Abstract: Epoxy probe cards are modified by mounting passive and/or active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short, electrically conductive lines that are formed on the probe card surface by printed circuit techniques. Ordinary wire probes may be interspersed with coaxial probes with electrically conducting tips bonded to electrically insulating shanks. An auxiliary printed circuit board containing additional electronic components may be included to accommodate especially sensitive test points. The resulting probe structure is intended to extend the frequency range of the well-developed epoxy probe card technology while retaining its ruggedness and low cost features.

Abstract: Epoxy probe cards are modified by mounting passive and/or active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short, electrically conductive lines that are formed on the probe card surface by printed circuit techniques. Ordinary wire probes may be interspersed with coaxial probes and probes with electrically conducting tips bonded to electrically insulating shanks. An auxiliary printed circuit board containing additional electronic components may be included to accommodate especially sensitive test points. The resulting probe structure is intended to extend the frequency range of the well-developed epoxy probe card technology while retaining its ruggedness and low cost features.

Abstract: Epoxy probe cards are modified by mounting passive and/or active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short, electrically conductive lines that are formed on the probe card surface by printed circuit techniques. Ordinary wire probes may be interspersed with coaxial probes and probes with electrically conducting tips bonded to electrically insulating shanks. An auxiliary printed circuit board containing additional electronic components may be included to accommodate especially sensitive test points. The resulting probe structure is intended to extend the frequency range of the well-developed epoxy probe card technology while retaining its ruggedness and low cost features.

Abstract: Epoxy probe cards are modified by mounting passive and/or active electronic components on the insulating surface of the probe card and connecting those components to the probe wires with short, electrically conductive lines that are formed on the probe card surface by printed circuit techniques. Ordinary wire probes may be interspersed with coaxial probes and probes with electrically conducting tips bonded to electrically insulating shanks. An auxiliary printed circuit board containing additional electronic components may be included to accommodate especially sensitive test points. The resulting probe structure is intended to extend the frequency range of the well-developed epoxy probe card technology while retaining its ruggedness and low cost features.

Abstract: A probe for testing integrated circuits at microwave frequencies employs a tapered coaxial transmission line to transform the impedance at the probe tips to the impedance of the test instruments. Mechanically resilient probe tip structures allow reliable probing of non-planar circuits and the elastic probe body allows large overprobing without damage to the test circuit. Novel insulator structures for the coaxial line allow easy and accurate assembly and high performance.

Abstract: A device for testing the performance of high speed integrated circuits (ICs) while in wafer form or separated from the wafer which includes first and second spaced-apart probes fixedly mounted on a support member for accurately positioning the first and second probes in three dimensions for contacting at least one first point and a second point, respectively, on an IC under test. The first and second probes are interconnected at a predetermined portion of their length by a capacitor means which provides sufficient flexibility so as to facilitate independent movement of the first and second probes and avoid introducing parameters (e.g., inductance) which interfere with high speed testing of the IC. In one embodiment, the first probe is a transmission line probe (e.g., a coaxial line) and the second probe is a wire probe for supplying power to the second point on the IC.

Abstract: A microposition table is held in place by the friction between a series of plates contacting one another. Movement is effected by forcing a small burst of air through a series of channels to drive metal pistons each held captive inside an elongated cylinder. The impact of each piston striking one or the other of the cylinder ends imparts sharp mechanical impulses to each plate driving the plate a small distance in the direction of the impacting force. Repeated impacts by repeated bursts of air move the plates the desired distances with respect to one another.

Abstract: A device for measuring the performance of high speed integrated circuits (ICs) while in wafer form consists of one or more miniature coaxial transmission lines for carrying the test signals to and from test instruments. Each of the miniature coaxial cables has a standard connector at one end for connection to testing instruments. The other end of each cable has its center conductor extended beyond the shield of the cable and formed into a conical point for connection to test pads on the IC. One or more miniature leaf springs are attached to the shield. The leaf springs are adapted so that during a probing operation they contact the test pads first and thereafter flex to allow the center conductors to make contact to other test pads. The miniature coaxial transmission lines also flex to limit forces which could otherwise damage center conductors or the test pads.