Abstract: An improved wafer transfer and monitoring system is described which utilizes a robotic interface unit. The robotic interface unit includes at least one wafer storage location placed proximate to a wafer stepper unit. A robotic arm attached to the interface unit is moveable in three dimensions to move wafers between the wafer storage location and the wafer stepper unit. The robotic interface unit can be placed between a wafer stepper unit and a coater/developer unit to transfer wafers between each unit and to store and monitor wafers placed upon the units and/or upon the wafer storage location. Accordingly, the robotic interface unit can operate in a stand-alone configuration with the wafer stepper or can be integrated between a wafer stepper and a wafer coater/developer. By using a robotic arm, less contaminates are associated with the exposed and readily cleaned arm.

Abstract: A semiconductor wafer is provided for sensing and recording processing conditions to which the wafer is exposed. The wafer can also write the recorded processing conditions to an external output device connectable to the wafer. The wafer includes a plurality of regions spaced across the wafer, and at least one sensor placed within each region. The sensor can sense a single processing condition such as, e.g., pressure, temperature, fluidic flow rate, or gas composition. If more than one processing condition is to be measured, then more than one sensor can be placed in each region to provide a sensed reading across the entire wafer surface necessary for gradient measurements. The wafer further includes signal acquisition/conditioning circuit which receives analog signals from each of the sensors placed upon the wafer and converts the analog signals to corresponding digital signals. Digital signals can then be stored within and processed by a processor also formed within the wafer.

Abstract: A high precision electrode position controller is provided for use in a semiconductor etching device. The electrode position controller, system, and method of use can accurately and repeatedly position a dry etch electrode within the etch chamber without having to open the chamber and manually move the electrode. Moreover, the actual gap between electrodes can be calibrated each time the etching device is turned on. Frequent calibration of actual electrode position ensures the electrodes are positioned parallel to each other and at an optimal distance therebetween. Accurate positioning of the electrodes provides a more precise etch rate and a more uniform etch across the wafer surface. By repositioning the electrodes and maintaining parallelism, varying types of material can be accurately etched.