Patents by Inventor Gregory Debrabander
Gregory Debrabander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230133379Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: January 4, 2023Publication date: May 4, 2023Inventors: Gregory DeBrabander, Mark Nepomnishy
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Patent number: 11571895Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: October 21, 2020Date of Patent: February 7, 2023Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
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Publication number: 20210031521Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: October 21, 2020Publication date: February 4, 2021Applicant: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
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Patent number: 10850518Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: November 8, 2019Date of Patent: December 1, 2020Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
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Publication number: 20200070518Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: November 8, 2019Publication date: March 5, 2020Applicant: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
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Patent number: 10471718Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: July 3, 2018Date of Patent: November 12, 2019Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
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Publication number: 20180326729Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: July 3, 2018Publication date: November 15, 2018Applicant: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
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Publication number: 20180236771Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: ApplicationFiled: February 23, 2017Publication date: August 23, 2018Inventors: Gregory DeBrabander, Mark Nepomnishy
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Patent number: 10052875Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.Type: GrantFiled: February 23, 2017Date of Patent: August 21, 2018Assignee: FUJIFILM Dimatix, Inc.Inventors: Gregory DeBrabander, Mark Nepomnishy
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Patent number: 8853915Abstract: A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.Type: GrantFiled: September 18, 2009Date of Patent: October 7, 2014Assignee: FUJIFILM Dimatix, Inc.Inventors: Christoph Menzel, Gregory DeBrabander, Corina Nistorica
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Patent number: 8727475Abstract: A method is described wherein one or more parameters are measured that affect the nozzle velocity at which a printing fluid is ejected from a pumping chamber through a nozzle. The printing fluid is contained in the pumping chamber actuated by deflection of a piezoelectric layer. A surface area of an electrode actuating the piezoelectric layer is reduced based at least in part on the measured one or more parameters. Reducing the surface area of the electrode reduces the actuated area of the piezoelectric layer.Type: GrantFiled: September 22, 2009Date of Patent: May 20, 2014Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Christoph Menzel, Corina Nistorica, Gregory DeBrabander
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Patent number: 8641171Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.Type: GrantFiled: May 30, 2012Date of Patent: February 4, 2014Assignee: FUJIFILM CorporationInventors: Gregory DeBrabander, Mark Nepomnishy
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Patent number: 8523322Abstract: A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.Type: GrantFiled: June 30, 2006Date of Patent: September 3, 2013Assignee: FUJIFILM Dimatix, Inc.Inventors: Yoshimasa Okamura, Jeffrey Birkmeyer, John A. Higginson, Gregory Debrabander, Paul A. Hoisington, Andreas Bibl
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Publication number: 20120234946Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.Type: ApplicationFiled: May 30, 2012Publication date: September 20, 2012Applicant: FUJIFILM CORPORATIONInventors: Gregory DeBrabander, Mark Nepomnishy
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Patent number: 8210649Abstract: A fluid ejection module includes a flow-path body, a first oxide layer, a membrane, and a second oxide layer. The flow-path body has a first outer surface and an opposing second outer surface and a plurality of flow paths, each flow path extending at least from the first outer surface to the second outer surface. The first oxide layer coats at least an interior surface of each of the flow paths and the first and second outer surfaces of the flow-path body and has a thickness that varies by less than 5% along {100} planes. The membrane has a first outer surface. The second oxide layer is coated on the first outer surface of the membrane and has a thickness that varies by less than 5% along {100} planes and is bonded to the first oxide layer.Type: GrantFiled: November 6, 2009Date of Patent: July 3, 2012Assignee: FUJIFILM CorporationInventors: Zhenfang Chen, Gregory Debrabander
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Patent number: 8197029Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.Type: GrantFiled: December 30, 2008Date of Patent: June 12, 2012Assignee: FUJIFILM CorporationInventors: Gregory Debrabander, Mark Nepomnishy
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Publication number: 20110212261Abstract: A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.Type: ApplicationFiled: May 12, 2011Publication date: September 1, 2011Inventors: Yoshimasa Okamura, Jeffrey Birkmeyer, John A. Higginson, Gregory Debrabander, Paul A. Hoisington, Andreas Bibl
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Publication number: 20110109694Abstract: A fluid ejection module includes a flow-path body, a first oxide layer, a membrane, and a second oxide layer. The flow-path body has a first outer surface and an opposing second outer surface and a plurality of flow paths, each flow path extending at least from the first outer surface to the second outer surface. The first oxide layer coats at least an interior surface of each of the flow paths and the first and second outer surfaces of the flow-path body and has a thickness that varies by less than 5% along {100} planes. The membrane has a first outer surface. The second oxide layer is coated on the first outer surface of the membrane and has a thickness that varies by less than 5% along {100} planes and is bonded to the first oxide layer.Type: ApplicationFiled: November 6, 2009Publication date: May 12, 2011Inventors: Zhenfang Chen, Gregory DeBrabander
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Publication number: 20100165048Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.Type: ApplicationFiled: December 30, 2008Publication date: July 1, 2010Inventors: Gregory DeBrabander, Mark Nepomnishy
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Publication number: 20100141709Abstract: A nozzle layer is described that has a semiconductor body having a first surface, a second surface opposing the first surface, and a nozzle formed through the body connecting the first and second surfaces, wherein the nozzle is configured to eject fluid through a nozzle outlet on the second surface, and the outlet having straight sides connected by curved corners.Type: ApplicationFiled: October 26, 2009Publication date: June 10, 2010Inventors: Gregory DeBrabander, Deane A. Gardner, Thomas G. Duby, Marlene McDonald, William R. Letendre, Christoph Menzel