Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: The present invention relates to temperature control elements, spindle assemblies, and wafer processing assemblies. According to one embodiment of the present invention, a wafer processing assembly is provided comprising a rotary spindle assembly, at least one liquid source, a controller, a wafer support, and a wafer processing bowl. The rotary spindle assembly comprises a rotary drive motor, a rotary spindle coupled to the rotary drive motor, a heat regulating element arranged about the rotary spindle, and a heat regulating flange secured to the rotary drive motor. The controller is coupled to the liquid source and a temperature sensor coupled to one or both of the heat regulating element and the heat regulating flange and is programmed to be responsive to a temperature signal generated by the temperature sensor.

Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: A method for disposing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: Apparatuses are disclosed for use in dispensing a process liquid onto a surface of a wafer. The apparatus may include a bowl having a bottom and a side defining an interior region. An air ring is disposed in the interior region to define an upper plenum in fluid communication with a lower plenum. The air ring may have at least one flow path therethrough to said lower plenum, preferably in the form of a plurality of holes in a circumferential groove. Also in a preferred embodiment, a top ring is provided to further define the upper plenum. A semiconductor wafer that has a liquid dispensed thereon, may be supported within the bowl to contact portions of the air ring to remove excess liquid migrating to the underside of the wafer. The excess liquid may be drained through the air ring into the lower plenum wherein it is removed by a drain. A solvent dispenser may be provided in the air ring to apply a solvent to the underside of the wafer.

Abstract: Methods are disclosed for processing a semiconductor wafer. The methods may include removing first and second amounts of liquid from the lower surface of the wafer. The subject invention may also comprise methods for removing a liquid from a semiconductor wafer surface that include contacting the semiconductor wafer surface with an annular barrier formed in a ring member and draining the liquid contacting the annular barrier from the ring member. Other methods are disclosed for applying a solvent to a surface coating to remove excess therefrom and draining the solvent and liquid from a wafer support member.

Abstract: Apparatuses and methods are disclosed for use in spin dispensing a process liquid onto a surface of a wafer. The wafer is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. A dispense assembly is positioned to dispense process liquid, such as photoresist, onto the wafer support by the chuck. The apparatus further includes a bowl having a bottom and a side defining an interior region, the bottom containing an opening in which the shaft is movable. An air ring is disposed in the interior region around said chuck to define an upper plenum in fluid communication with a lower plenum. The air ring further includes at least one flow path through the air ring to said lower plenum, preferably in the form of a plurality of holes in a circumferential groove. Also in a preferred embodiment, a top ring is provided having a bottom face and an inner lip having dimensions smaller than the outer rim and larger than the wafer.