Patents by Inventor Govind Thattaisundaram

Govind Thattaisundaram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Data perturbation for wafer inspection or metrology setup using a model of a difference
    Patent number: 9360863
    Abstract: Various embodiments for determining parameters for wafer inspection and/or metrology are provided.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: June 7, 2016
    Assignee: KLA-Tencor Corp.
    Inventors: Govind Thattaisundaram, Mohan Mahadevan, Ajay Gupta, Chien-Huei Adam Chen, Ashok Kulkarni, Jason Kirkwood, Kenong Wu, Songnian Rong
  • Automated inspection scenario generation
    Patent number: 9053390
    Abstract: Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: June 9, 2015
    Assignee: KLA-Tencor Corporation
    Inventors: Mohan Mahadevan, Govind Thattaisundaram, Ajay Gupta, Chien-Huei (Adam) Chen, Jason Kirkwood, Ashok Kulkarni, Songnian Rong, Ernesto Escorcia, Eugene Shifrin
  • Automated Inspection Scenario Generation
    Publication number: 20140050389
    Abstract: Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.
    Type: Application
    Filed: August 14, 2012
    Publication date: February 20, 2014
    Applicant: KLA-Tencor Corporation
    Inventors: Mohan Mahadevan, Govind Thattaisundaram, Ajay Gupta, Chien-Huei (Adam) Chen, Jason Kirkwood, Ashok Kulkarni, Songnian Rong, Ernesto Escorcia, Eugene Shifrin
  • Data Perturbation for Wafer Inspection or Metrology Setup
    Publication number: 20120116733
    Abstract: Various embodiments for determining parameters for wafer inspection and/or metrology are provided.
    Type: Application
    Filed: June 9, 2011
    Publication date: May 10, 2012
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Govind Thattaisundaram, Mohan Mahadevan, Ajay Gupta, Chien-Huei Adam Chen, Ashok Kulkarni, Jason Kirkwood, Kenong Wu, Songnian Rong