Patents by Inventor Grace Hsiu-Ling Chen
Grace Hsiu-Ling Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9645093Abstract: An inspection system with selectable apodization includes a selectably configurable apodization device disposed along an optical pathway of an optical system. The apodization device includes one or more apodization elements operatively coupled to one or more actuation stages. The one or more actuation stages are configured to selectably actuate the one or more apodization elements along one or more directions. The inspection system includes a control system communicatively coupled to the one or more actuation stages. The control system is configured to selectably control an actuation state of at the one or more apodization elements so as to apply a selected apodization profile formed with the one or more apodization elements.Type: GrantFiled: November 2, 2015Date of Patent: May 9, 2017Assignee: KLA-Tencor CorporationInventors: Jamie M. Sullivan, Gary Janik, Steve Cui, Rex Runyon, Dieter Wilk, Steve Short, Mikhail Haurylau, Qiang Q. Zhang, Grace Hsiu-Ling Chen, Robert M. Danen, Suwipin Martono, Shobhit Verma, Wenjian Cai, Meier Brender
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Publication number: 20170091925Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.Type: ApplicationFiled: December 12, 2016Publication date: March 30, 2017Inventors: Kenong Wu, Lisheng Gao, Grace Hsiu-Ling Chen, David W. Shortt
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Patent number: 9552636Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.Type: GrantFiled: July 28, 2015Date of Patent: January 24, 2017Assignee: KLA-Tencor Corp.Inventors: Kenong Wu, Lisheng Gao, Grace Hsiu-Ling Chen, David W. Shortt
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Publication number: 20160372304Abstract: A scanning electron microscopy system with improved image beam stability is disclosed. The system includes an electron beam source configured to generate an electron beam and a set of electron-optical elements to direct at least a portion of the electron beam onto a portion of the sample. The system includes an emittance analyzer assembly. The system includes a splitter element configured to direct at least a portion secondary electrons and/or backscattered electrons emitted by a surface of the sample to the emittance analyzer assembly. The emittance analyzer assembly is configured to image at least one of the secondary electrons and/or the backscattered electrons.Type: ApplicationFiled: March 24, 2016Publication date: December 22, 2016Inventors: Doug K. Masnaghetti, Gabor Toth, David Trease, Rohit Bothra, Grace Hsiu-Ling Chen, Rainer Knippelmeyer
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Patent number: 9442077Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.Type: GrantFiled: August 25, 2014Date of Patent: September 13, 2016Assignee: KLA-Tencor Corp.Inventors: Junqing Huang, Huan Jin, Grace Hsiu-Ling Chen, Lisheng Gao
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Publication number: 20160054232Abstract: An inspection system with selectable apodization includes a selectably configurable apodization device disposed along an optical pathway of an optical system. The apodization device includes one or more apodization elements operatively coupled to one or more actuation stages. The one or more actuation stages are configured to selectably actuate the one or more apodization elements along one or more directions. The inspection system includes a control system communicatively coupled to the one or more actuation stages. The control system is configured to selectably control an actuation state of at the one or more apodization elements so as to apply a selected apodization profile formed with the one or more apodization elements.Type: ApplicationFiled: November 2, 2015Publication date: February 25, 2016Inventors: Jamie M. Sullivan, Gary Janik, Steve Cui, Rex Runyon, Dieter Wilk, Steve Short, Mikhail Haurylau, Qiang Q. Zhang, Grace Hsiu-Ling Chen, Robert M. Danen, Suwipin Martono, Shobhit Verma, Wenjian Cai, Meier Brender
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Publication number: 20160027165Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.Type: ApplicationFiled: July 28, 2015Publication date: January 28, 2016Inventors: Kenong Wu, Lisheng Gao, Grace Hsiu-Ling Chen, David W. Shortt
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Patent number: 9239295Abstract: Methods and systems for variable polarization wafer inspection are provided. One system includes one or more polarizing components position in one or more paths of light scattered from a wafer and detected by one or more channels of an inspection system. The polarizing component(s) are configured to have detection polarization(s) that are selected from two or more polarization settings for the polarizing component(s).Type: GrantFiled: April 5, 2013Date of Patent: January 19, 2016Assignee: KLA-Tencor Corp.Inventors: Xianzhao Peng, Mark Shi Wang, Grace Hsiu-Ling Chen
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Patent number: 9176069Abstract: An inspection system with selectable apodization includes an illumination source configured to illuminate a surface of a sample, a detector configured to detect at least a portion of light emanating from the surface of the sample, the illumination source and the detector being optically coupled via an optical pathway of an optical system, a selectably configurable apodization device disposed along the optical pathway, wherein the apodization device includes one or more apodization elements operatively coupled to one or more actuation stages configured to selectably actuate the one or more apodization elements along one or more directions, and a control system communicatively coupled to the one or more actuation and configured to selectably control apodization of illumination transmitted along the optical pathway by controlling an actuation state of the one or more apodization elements.Type: GrantFiled: February 6, 2013Date of Patent: November 3, 2015Assignee: KLA-Tencor CorporationInventors: Jamie M. Sullivan, Gary Janik, Steve Cui, Rex Runyon, Dieter Wilk, Steve Short, Mikhail Haurylau, Qiang Q. Zhang, Grace Hsiu-Ling Chen, Robert M. Danen, Suwipin Martono, Shobhit Verma, Wenjian Cai, Meier Brender
