Abstract: This disclosure describes an apparatus and method of an embodiment of an invention that is a ceiling tile microphone that includes: a plurality of microphones positioned at predetermined locations and coupled together as a microphone array used for beamforming; a single ceiling tile with an outer surface on the front side of the ceiling tile where the outer surface is acoustically transparent, the microphone array couples to the back side of the single ceiling tile, the microphone array combines with the ceiling tile as a single unit, the single unit is mountable in a drop ceiling in place of a single ceiling tile included in the drop ceiling, all or part of the single unit is in the drop space of the drop ceiling when the single unit is used in a drop ceiling mounting configuration; where the ceiling tile microphone further includes beamforming, acoustic echo cancellation, and auto mixing.

Abstract: Described herein is a mount assembly for mounting a device to a surface, including: a socket assembly; a mounting element including a unitary mounting ball receivable by the socket assembly to pivotally couple the mounting element to the socket assembly to position the mounting element relative to the socket assembly, where the socket assembly includes a resilient member configured to define a socket to receive and engage the unitary mounting ball, the resilient member configured to permit the unitary mounting ball to be urged into the socket against a resilient bias; and the socket including at least one formation and the unitary mounting ball including at least one complementary formation, the at least one formation and at least one complementary formation configured to interact to inhibit rotational movement about a roll axis of the mounting element relative to the socket assembly.

Abstract: Described herein is a mount assembly for mounting a device to a surface, including: a socket assembly; a mounting element including a mounting ball receivable by the socket assembly to pivotally couple the mounting element to the socket assembly to position the mounting element relative to the socket assembly; where the socket assembly includes: a resilient member configured to define a socket to receive and engage the mounting ball, the resilient member configured to permit the mounting ball to be urged into the socket against a resilient bias; a biasing element to bias the resilient member into the socket; and a retention element to inhibit deflection of an end of the resilient member away from the socket.

Abstract: Described herein is a mount assembly for mounting a device to a surface, including: a socket assembly; a mounting element including a mounting ball receivable by the socket assembly to pivotally couple the mounting element to the socket assembly to position the mounting element relative to the socket assembly; where the socket assembly includes: a resilient member configured to define a socket to receive and engage the mounting ball, the resilient member configured to permit the mounting ball to be urged into the socket against a resilient bias; a biasing element to bias the resilient member into the socket; and a retention element to inhibit deflection of an end of the resilient member away from the socket.

Abstract: Described herein is a mount assembly for mounting a device to a surface, including: a socket assembly; a mounting element including a unitary mounting ball receivable by the socket assembly to pivotally couple the mounting element to the socket assembly to position the mounting element relative to the socket assembly, where the socket assembly includes a resilient member configured to define a socket to receive and engage the unitary mounting ball, the resilient member configured to permit the unitary mounting ball to be urged into the socket against a resilient bias; and the socket including at least one formation and the unitary mounting ball including at least one complementary formation, the at least one formation and at least one complementary formation configured to interact to inhibit rotational movement about a roll axis of the mounting element relative to the socket assembly.

Abstract: Described herein is a mount assembly for mounting a device to a surface, including: a socket assembly; a mounting element including a mounting ball formation receivable by the socket assembly to pivotally couple the mounting element to the socket assembly, where the socket assembly includes a resilient member configured to define a socket to receive and engage the mounting ball formation, the member configured to permit the mounting ball formation to be urged into the socket against a resilient bias; the mount assembly further including a surface interface member configured to provide a frictional interface between the outer surface of the mounting ball formation and an inner wall of the socket defined by the resilient member.