Abstract: An electrical connection between two chips includes an IC pad on a first chip, an IC pad on a second chip, a first barrier metal over the IC pad of the first chip, a second barrier metal over the IC pad of the second chip, a malleable electrically conductive metal, different from the barrier metals, trapped between the first barrier metal and the second barrier metal, the first barrier metal, the malleable conductive metal and the second barrier metal forming a complete electrically conductive path between the IC pad of the first chip and the IC pad of the second chip.

Abstract: A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.

Abstract: A chip having at least one electrical contact having a first end proximate to the chip and a second end removed from the chip, the second end including a pattern configured to facilitate penetration of the at least one contact into a malleable contact on another chip, the pattern comprising a non-planar surface having a perimeter and a surface area, the surface area being larger than a planar surface of an identical perimeter.

Abstract: A chip having at least one electrical contact having a first end proximate to the chip and a second end removed from the chip, the second end including a pattern configured to facilitate penetration of the at least one contact into a malleable contact on another chip, the pattern comprising a non-planar surface having a perimeter and a surface area, the surface area being larger than a planar surface of an identical perimeter.

Abstract: An electrical connection between two chips includes an IC pad on a first chip, an IC pad on a second chip, a first barrier metal over the IC pad of the first chip, a second barrier metal over the IC pad of the second chip, a malleable electrically conductive metal, different from the barrier metals, trapped between the first barrier metal and the second barrier metal, the first barrier metal, the malleable conductive metal and the second barrier metal forming a complete electrically conductive path between the IC pad of the first chip and the IC pad of the second chip.

Abstract: A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.

Abstract: A chip contact functionally having an IC pad, a barrier layer over the IC pad, and a malleable material over the barrier layer. An alternative chip contact functionally having an IC pad, a barrier layer over the IC pad, and a rigid material over the barrier layer.

Abstract: A method of physically and electrically joining two chips to each other involves aligning an electrically conductive contact of a first chip with a corresponding electrically conductive contact on a second chip, the electrically conductive contact of the first chip being a rigid material and the electrically conductive contact of the second chip being a material that is malleable, bringing the aligned electrically conductive contact of the first chip into contact with the corresponding electrically conductive contact on the second chip, elevating the contact of the chips to a temperature that is below a liquidus temperature for both the rigid material and the material that is malleable while applying pressure to the chips so as to cause the rigid material to penetrate the malleable material and form an electrically conductive connection, and, following the forming of the electrically conductive connection, cooling the contacts to an ambient temperature.

Abstract: A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.

Abstract: A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.

Abstract: A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.

Abstract: A chip contact functionally having an IC pad, a barrier layer over the IC pad, and a malleable material over the barrier layer. An alternative chip contact functionally having an IC pad, a barrier layer over the IC pad, and a rigid material over the barrier layer.

Abstract: An electrical connection between two chips includes an IC pad on a first chip, an IC pad on a second chip, a first barrier metal over the IC pad of the first chip, a second barrier metal over the IC pad of the second chip, a malleable electrically conductive metal, different from the barrier metals, trapped between the first barrier metal and the second barrier metal, the first barrier metal, the malleable conductive metal and the second barrier metal forming a complete electrically conductive path between the IC pad of the first chip and the IC pad of the second chip.

Abstract: A method of joining contacts on two chips, each having multiple contacts, to each other involves maintaining a first of the chips at a first temperature, the first of the chips having a rigid electrical contact thereon, bringing a second chip, having an electrical contact that is malleable with respect to the rigid contact and matingly corresponding thereto, into contact with the first such that the corresponding rigid and malleable contacts are brought together, locally raising the second of the chips to a local temperature that is sufficiently high to cause material of the rigid and malleable contact to interdiffuse, interpenetrate or both, but below both a temperature that would cause the material to become liquidus and a fuse temperature, and allowing the second of the chips to cool to at least the first temperature.

Abstract: A chip having at least one electrical contact having a first end proximate to the chip and a second end removed from the chip, the second end including a pattern configured to facilitate penetration of the at least one contact into a malleable contact on another chip, the pattern comprising a non-planar surface having a perimeter and a surface area, the surface area being larger than a planar surface of an identical perimeter.

Abstract: A method of physically and electrically joining two chips to each other involves aligning an electrically conductive contact of a first chip with a corresponding electrically conductive contact on a second chip, the electrically conductive contact of the first chip being a rigid material and the electrically conductive contact of the second chip being a material that is malleable, bringing the aligned electrically conductive contact of the first chip into contact with the corresponding electrically conductive contact on the second chip, elevating the contact of the chips to a temperature that is below a liquidus temperature for both the rigid material and the material that is malleable while applying pressure to the chips so as to cause the rigid material to penetrate the malleable material and form an electrically conductive connection, and, following the forming of the electrically conductive connection, cooling the contacts to an ambient temperature.