Abstract: A board to board contactless interconnect system includes a first circuit board for launching at st one microwave signal into a cavity of a first waveguide secured thereto. A second waveguide, secured to a second circuit board, is coupleable to the first waveguide to receive the at least one microwave signal in a cavity of the second waveguide and conduct the at least one microwave signal onto a microwave receiver aligned with the cavity on the second circuit board. The waveguides may be separable and may include additional waveguides. Conductive gaskets with apertures for microwave signals to pass through are positioned between the waveguides and between each circuit board and a waveguide to prevent leakage of microwave energy therebetween. Some embodiments may pass signals through a sealed boundary and maintain integrity of the seal. Such embodiments may have a third waveguide interposed between the first and second waveguides.

Abstract: An electrical connector includes a housing having a cavity. A wafer stack is received in the cavity. The wafer stack includes a plurality of electrical wafers arranged parallel to each other within the cavity. Each wafer includes a first edge and a second edge. Each wafer includes at least one trace between the first and second edges. The electrical connector includes a flex harness including a plurality of flexible printed circuit boards (FPCBs). The FPCBs are electrically connected to corresponding wafers.

Abstract: An electrical connector includes a housing having a cavity. A wafer stack is received in the cavity. The wafer stack includes a plurality of electrical wafers arranged parallel to each other within the cavity. Each wafer includes a first edge and a second edge. Each wafer includes at least one trace between the first and second edges. The electrical connector includes a flex harness including a plurality of flexible printed circuit boards (FPCBs). The FPCBs are electrically connected to corresponding wafers.

Abstract: An electrical connector includes a connector housing having at least one contact cavity and an interchange port. A power contact is held by the connector housing within the contact cavity. The power contact is configured to conduct electrical power. An interchangeable signal module is separably mounted to the connector housing such that at least a portion of the signal module is held within the interchange port of the connector housing. The signal module includes an insulator holding a signal contact that is configured to conduct electrical data signals.

Abstract: An electrical connector includes a connector housing having at least one contact cavity and an interchange port. A power contact is held by the connector housing within the contact cavity. The power contact is configured to conduct electrical power. An interchangeable signal module is separably mounted to the connector housing such that at least a portion of the signal module is held within the interchange port of the connector housing. The signal module includes an insulator holding a signal contact that is configured to conduct electrical data signals.

Abstract: A header connector includes a housing extending along a longitudinal axis between mating and mounting ends. The housing has contact channels open between the mating and mounting ends, and the housing has air pockets provided between selected ones of the contact channels to control an impedance of socket contacts received in the contact channels. Socket contacts are loaded into the contact channels, with each socket contact including a contact body extending along a longitudinal axis between mating and mounting ends. The contact body has a box-shaped socket at the mating end that clergies a reception area configured to receive a mating contact. The box-shaped socket is configured to engage four different sides of the mating contact.

Abstract: An electrical connector includes a dielectric housing that holds a plurality of electrical wafers. Each of the wafers includes a first side, a second side opposite the first side, and a forward mating edge. A plurality of contact pads on the first side are recessed from the forward mating edge, and a perimeter conductive trace is closer than the contact pads to the forward mating edge.