Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Abstract: A method of implementing vibration suppression at equipment residing at a local site includes the steps of transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further includes the steps of analyzing the sensed vibration response information at the remote site and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transferred from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed.

Abstract: A method of implementing vibration suppression at equipment residing at a local site is provided. The method comprises transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further comprises analyzing the sensed vibration response information at the remote site, and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transmitted from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed.

Abstract: A method of implementing vibration suppression at equipment residing at a local site is provided. The method comprises transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further comprises analyzing the sensed vibration response information at the remote site, and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transmitted from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed.

Abstract: A vibration suppression system is provided. The system comprises an integrated master vibration actuating device configured for generating vibration suppression control signals, inducing vibrations into a structure in response to the control signals, and transmitting the control signals. The system further comprises one or more integrated slave vibration actuating devices configured for receiving the control signals from the master actuating device, and inducing vibrations into the structure in response to the received control signals. The system also comprises one or more integrated vibration sensing devices configured for sensing vibrations within the structure, generating vibration sensing signals in response to the sensed vibrations, and transmitting the vibration sensing signals to the master actuating device. The master actuating device may be configured for generating the control signals based on the vibration sensing signals.

Abstract: Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Abstract: A transformer has a primary winding made from a first conducting trace formed on a first multilayer printed circuit board, and a secondary winding made from a second conducting trace formed on a second multilayer printed circuit board. The primary winding is magnetically coupled to the secondary winding. The windings are etched as traces in copper layers of the PC boards as spirals. The spiral of one copper layer is connected to the spiral of a different copper layer by a via, or vias, formed through the insulating layer of the PC board. The vias are drilled, cleaned, and plated with conducting material, for example copper. By using multiple layers, and by connecting spiral windings of each layer to the windings of the next layer by use of vias, any number of turns can be built into a primary winding, or into a secondary winding.

Abstract: The invention is a transformer having one winding, for example the secondary, built as tracings in a first multilayer PC board. The primary windings are made as a separate second PC board. In an exemplary embodiment of the invention, the second PC board containing the primary windings is attached to the first PC board by attachment tabs built into the second PC board, and the tabs are soldered to receiving attachment pads of the first PC board. In another exemplary embodiment of the invention, the first PC board has various other components mounted thereon. For example, the secondary windings of a power transformer along with the power supply circuits are all built into a first single PC board. In another exemplary embodiment of the invention, the windings are etched as traces in copper layers of the PC boards as spirals. The spiral of one copper layer is connected to the spiral of a different copper layer by a via, or vias, formed through the insulating layer of the PC board.

Abstract: A synch FET power supply uses a plurality of electronic switches to periodically connect the primary of a transformer to a direct current input source of power to generate a time varying magnetic field. The time varying magnetic field is coupled to two secondary windings. An electronic switch connected to each secondary winding periodically connects its secondary to the other output terminal. A reference voltage is applied to the control circuits, and the control circuits adjust the switches so that the output voltage tracks the reference voltage. Logic AND gates control the “turn on” signals to the electronic switches in the secondary circuits so that the secondary windings are not connected to an output terminal until a “synch FET enable” signal is applied to the AND gates.

Abstract: The invention replaces a snubber resistor with a two diodes and a load. The electric charge stored in the snubber capacitor on each cycle of the switch is then caused by a first diode to flow through the load, rather than to flow through a snubber resistor. A second diode provides a charging path for the snubber capacitor. The load uses the electric power which would be wasted in the snubber resistor.