The method includes annealing at least one polymeric sheet to form at least one annealed polymeric sheet. The method also includes transferring a pattern from a primary mask to the annealed polymeric sheet using laser micromachining to form the shadow mask.
    Type: Application
    Filed: June 11, 2015
    Publication date: December 24, 2015
    Inventors: Govind Dayal Singh, Ramakrishna Subramaniam Anantha
  • Publication number: 20150355538
    Abstract: An environmentally benign method for producing binary microfabrication masks is disclosed. An optical target may be provided that includes a water-soluble polymer material in contact with an ultraviolet radiation transmittable substrate. A laser may be focused on a primary mask to produce a mask image, the mask image thereafter being reduced by demagnification optics to provide a reduced image. The optical target may be exposed to the reduced image to create features of reduced size from the primary mask. The water-soluble polymer exposed to the ultraviolet radiation may be ablated from the optical target. The optical target may be subsequently metalized using a metal vapor to coat the remaining polymer material and exposed substrate. The metalized optical target may be contacted with an aqueous fluid to remove the metalized polymer material leaving the binary mask.
    Type: Application
    Filed: December 11, 2013
    Publication date: December 10, 2015
    Applicant: Indian Institute of Technology Kanpur
    Inventors: Govind Dayal SINGH, Ramakrishna SUBRAMANIAM ANANTHA, Janakarajan RAMKUMAR
  • Publication number: 20150301444
    Abstract: A system and method for producing binary dry process laser microfabrication masks is disclosed. A laser is focused on a first mask to produce a mask image, the mask image thereafter being reduced by demagnification optics to provide a reduced image. A target is exposed to the reduced image to create features of reduced size from the original mask. The target may be used to form a binary mask capable of withstanding laser radiation power necessary for direct target micromachining. A binary mask may be used to create other binary masks in an iterative process to provide binary masks with successively smaller features based on the image reduction due to the demagnification optics.
    Type: Application
    Filed: June 17, 2013
    Publication date: October 22, 2015
    Inventors: Govind Dayal SINGH, Subramaniam Anantha RAMAKRISHNA, Janakarajan RAMKUMAR
  • Publication number: 20140355639
    Abstract: Techniques described herein are generally related to metamaterial structures for Q-switching in laser systems. The various described techniques may be applied to methods, systems, devices or combinations thereof. Sonic described metamaterial structures may include a substrate and a first conductive layer disposed on a first surface of the substrate. A dielectric layer may be disposed on a first surface of the first conductive layer and a second conductive layer having a substantially symmetric geometric shape may be disposed on a first surface of the dielectric layer. The second conductive layer may cover a portion of the first surface of the dielectric layer.
    Type: Application
    Filed: April 17, 2013
    Publication date: December 4, 2014
    Inventors: Ramakrishna Subramaniam Anantha, Govind Dayal Singh