Patents by Inventor Grant Maloney

Grant Maloney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having a multi-layered base
    Patent number: 9559026
    Abstract: A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic case, a conductive base coupled to the semiconductor die at a top surface of the conductive base, where the conductive base includes a first layer having a first coefficient of thermal expansion (CTE), and a second layer having at least one mounting tab and a second CTE. The conductive base is configured to reduce thermal stress in the ceramic case, where the first CTE is equal to or slightly different than a CTE of the ceramic case, the second CTE is greater than the first CTE, and a CTE of the PCB is greater than or equal to the second CTE. The conductive base is configured to electrically couple a power electrode of the semiconductor die to the PCB.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: January 31, 2017
    Assignee: INFINEON TECHNOLOGIES AMERICAS CORP.
    Inventors: Shunhe Xiong, Grant Maloney
  • Semiconductor Package Having a Multi-Layered Base
    Publication number: 20160254203
    Abstract: A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic case, a conductive base coupled to the semiconductor die at a top surface of the conductive base, where the conductive base includes a first layer having a first coefficient of thermal expansion (CTE), and a second layer having at least one mounting tab and a second CTE. The conductive base is configured to reduce thermal stress in the ceramic case, where the first CTE is equal to or slightly different than a CTE of the ceramic case, the second CTE is greater than the first CTE, and a CTE of the PCB is greater than or equal to the second CTE. The conductive base is configured to electrically couple a power electrode of the semiconductor die to the PCB.
    Type: Application
    Filed: November 20, 2015
    Publication date: September 1, 2016
    Inventors: Shunhe Xiong, Grant Maloney