Abstract: Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Disclosed herein is a modular computing device that provides a user options to upgrade an existing computing device as improved expansion units become available without rendering the underlying base unit obsolete. The base unit of the modular computing device receives high-voltage AC power and one or more power supplies within the base unit converts the AC power to low-voltage DC power that is consumed within the base unit. An AC power transfer unit transfers AC power from the base unit to an expansion unit installed within an expansion dock of the base unit. One or more power supplies within the expansion unit convert the received AC power to low-voltage DC power that is consumed within the expansion unit.

Abstract: Systems, methods, and software are disclosed herein for compressing audio data. In an implementation, sampled values of an audio signal have a dynamic range. A division of the dynamic range, into at least a lower range and an upper range, is identified based on a fixed mapping of a lower portion of the sampled values to a subset of quanta in a set of quanta having a depth less than a depth of the sampled values. Then an adaptive mapping of an upper portion of the sampled values to a remaining subset of quanta in the set of quanta is also identified, based at least on a dimension of the upper range. The fixed mapping is used to encode the lower portion of the sampled values based, while the adaptive mapping is used to encode the upper portion of the sampled values based on the adaptive mapping.

Abstract: Power control arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes an integrated circuit device comprising one or more processing cores and a power domain configured to distribute a supply voltage to the one or more processing cores. The assembly also includes a charge injection circuit coupled to the power domain of the integrated circuit device, and configured to selectively couple electric charge into the power domain to predictively offset at least portions of voltage transients in the power domain.

Abstract: Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, where the first circuit board is coupled to first surface of a system circuit board. The assembly includes a second circuit assembly comprising a second circuit board having decoupling capacitance for the integrated circuit device, where the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Abstract: Power control arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes an integrated circuit device comprising one or more processing cores and a power domain configured to distribute a supply voltage to the one or more processing cores. The assembly also includes a charge injection circuit coupled to the power domain of the integrated circuit device, and configured to selectively couple electric charge into the power domain to predictively offset at least portions of voltage transients in the power domain.

Abstract: Voltage control arrangements for integrated circuit devices are discussed herein. In one example, a method includes receiving an indication of one or more software elements selected for execution by an integrated circuit device, and determining a target level of a supply voltage for the integrated circuit device based on the indication. The method also includes controlling voltage regulation circuitry to adjust a present level of the supply voltage for the integrated circuit device in accordance with the target level.

Abstract: Integrated circuit device carriers and packaging assemblies which have attached decoupling capacitance are discussed herein. In one example, an assembly includes a package assembly coupled to a motherboard and comprising a carrier circuit board and an integrated circuit device coupled to a first side of the carrier circuit board. The assembly also includes decoupling capacitors for the integrated circuit device conductively coupled between the motherboard and a second side of the carrier circuit board opposite from at least a portion of a footprint of the integrated circuit device on the carrier circuit board.

Abstract: Integrated circuit device carriers and packaging assemblies which have attached decoupling capacitance are discussed herein. In one example, an assembly includes a package assembly comprising a carrier circuit board and an integrated circuit device coupled to a first side of the carrier circuit board. The assembly includes decoupling capacitors for the integrated circuit device are coupled to a second side of the carrier circuit board opposite from at least a portion of a footprint of the integrated circuit device on the carrier circuit board. A motherboard can be coupled to the package assembly and have at least one motherboard substrate layer facing the decoupling capacitors.

Abstract: Integrated circuit decoupling capacitance systems, arrangements, and assemblies are discussed herein. In one example, an assembly includes an integrated circuit device comprising a plurality of through silicon vias (TSVs) coupled to corresponding voltage domains of the integrated circuit device. The assembly includes one or more capacitive elements external to the integrated circuit device and conductively coupled to selected ones of the TSVs.

Abstract: Systems, methods, and software are disclosed herein for compressing audio data. In an implementation, sampled values of an audio signal have a dynamic range. A division of the dynamic range, into at least a lower range and an upper range, is identified based on a fixed mapping of a lower portion of the sampled values to a subset of quanta in a set of quanta having a depth less than a depth of the sampled values. Then an adaptive mapping of an upper portion of the sampled values to a remaining subset of quanta in the set of quanta is also identified, based at least on a dimension of the upper range. The fixed mapping is used to encode the lower portion of the sampled values based, while the adaptive mapping is used to encode the upper portion of the sampled values based on the adaptive mapping.

