Patents by Inventor Gregg A. Hebert

Gregg A. Hebert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for using a support backer board system for siding
    Patent number: 6418610
    Abstract: A method for using a support backer board system and siding. The support backer board system comprises at least a first layer. The first layer is made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof. The board system is thermoformed into a desired shape with the desired shape being generally contour to the selected siding. The siding is attached to the board system so as to provide support thereto. In one process, the siding may be vinyl.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: July 16, 2002
    Assignee: Pactiv Corporation
    Inventors: John W. Lubker, II, Gregg A. Hebert
  • Methods for using a support backer board system for siding
    Publication number: 20010010116
    Abstract: A method for using a support backer board system and siding. The support backer board system comprises at least a first layer. The first layer is made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof. The board system is thermoformed into a desired shape with the desired shape being generally contour to the selected siding. The siding is attached to the board system so as to provide support thereto. In one process, the siding may be vinyl.
    Type: Application
    Filed: March 22, 2001
    Publication date: August 2, 2001
    Inventors: John W. Lubker, Gregg A. Hebert
  • Methods for using a support backer board system for siding
    Patent number: 6263574
    Abstract: A method for using a support backer board system and siding. The support backer board system comprises at least a first layer. The first layer is made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof. The board system is thermoformed into a desired shape with the desired shape being generally contour to the selected siding. The siding is attached to the board system so as to provide support thereto. In one process, the siding may be vinyl.
    Type: Grant
    Filed: March 2, 1999
    Date of Patent: July 24, 2001
    Assignee: Tenneco Packaging Inc.
    Inventors: John W. Lubker, II, Gregg A. Hebert
  • Method of forming perforations in a structure during molding thereof
    Patent number: 5451356
    Abstract: A thermoforming technique for making a shaped article from a web of polystryrene foam sheet or the like, with simultaneous forming and perforation of the article. Serrated cutter and spaced mandrel elements mounted in opposing mold sections provide a perforated pattern in the sheet.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: September 19, 1995
    Assignee: Mobil Oil Corporation
    Inventor: Gregg A. Hebert