Abstract: Embodiments disclosed herein include an interconnect structure. In an embodiment, the interconnect structure is an apparatus that comprises a substrate with a well through a thickness of the substrate. In an embodiment, the substrate comprises a polymer foam. In an embodiment, a liquid metal is in the opening, and the liquid metal comprises voids.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed that improve thermal tests of integrated circuit devices. An example apparatus includes interface circuitry; machine readable instructions; and programmable circuitry to at least one of instantiate or execute the machine readable instructions to determine a condition of a fluid to be dispensed by a pneumatic nozzle, the condition of the fluid including a temperature of the fluid; determine a ratio of a first liquid, a second liquid, and a superheated vapor that combine to result in the condition of the fluid; and cause the first liquid, the second liquid, and the superheated vapor to be provided to the pneumatic nozzle in proportions defined by the ratio.

Abstract: An electronic device carrier structure can include a substrate including a plurality of electrical contacts spaced apart on the substrate, a plurality of electrically conductive balls, each of the electrically conductive balls being on a respective one of the plurality of electrical contacts, solder attaching each of the electrically conductive balls to respective ones of the electrical contacts to form an attachment boundary where the solder ends on a surface of each of the plurality of electrically conductive balls, and a polymer layer extending on the substrate onto the plurality of electrically conductive balls to form a surface of the polymer layer at a contact point on the plurality of electrically conductive balls that is above the attachment boundary and below an apex of each of the plurality of electrically conductive balls.

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a first surface and a second surface opposite from the first surface. In an embodiment, pads are on the first surface of the package substrate, where the pads have a first width. In an embodiment, a layer is on the first surface of the package substrate, where the layer comprises wells through the layer, and where the wells have a second width that is wider than the first width. In an embodiment, a liquid metal is in the wells and in contact with the pads.

Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Abstract: A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

Abstract: An electronic device carrier structure can include a substrate including a plurality of electrical contacts spaced apart on the substrate, a plurality of electrically conductive balls, each of the electrically conductive balls being on a respective one of the plurality of electrical contacts, solder attaching each of the electrically conductive balls to respective ones of the electrical contacts to form an attachment boundary where the solder ends on a surface of each of the plurality of electrically conductive balls, and a polymer layer extending on the substrate onto the plurality of electrically conductive balls to form a surface of the polymer layer at a contact point on the plurality of electrically conductive balls that is above the attachment boundary and below an apex of each of the plurality of electrically conductive balls.

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Abstract: A circuit board assembly includes at least one circuit board having a plurality of conductive layers, the at least one circuit board having a first face and an opposite second face. A first chip socket on the first face is positioned opposite of a second chip socket on the second face. In one example, each chip socket can receive a processor. The first and second chip sockets may be arranged in a mirrored fashion with respect to one another, or an overlapping but non-mirrored fashion. In any such arrangements, as fasteners are tightened to fully seat first and second chips respectively installed in the first and second chip sockets, forces applied to the first chip effectively neutralize or otherwise reduce opposing forces applied to the second chip, thereby reducing circuit board deflection.

Abstract: A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

Abstract: High-speed data transmissions through a CPU socket are facilitated with CPU socket contacts that have a CPU socket contact body that improves bandwidth throughput. The CPU socket contact body is partially suspended from a CPU socket contact and may include a cavity. The CPU socket contact body includes capacitive impedance that substantially cancels an inductive impedance of the CPU socket contact. Canceling the inductive impedance causes the CPU socket contact to operate like an impedance-matched coaxial transmission line, which enables better bandwidth throughput than a non-impedance matched transmission line.

Abstract: A vertically ground isolated package device can include (1) ground shielding attachment structures and shadow voiding for data signal contacts; (2) vertical ground shielding structures and shield fencing of vertical data signal interconnects; and (3) ground shielding for an electro-optical module connector of the package device. These reduce cross talk between data signal contacts, attachment structures and vertical “signal” interconnects of the package device. The ground shielding attachment structures may include patterns of solder bumps and/or surface contacts. The shadow voiding may be surrounding voids in ground planes that are larger than the data signal solder bumps. The vertical ground shielding structures may include patterns of ground shield interconnects between the vertical data signal interconnects: The shield fencing may include patterns of ground plated through holes (PTH) and micro-vias (uVia).

Abstract: Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a package substrate. The electronic device package can also include a processor mounted on the package substrate. Additionally, the electronic device package can include a memory socket mounted on the package substrate and operably coupled to the processor. The memory socket can be operable to removably couple with a memory module and facilitate electrical communication between the processor and the memory module. A memory module can include a plurality of printed circuit boards (PCBs). Each PCB can have a bottom edge and a plurality of contact pads located about the bottom edge. Additionally, the memory module can include a memory device mounted on at least one of the plurality of PCBs and electrically connected to at least one of the pluralities of contact pads to facilitate electrically coupling the memory module with an external electronic component, such as a processor.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.