Patents by Inventor Gregor Kaschel

Gregor Kaschel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090280278
    Abstract: Multilayer film with a layer A, based on a thermoplastic polymer or on a mixture of a plurality of thermoplastic polymers with melting point TmA and a VICAT softening point TvA, and which has a thickness of at most 40 ?m; and a layer B, which is immediately adjacent to layer A, and is based on a thermoplastic polymer or on a mixture of a plurality of thermoplastic polymers with melting point TmB, a VICAT softening point TvB, and a thickness of at most 50 ?m; where TvB<TvA and TmB<TmA; TvB?115° C.; having at least one at least monoaxially oriented layer and an external sealable layer; and a region D between layer A and layer B that has been printed and/or metallized and/or coated with a semi-metal oxide; the adhesion between layer A and layer B being at least 1.0 N/15 mm.
    Type: Application
    Filed: July 4, 2007
    Publication date: November 12, 2009
    Applicant: WIPAK WALSRODE GMBH & CO. KG
    Inventors: Rainer Brandt, Gregor Kaschel, Esko Saaristo, Timo Toivola
  • Patent number: 6780522
    Abstract: Described is a single or multi-layered film having at least one polyamide layer (I) containing dispersed nanoscale nucleating particles. The smallest components of the dispersed nanoscale nucleating particles in layer (I) have an extension of less than 100 nm in at least one randomly selected direction for each component, based on a weighted average of all components of the dispersed nanoscale nucleating particles. Crystalline structures emanating from the surface of the dispersed nanoscale nucleating particles are formed after the layer (I) is cooled from the molten state at a rate of from 10 to 20° C. per minute. The dispersed nanoscale nucleating particles are present in the polyamide layer (I) in an amount of from 10 ppm to 3000 ppm, based on the total weight of layer (I).
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: August 24, 2004
    Assignee: Wolff Walsrode AG
    Inventors: Holger Eggers, Andreas Gasse, Gregor Kaschel, Rainer Brandt, Bernd Eilers
  • Patent number: 6740422
    Abstract: Described is a flexible, multilayered film comprising, (i) an outer layer composed substantially of polyamide containing nanodispersed filing material (e.g., in an amount of from 0.1 and 3 wt. %), and (ii) at least one additional polyamide layer. The multilayered film of the present invention may be produced by flat film or blown film methods. Also described is a method of using the multilayered film of the present invention as a packaging for foodstuff.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: May 25, 2004
    Assignee: Wolff Walsrode AG
    Inventors: Holger Eggers, Gregor Kaschel
  • Patent number: 6732493
    Abstract: A method for packaging food, which comprises packaging food in an at least eight-layer co-extruded, adhesive free and EVOH-free thermoformable film comprised of polyamide, polyolefin, and/or copolymers based on olefins, wherein the film has a first outer layer comprised of polyamide, a second outer layer comprised of a polyolefin or olefin copolymer and the film does not delaminate at temperatures between 50° C. and 150° C.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: May 11, 2004
    Assignee: Wolff Walsrode AG
    Inventor: Gregor Kaschel
  • Publication number: 20030207060
    Abstract: The present invention relates to a thermoformable, multilayer, co-extruded adhesive-free and EVOH-free film containing polyamide, polyolefins, and/or copolymers based on olefins. This film is particularly suitable for the packaging of products that have been subjected to a heat treatment in thermoformed films. The films are characterised by an outer layer of polyamide and a second outer layer of polyolefins or coploymers based on olefins, wherein the film composite does not delaminate even at temperatures between 50° C. and 150° C.