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Patent number: 9128064Abstract: The disclosure is directed to a system and method for inspecting a sample by illuminating the sample at a plurality of different angles and independently processing the resulting image streams. Illumination is directed through a plurality of pupil apertures to a plurality of respective field apertures so that the sample is imaged by portions of illumination directed at different angles. The corresponding portions of light reflected, scattered, or radiated from the surface of the sample are independently processed. Information associated with the independently processed portions of illumination is utilized to determine a location of at least one defect of the sample. Independently processing multiple image streams associated with different illumination angles allows for retention of frequency content that would otherwise be lost by averaging information from multiple imaging angles.Type: GrantFiled: April 16, 2013Date of Patent: September 8, 2015Assignee: KLA-Tencor CorporationInventors: Daniel L. Cavan, Grace Hsiu-Ling Chen, Qibiao Chen
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Patent number: 9092846Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.Type: GrantFiled: January 31, 2014Date of Patent: July 28, 2015Assignee: KLA-Tencor Corp.Inventors: Kenong Wu, Lisheng Gao, Grace Hsiu-Ling Chen, David W. Shortt
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Publication number: 20150063677Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.Type: ApplicationFiled: August 25, 2014Publication date: March 5, 2015Inventors: Junqing Huang, Huan Jin, Grace Hsiu-Ling Chen, Lisheng Gao
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Publication number: 20140285657Abstract: The present disclosure is directed to a system for inspecting a sample with multiple wavelengths of illumination simultaneously via parallel imaging paths. The system may include at least a first detector or set of detectors configured to detect illumination reflected, scattered, or radiated along a first imaging path from a selected portion of the sample in response to the first wavelength of illumination and a second detector or set of detectors configured to concurrently detect illumination reflected, scattered, or radiated along a second imaging path from the selected portion of the sample (i.e. the same location on the sample) in response to the second wavelength of illumination, where the second imaging path may at least partially share illumination and/or detection optics with an autofocus channel.Type: ApplicationFiled: March 17, 2014Publication date: September 25, 2014Applicant: KLA-Tencor CorporationInventors: Shiow-Hwei Hwang, Amir Bar, Grace Hsiu-Ling Chen, Daniel L. Cavan
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Publication number: 20140219544Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.Type: ApplicationFiled: January 31, 2014Publication date: August 7, 2014Applicant: KLA-TENCOR CORPORATIONInventors: Kenong Wu, Lisheng Gao, Grace Hsiu-Ling Chen, David W. Shortt
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Publication number: 20130321797Abstract: The disclosure is directed to a system and method for inspecting a sample by illuminating the sample at a plurality of different angles and independently processing the resulting image streams. Illumination is directed through a plurality of pupil apertures to a plurality of respective field apertures so that the sample is imaged by portions of illumination directed at different angles. The corresponding portions of light reflected, scattered, or radiated from the surface of the sample are independently processed. Information associated with the independently processed portions of illumination is utilized to determine a location of at least one defect of the sample. Independently processing multiple image streams associated with different illumination angles allows for retention of frequency content that would otherwise be lost by averaging information from multiple imaging angles.Type: ApplicationFiled: April 16, 2013Publication date: December 5, 2013Applicant: KLA-Tencor CorporationInventors: Daniel L. Cavan, Grace Hsiu-Ling Chen, Qibiao Chen
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Publication number: 20130265577Abstract: Methods and systems for variable polarization wafer inspection are provided. One system includes one or more polarizing components position in one or more paths of light scattered from a wafer and detected by one or more channels of an inspection system. The polarizing component(s) are configured to have detection polarization(s) that are selected from two or more polarization settings for the polarizing component(s).Type: ApplicationFiled: April 5, 2013Publication date: October 10, 2013Applicant: KLA-Tencor CorporationInventors: Xianzhao Peng, Mark Shi Wang, Grace Hsiu-Ling Chen
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Patent number: 7535563Abstract: Systems configured to inspect a specimen are provided. One system includes an illumination subsystem configured to illuminate a two-dimensional field of view on the specimen. The system also includes a collection subsystem configured to collect light scattered from the specimen. In addition, the system includes an array of micro-mirrors configured to reflect a two-dimensional pattern of light diffracted from periodic structures on the specimen out of the optical path of the system without reflecting light across an entire dimension of the array out of the optical path. The system further includes a detection subsystem configured to generate output responsive to light reflected by the array into the optical path. The output can be used to detect defects on the specimen. In one embodiment, the system includes an optical element configured to increase the uniformity of the wavefront of the light reflected by the array into the optical path.Type: GrantFiled: August 15, 2006Date of Patent: May 19, 2009Assignee: KLA-Tencor Technologies CorporationInventors: Grace Hsiu-Ling Chen, Tao-Yi Fu, Jamie Sullivan, Shing Lee, Greg Kirk
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Patent number: 7436503Abstract: Accordingly, the present invention provides methods and apparatus for performing a darkfield inspection on a specimen having periodic structures thereon while substantially reducing or eliminating the long range ringing response, which is typically produced by a traditional Fourier filter mask used to eliminate the diffraction caused by the periodic structures. In one embodiment, an apparatus for inspecting a specimen by detecting optical beams scattered from the specimen. The apparatus includes a beam generator for providing and directing an incident beam towards a specimen and an array subtraction device for substantially subtracting a periodic component from an output beam scattered from the specimen in response to the incident beam. The periodic component corresponds to at least one periodic structure on the specimen, and the subtraction is performed so as to substantially reduce or eliminate a ringing response from the output beam.Type: GrantFiled: December 10, 2004Date of Patent: October 14, 2008Assignee: KLA-Tencor Technologies Corp.Inventors: Grace Hsiu-Ling Chen, Tao-Yi Fu, Evan Mapoles