Abstract: A center tapped chip inductor includes a core and a winding formed from one or more wires wrapped about the core. A first and a second end terminal are provided along with a medially disposed center terminal, all of which are in electrical contact the winding. By providing a center tap on a chip inductor, a high Q component can be produced while retaining the spatial limitations of a two terminal chip inductor.

Abstract: Improved telemetry antennas and methods of fabrication for an implantable medical device (IMD) for use in uplink telemetry (UT) and downlink telemetry (DT) transmissions between the IMD and an external medical device (EMD) are disclosed. A first telemetry antenna element is supported to extend in a first direction along a minor side of the IMD housing by a first header segment, and a second antenna element is supported to extend in a second direction along a second minor side of the IMD housing by a second header segment. The first and second antenna elements are supported to extend apart at substantially 90° to one another, i.e., substantially orthogonally, in substantially a common plane to optimize UT transmission and DT reception of UHF telemetry signals by at least one of the first and second antenna elements depending upon the mutual spatial orientation with the antenna elements of an EMD antenna.

Abstract: The invention is directed to techniques for synchronizing the internal clocks of two devices, such as an implantable medical device and an external device, with reduced reliance on periodic polling. In one embodiment, the invention is directed to a technique in which one of the devices computes a time drift. The time drift may occur because the internal clock of one device may run more slowly than the internal clock of the other device. One device may poll the other as a function of the time drift. In another embodiment, a system of medical devices synchronizes internal clocks to a time signal generated by a time reference.

Abstract: An automated identification and configuration system for use with an implantable medical device (IMD) is disclosed. The system includes a first communication circuit that is attached to, or otherwise carried by, a detachable component associated with the IMD such as a medical lead. The communication circuit stores data such as model numbers, serial numbers, technical data, and/or calibration information that describes the additional component. This information may be transferred by the first communications circuit to a second communications circuit that is external to the additional component. This transferred data can be used to automatically configure the internal circuitry and connection functions of the IMD to properly interface with, and support, the additional component. For example, the data can be used to automatically adjust amplifier gains or other sensor circuitry, or to configure a connector block to properly couple to the component.

Abstract: An automated identification and configuration system for use with an implantable medical device (IMD) is disclosed. The system includes a first communication circuit that is attached to, or otherwise carried by, a detachable component associated with the IMD such as a medical lead. The communication circuit stores data such as model numbers, serial numbers, technical data, and/or calibration information that describes the additional component. This information may be transferred by the first communications circuit to a second communications circuit that is external to the additional component. This transferred data can be used to automatically configure the internal circuitry and connection functions of the IMD to properly interface with, and support, the additional component. For example, the data can be used to automatically adjust amplifier gains or other sensor circuitry, or to configure a connector block to properly couple to the component.

Abstract: Implantable medical devices (IMDs) having RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include: (1) integrating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate.

Abstract: An automated identification and configuration system for use with an implantable medical device (IMD) is disclosed. The system includes a first communication circuit that is attached to, or otherwise carried by, a detachable component associated with the IMD such as a medical lead. The communication circuit stores data such as model numbers, serial numbers, technical data, and/or calibration information that describes the additional component. This information may be transferred by the first communications circuit to a second communications circuit that is external to the additional component. This transferred data can be used to automatically configure the internal circuitry and connection functions of the IMD to properly interface with, and support, the additional component. For example, the data can be used to automatically adjust amplifier gains or other sensor circuitry, or to configure a connector block to properly couple to the component.

Abstract: A circuit for providing phase shifted I and Q output signals from a received FSK modulated signal and the method of its operation. The circuit includes apparatus for receiving an FSK modulated signal, first, second and third mixers, to which the received FSK modulated signal is applied, a local oscillator, generating an oscillator signal and phase shifters providing first, second and third phase shifted versions of the oscillator signal to the first, second and third mixers to produce first, second and third mixer output signals which are likewise phase shifted. The mixer output signals are provided to summing circuits providing an I output signal corresponding to the difference between the first and second mixer output signals a Q output signal corresponding to the difference between the second and third mixer output signals.

Abstract: A method and an apparatus for reducing coupled electrical energy resulting from an electromagnetic field. Embodiments of the present invention provide for an elongate body having a proximal end portion, a middle portion, and a distal end portion and at least one coil wound about at least one of the proximal end portion, the middle portion, and the distal end portion, the coil to provide for filtering of radio frequency (RF) signal-coupled electrical energy.

Abstract: Implantable medical devices (IMDS) having RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof. An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include: (1) integrating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate.

Abstract: Implantable medical devices (IMDs) having sense amplifiers for sensing physiologic signals and parameters, RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming and interrogation commands to and from an external programmer or other medical device are disclosed. At least one IC chip and discrete components have a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include forming notch filters of MEMS structures or forming discrete circuit notch filters by one or more of: (1) IC fabricating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate.