Abstract: A fan for cooling an electronic device is described, wherein the fan can include an enclosure and a motor secured within the enclosure. The fan can also include an impeller to be turned by the motor, the impeller having a plurality of blades, wherein an angular spacing of the blades results in an audio spread-spectrum within a range of audio frequencies. In some examples, an arrangement of the blades has a center of mass below a threshold, and the angular spacing of the blades and a blade pass frequency (BPF) results in sound that is distributed in the range of audio frequencies.

Abstract: Examples are disclosed that relate cooling an electronic device based on power load. One disclosed example includes a controller configured to obtain a first measure of a power load, apply a filter to obtain a first filtered power load value, set a first thermal setpoint based at least on the first filtered power load value, determine a first temperature of the device, and adjust a response of the cooling mechanism based at least on the first thermal setpoint. The controller is further configured to obtain a second measure of the power load at a different time, apply the filter to obtain a second filtered power load value, set a second thermal setpoint based at least on the second filtered power load value, determine a second temperature of the device, and adjust the response of the cooling mechanism based at least on the second thermal setpoint.

Abstract: The disclosed subject matter includes techniques for wireless control. A system includes a processor. The system also includes a computer-readable memory storage device storing executable instructions that can be executed by the processor to cause the processor to receive a connection request from a wireless controller. The processor can also send a request for a media stream and a request for a wireless monitoring acknowledgement to a host device. The processor can also receive a response from the host device with the wireless monitoring acknowledgment. The processor can also further receive a message from the host device acknowledging a reception with the wireless controller. The processor can stop monitoring for control data from the wireless controller in response to the host device acknowledging the reception with the wireless controller. The processor can further receive the media stream from the host device.

Abstract: Computing device manufacturers are often driven to minimize power supply capabilities supplied with a device to that required to operate the device. The disclosed computing devices include a system chassis and a removable power module. The removable power module includes a power supply that rectifies received AC power to a quantity of DC power sufficient to operate both the removable power module and the system chassis. The removable power module may also include a performance enhancing component that may be used to upgrade the performance of the device. As each removable power module includes the power supply for the entire device, the power supply within each removable power module may be tailored to provide the power necessary to operate both the removable power module and the system chassis.

Abstract: An accessory apparatus includes a housing, an apparatus connector, a plurality of auxiliary accessory interfaces, and an internal microcontroller. The connection connector is configured to mate with a corresponding accessory connector of a physical controller to electrically connect the internal microcontroller to the physical controller. Each auxiliary accessory connector is configured to enable a separate auxiliary user input device to operatively connect to the accessory apparatus and electrically connect with the internal microcontroller. The internal microcontroller is configured to: (1) receive an input control signal from an auxiliary user input device operatively connected to an auxiliary accessory connector of the plurality of auxiliary accessory connectors, (2) map the input control signal to a mapped control signal corresponding to a physical control of the physical controller, and (3) send the mapped control signal to the physical controller via the apparatus connector.

Abstract: Examples are disclosed that relate cooling an electronic device based on power load. One disclosed example includes a controller configured to obtain a first measure of a power load, apply a filter to obtain a first filtered power load value, set a first thermal setpoint based at least on the first filtered power load value, determine a first temperature of the device, and adjust a response of the cooling mechanism based at least on the first thermal setpoint. The controller is further configured to obtain a second measure of the power load at a different time, apply the filter to obtain a second filtered power load value, set a second thermal setpoint based at least on the second filtered power load value, determine a second temperature of the device, and adjust the response of the cooling mechanism based at least on the second thermal setpoint.

Abstract: A method for controlling a cooling system for a device includes determining a power load of the processing system, determining a power load of the device, setting a first thermal setpoint based at least in part on the power load, determining a temperature of the device, adjusting a response of the cooling system based at least in part on the first thermal setpoint, detecting a change in the power load of the device to a higher power load having a higher magnitude acoustic response, in response to detecting the change in the power load, setting a second thermal setpoint having a lower magnitude acoustic response at the higher power load, the second thermal setpoint being based at least in part on a determined second corresponding acoustic response curve, and adjusting the response of the cooling system based at least in part on the second thermal setpoint.

Abstract: Accessory-based power distribution techniques are described. In one or more implementations, power available from a power system of a computing device is intelligently and adaptively distributed between device systems and accessories in accordance with a current usage scenario. To do so, a power manager operates to collect information regarding the current usage scenario, including system state information and a power draw level for accessory devices. Power available from the power system is then divided between the device systems and accessories in dependence upon the usage scenario, such as by establishing and applying power limits dynamically based on the usage scenario. For instance, as system power level for device subsystems may be reduced to provide more power for accessories in some scenarios. Likewise, power for accessories may be limited to enable a high performance mode for device operations in scenarios in which the system is operating near applied limits.