    Type: Application
    Filed: May 16, 2003
    Publication date: November 6, 2003
    Applicant: Wolff Walsrode AG
    Inventor: Gregor Kaschel
  • Patent number: 6627324
    Abstract: Described is a film having at least a single layer and at least one copolyamide layer (I) containing dispersed nanoscale nucleating particles. Crystalline structures extending from the dispersed particle surfaces are formed after the layer (I) is cooled from a molten state at a cooling rate of from 10° C. to 20° C. per minute. The dispersed nanoscale nucleating particles are present in layer (I) in an amount of from 10 ppm to 2000 ppm, based on the total weight of layer (I). Also described is a method of using the film of the present invention in packaging foodstuffs.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: September 30, 2003
    Assignee: Wolff Walsrode AG
    Inventors: Holger Eggers, Gregor Kaschel, Claudia Müller, Andreas Gasse, Rainer Brandt, Dieter Neubauer, Bernd Eilers
  • Patent number: 6613407
    Abstract: A thermoformable, multilayer, co-extruded adhesive-free and EVOH free film having an outer layer of polyamide and a second outer layer polyolefin, olefin copolymer or a mixture thereof, with inner polyamide and polyolefin or olefin copolymer layers, and layers of coupling polymer.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: September 2, 2003
    Assignee: Wolff Walsrode AG
    Inventor: Gregor Kaschel
  • Patent number: 6582828
    Abstract: A thermoformable, puncture-resistant multi-layered film with surface slip, prepared by coextrusion and built up from polyolefin-based, polyamide-based and adhesion promoting polymer layers and its use for packaging sharp-edged goods, in particular foodstuffs.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: June 24, 2003
    Assignee: Wolff Walsrode AG
    Inventor: Gregor Kaschel
  • Patent number: 6569538
    Abstract: A thermoformable, multi-layered, symmetric, coextruded film having no tendency to roll up, is described. The coextruded film contains layers of polyamide and polyolefin or copolymers based on olefins.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: May 27, 2003
    Assignee: Wolff Walsrode AG
    Inventor: Gregor Kaschel
  • Patent number: 6555242
    Abstract: A longitudinally stretched multilayered film having good barrier properties is described. The film is prepared by a process comprising (a) preparing by coextrusion a laminate structured of, in sequence, a first polyamide layer, an EVOH layer, and a second polyamide layer, and (b) longitudinally stretching the laminate and (c) applying by vacuum vapor deposition to one of the surfaces of the stretched laminate an inorganic layer.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: April 29, 2003
    Assignee: Wolff Walsrode AG
    Inventors: Antoine Cassel, Rainer Brandt, Gregor Kaschel
  • Patent number: 6534171
    Abstract: Described is a heat sealable, multi-layer laminating film composed of at least six layers of thermoplastic polymers. The multi-layer laminating film has an inner layer of ethylene/vinyl alcohol copolymer (EVOH). Also described are packaging materials containing the multi-layer laminating film of the present invention.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: March 18, 2003
    Assignee: Wolff Walsrode AG
    Inventors: Holger Eggers, Gregor Kaschel
  • Publication number: 20010014400
    Abstract: A longitudinally stretched multilayered film having good barrier properties is described. The film is prepared by a process comprising (a) preparing by coextrusion a laminate structured of, in sequence, a first polyamide layer, an EVOH layer, and a second polyamide layer, and (b) longitudinally stretching the laminate and (c) applying by vacuum vapor deposition to one of the surfaces of the stretched laminate an inorganic layer.
    Type: Application
    Filed: January 24, 2001
    Publication date: August 16, 2001
    Inventors: Antoine Cassel, Rainer Brandt, Gregor Kaschel
  • Patent number: 6274246
    Abstract: A multi-layered laminate suitable for production of thermoformed packaging is disclosed. The laminate contains a polyamide-containing layer, a sealing layer and optionally an EVOH-containing layer and is characterized in that it contains water in an amount of 0.5 to 2.5 percent.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: August 14, 2001
    Assignee: Wolff Walsrode Aktiengesellschaft
    Inventors: Holger Eggers, Gregor Kaschel, Andreas Gasse
  • Patent number: 5994445
    Abstract: The present invention relates to a mixture consisting of60 to 98 wt. % of a partially crystalline polyamide polymerised from m-xylylene diamine and adipic acid,2 to 40 wt. % of an aliphatic polyamide containing inorganic particles with a characteristic particle diameter of less than 800 nm,wherein the proportion of organic and/or inorganic particles in the polymer mixture is less than 10 wt. %.
    Type: Grant
    Filed: July 7, 1997
    Date of Patent: November 30, 1999
    Assignee: Wolff Walsrode AG
    Inventors: Gregor Kaschel, Rudi Klein
  • Patent number: 5885707
    Abstract: The present invention relates to a sealable laminated film which contains a copolymer consisting of ethylene and .alpha.-olefine, wherein the MPE copolymer is characterized as follows:polymerised with metallocene catalysts,crystallite melting point less than 110.degree. C., preferably less than 105.degree. C.,melt index MFR from 0.5 to 10 g/10 min,molecular weight distribution M.sub.w /M.sub.n less than 3, preferably less than 2.5.
    Type: Grant
    Filed: September 18, 1996
    Date of Patent: March 23, 1999
    Assignee: Wolff Walsrode AG
    Inventors: Gregor Kaschel, Heiko Tamke