Abstract: A printed circuit card thermal conducting device provides a flexible, thermally conducting sheet with a cushioning layer on one side and a thermally conductive and resilient layer on the other side. On top of the thermally conductive and resilient layer is placed a number of thermal contact pieces of rigid material. Each of the contact pieces is defined to have a contour for making intimate contact with one electrical component mounted on the printed circuit card. The device is wedged between two of the printed circuit cards with the cushioning layer laying in contact with a backside surface of one of the cards, while the contact pieces of the same device lay in intimate contact with the components of another of the circuit cards. The cushioning material and the conductive and resilient material maintain good thermal contact between the contact pieces and the electrical components.