Abstract: A telemetry receiver for an implantable medical device such as a cardiac pacemaker has an RF antenna coupled to a telemetry circuit that includes an out-of-band rejection filter comprising a microelectromechanical filter. The telemetry circuit further includes an amplifier coupled to the microelectromechanical filter and a demodulator coupled to the amplifier. The filter, amplifier and demodulator are all fabricated on a common integrated circuit die. A multichannel telemetry receiver for an implantable medical device has a plurality of microelectromechanical bandpass filters defining individual channels. A multiplexing circuit selects the signal of an individual bandpass filter channel for application to a demodulator circuit that recovers programming data from a modulated RF transmission from a programming unit.

Abstract: An automated identification and configuration system for use with an implantable medical device (IMD) is disclosed. The system includes a first communication circuit that is attached to, or otherwise carried by, a detachable component associated with the IMD such as a medical lead. The communication circuit stores data such as model numbers, serial numbers, technical data, and/or calibration information that describes the additional component. This information may be transferred by the first communications circuit to a second communications circuit that is external to the additional component. This transferred data can be used to automatically configure the internal circuitry and connection functions of the IMD to properly interface with, and support, the additional component. For example, the data can be used to automatically adjust amplifier gains or other sensor circuitry, or to configure a connector block to properly couple to the component.

Abstract: The present invention provides a practical, multi-polar, in-line connector system for use in connecting implantable medical devices (IMD) and associated non-standard, low profile medical electrical leads. In addition, the present invention provides a system that uses tool less, frictional, sealed, compressive electrical connections for most or all of the electrical interconnections between an IMD and a low profile lead. A protective sleeve seals the lead connector to the non-standard port to prevent intrusion of body fluids therein. In addition, optional microchip-based circuitry coupled to the sleeve enables wireless communication and remote programming for diverse IMDs. Memory associated with the circuitry can store, update and reprogram a wide variety of information relevant to the IMD, the patient, and the attending physician, among others. For example, the microchip may be used to identify the lead type and characteristics, as well as other useful data.

Abstract: In an implantable medical device, a frequency synthesizer employed in the RF transceiver of the IMD operating system functions in a PLL LOCK mode wherein the VCO frequency is governed by the PLL and an energy saving HOLD mode wherein the PLL is not operational and the VCO generated carrier frequency can drift over time. The PLL circuit is powered up and coupled with a control voltage input and the output of the VCO to develop a frequency control voltage stored by a capacitive loop filter during initial LOCK portions of both uplink and downlink telemetry transmission time periods. A frequency modulation (FM) input of the VCO receives data bit modulation voltages that modulates the carrier frequency during uplink transmission of patient data.

Abstract: An implantable device having a hermetic housing containing a transceiver, circuitry for sensing a physiologic parameter or delivering a stimulus signal, an antenna mounted external to the hermetic enclosure, a medical lead, located external to the hermetic enclosure and a feedthrough extending through the wall of the hermetic enclosure. The antenna and the electrical lead are coupled to the feedthrough exterior to the device housing and the transceiver and the sensing or stimulating circuitry are coupled to the feedthrough internal to the device housing. The device is provided with a diplexer including high and low pass filters arranged to prevent passage of high frequency signals from the antenna to the sensing or stimulating circuitry and to prevent passage of low frequency signals from the medical lead to the transceiver.

Abstract: Implantable medical devices (IMDs) having sense amplifiers for sensing physiologic signals and parameters, RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming and interrogation commands to and from an external programmer or other medical device are disclosed. At least one IC chip and discrete components have a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include forming notch filters of MEMS structures or forming discrete circuit notch filters by one or more of: (1) IC fabricating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate.

Abstract: A system for communicating with a medical device implanted in an ambulatory patient and for locating the patient in order to selectively monitor device function, alter device operating parameters and modes and provide emergency assistance to and communications with a patient. The implanted device includes a telemetry transceiver for communicating data and operating instructions between the implanted device and an external patient communications control device that is either worn by or located in proximity to the patient within the implanted device transceiving range. The control device preferably includes a communication link with a remote medical support network, a global positioning satellite receiver for receiving positioning data identifying the global position of the control device, and a patient activated link for permitting patient initiated personal communication with the medical support network.

Abstract: A device for use in communication with an implantable medical device. The device is provided with a spatial diversity antenna array mounted to a housing and an RF transceiver operating at defined frequency, coupled to the antenna alray. The antenna array comprises two antennas spaced a fraction of the wavelength of the defined frequency from one another, each antenna including two antenna elements mounted to the housing and located oithogonal to one another. Selection of which of the antennas is employed is accomplished by an device controller, responsive to the quality of the signals received by the antennas.

Abstract: A microstrip RF telemetry antenna is formed on or within the exterior surface of an implantable medical device housing that is formed either of a conductive metal or of a non-conductive dielectric material. The microstrip antenna is formed of an electrically conductive radiator patch layer that is laminated upon an exterior facing side of a dielectric substrate layer of relatively constant thickness. A conductive ground plane layer is formed on the opposite side of the dielectric substrate layer to extend parallel to and at least coextensively with the radiator patch layer. The radiator patch layer is coupled to the transceiver circuitry within the implantable medical device housing by a feedthrough extending through the dielectric substrate layer, the ground plane layer and the implantable medical device housing side wall.