Abstract: The disclosure relates to an optical transceiver and a manufacturing method thereof. The optical transceiver includes a substrate, a thermal-conductive substrate, a first metal wiring structure, a light-transceiving element and an optical fiber array. The substrate has an opening, and the thermal-conductive substrate is embedded within the opening. The first metal wiring structure is integrally formed on the substrate and the thermal-conductive substrate through an electroplating or a wire-printing process. The light-transceiving element is disposed on the thermal-conductive substrate and is electrically connected to the first metal wiring structure. The optical fiber array is arranged on the thermal-conductive substrate for communication with the light-transceiving element.

Abstract: The disclosure relates to an optical transceiver and a manufacturing method thereof. The optical transceiver includes a substrate, a thermal-conductive substrate, a first metal wiring structure, a light-transceiving element and an optical fiber array. The substrate has an opening, and the thermal-conductive substrate is embedded within the opening. The first metal wiring structure is integrally formed on the substrate and the thermal-conductive substrate through an electroplating or a wire-printing process. The light-transceiving element is disposed on the thermal-conductive substrate and is electrically connected to the first metal wiring structure. The optical fiber array is arranged on the thermal-conductive substrate for communication with the light-transceiving element.

Abstract: A light detection and ranging (LiDAR) system is provided. The light detection and ranging system includes a first driver, a first light emitting element, and a first detector. The first driver is configured to drive the first light emitting element to emit light. The first detector is configured to detect power of the light.

Abstract: A light emitting device for lidar includes a transistor, a laser light source, and an energy-storage capacitor. The transistor is embedded inside a substrate. The laser light source is disposed on the substrate and electrically connected to the transistor. The energy-storage capacitor is disposed on the substrate and electrically connected to the laser light source. The transistor is selectively turned on in response to a gate controlling signal so as to discharge the energy-storage capacitor, such that the laser light source emits a light pulse. The transistor is disposed opposite to the laser light source.

Abstract: A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant.

Abstract: An optical connector is disclosed. The optical connector has a casing, a circuit structure, a lens structure and an optical transceiver element. The circuit structure is disposed inside the casing and configured for transmitting an electrical signal. The lens structure is directly fixed on the casing and coupled to a fiber adapter. The optical transceiver element is disposed on the circuit structure, and an optical signal is transmitted between the optical transceiver element and the fiber adapter through the lens structure.

Abstract: A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant.

Abstract: A method for defining plural windows with different etching depths simultaneously is disclosed. The method includes steps of (a) forming a photoresist on a substrate having a multiple film structure thereon, (b) exposing a first region of the photoresist to a first exposure dose and a second region of the photoresist to a second exposure dose, (c) obtaining different remaining thickenesses of the photoresist on the first region and the second region by a development, and (d) etching the first region and the second region of the photoresist for forming the plural windows with different etching depths of the multiple film structure.

Abstract: In a novel dot inversion mode liquid crystal display, the period of time required to write a pixel electrode is shortened. The liquid crystal display consists of a plurality of pixel cells arranged in a form of matrix. Each of the pixel cells comprises: a pixel electrode for controlling the motion of liquid crystal molecules, a pre-writing transistor, activated by a first scan line, for in advance writing the data signal on a first data line into the pixel electrode, and a main transistor, activated by a second scan line, for writing the data signal in a second data line into the pixel electrode. According to the present invention, the pixel electrode in the liquid crystal display undergoes two separate operations of writing potential voltages with the same polarity per frame of time. Therefore, it is easy to completely write the data signal into the pixel electrode, even when the liquid crystal display becomes higher in the scanning frequency or larger in the resolution degree of the panel.

Abstract: A method for defining plural windows with different etching depths simultaneously is disclosed. The method includes steps of (a) forming a photoresist on a substrate having a multiple film structure thereon, (b) exposing a first region of the photoresist to a first exposure dose and a second region of the photoresist to a second exposure dose, (c) obtaining different remaining thickenesses of the photoresist on the first region and the second region by a development, and (d) etching the first region and the second region of the photoresist for forming the plural windows with different etching depths of the multiple film structure.