Abstract: An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.

Abstract: The present invention relates to an LED module 10, a circuit board 1, and a method for coating the circuit board 1 that is used in an LED module 10. The circuit board 1 is used particularly for reflecting light emitted by at least one LED chip of the LED module 10. The at least one LED chip 6 is located on a carrier plate 5 in a cut-out 2 of the circuit board 1. To increase the light yield of the LED module 10, the circuit board 1 is sprayed with a highly reflective layer 4. The layer 4 can be an ink provided with reflective particles, for example, which is sprayed on using an ink jet printing method. The LED module can additionally have at least one colour conversion element 7, 8, 9, which is preferably positioned in or above the at least one cut-out 2 of the circuit board 1. Finally; positioning elements 12, 13 can improve the assembly of the LED module 10, particularly the alignment of the circuit board 1 and the carrier plate 5.

Abstract: The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner.

Abstract: The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one LED (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the LED (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the LED (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1).

Abstract: The invention relates to a printed circuit board element (10), comprising at least one flexible printed circuit board part (12) and at least one rigid printed circuit board part (11A, 11C; 34, 35; 37) having a component (17), which is accommodated in a cavity (14) and with a light-emitting or light-receiving part (17) projects over the edge (18) of the cavity (14), wherein the flexible printed circuit board part (12) has a flexible layer (15?) made of an optical, photo-polymerizable material (15), in which an optical fiber (15) is structured in alignment with the light-emitting or light-receiving part (17) of the optoelectronic component (17) by way of radiation.

Abstract: An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.

Abstract: The invention relates to an optical sensor device (1) comprising a substrate (2) on which at least one light source (4), such as an LED, is arranged, from which at least one optical waveguide (7) leads to at least one receiver (5), such as a photodiode, to which an evaluating unit (6) is connected, wherein the optical waveguide (7) is accessible in a sensor region (8) for a change of the evanescent field of the optical waveguide present there; an optical layer (3) made of material that can be photopolymerized is applied to the substrate (2), wherein the optical waveguide (7) is structured by an exposure process in said optical layer, wherein the optical waveguide (7) is led to the surface (9) of the optical layer (3) in the sensor region (8).

Abstract: A printed circuit board element (1) with a substrate (2), with at least one optoelectronic component (3) embedded in a photopolymerizable optical layer material (5), and with at least one optical waveguide (6) optically coupled with the former and structured in the optical material by photon absorption, wherein a prefabricated deflection mirror (4) embedded in the optical material (5) and optically coupled with the optoelectronic component (3) via the optical waveguide (6) is arranged on the substrate (2), optionally together with a support (4?).

Abstract: The invention relates to a printed circuit board element (10) including at least one optoelectronic component (1) which is embedded in an optical, photopolymerizable layer material (13), and at least one optical waveguide (14) optically coupled thereto, which is structured in the optical, photopolymerizable material (13) by photon irradiation, wherein the component (1) comprises a curved deflection mirror (5) on its light transmission surface (3), which curved deflection mirror deflects the light radiation (15), for instance by 90°.

Abstract: The invention relates to a printed circuit board element (10), comprising at least one flexible printed circuit board part (12) and at least one rigid printed circuit board part (11A, 11C; 34, 35; 37) having a component (17), which is accommodated in a cavity (14) and with a light-emitting or light-receiving part (17) projects over the edge (18) of the cavity (14), wherein the flexible printed circuit board part (12) has a flexible layer (15?) made of an optical, photo-polymerizable material (15), in which an optical fiber (15) is structured in alignment with the light-emitting or light-receiving part (17) of the optoelectronic component (17) by way of radiation.

Abstract: A printed circuit board element (1) with a substrate (2), with at least one optoelectronic component (3) embedded in a photopolymerizable optical layer material (5), and with at least one optical waveguide (6) optically coupled with the former and structured in the optical material by photon absorption, wherein a prefabricated deflection mirror (4) embedded in the optical material (5) and optically coupled with the optoelectronic component (3) via the optical waveguide (6) is arranged on the substrate (2), optionally together with a support (4?).

Abstract: The invention relates to a printed circuit board element (10) including at least one optoelectronic component (1) which is embedded in an optical, photopolymerizable layer material (13), and at least one optical waveguide (14) optically coupled thereto, which is structured in the optical, photopolymerizable material (13) by photon irradiation, wherein the component (1) comprises a curved deflection mirror (5) on its light transmission surface (3), which curved deflection mirror deflects the light radiation (15), for instance by 90°.

Abstract: Disclosed is a printed circuit board element comprising an optical waveguide and an embedded optoelectronic element.