Abstract: The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.

Abstract: An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.

Abstract: The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.

Abstract: The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.

Abstract: The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.

Abstract: An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.

Abstract: An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be employed to insure fin separation. In an alternate embodiment, the strips are stacked. The resulting heat sink is particularly effective in impingement flow cooling of electronic devices, chips, circuits or modules.

Abstract: A method and apparatus which provide field upgradability of an electrical system's air cooling capacity is provided. In particular, air-moving devices are disposed in an external enclosure which is mated with a base unit in such a way as to convert one of the base unit's exhaust ports to an added inlet port. Accordingly, thermal upgradability in the field is easily provided by removing lower capacity interior blowers, by providing and using an access port into the middle of the old air flow path and by attaching an exterior unit having increased air-moving capacity.

Abstract: A method and apparatus which provide field upgradability of an electrical system's air cooling capacity is provided. In particular, air-moving devices are disposed in an external enclosure which is mated with a base unit in such a way as to convert one of the base unit's exhaust ports to an added inlet port. Accordingly, thermal upgradability in the field is easily provided by removing lower capacity interior blowers, by providing and using an access port into the middle of the old air flow path and by attaching an exterior unit having increased air-moving capacity.

Abstract: An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be employed to insure fin separation. In an alternate embodiment, the strips are stacked. The resulting heat sink is particularly effective in impingement flow cooling of electronic devices, chips, circuits or modules.

Abstract: In accordance with a preferred embodiment of the present invention, an orientation independent evaporator includes a wicking member which also operates as a manifold which possesses a number of surface accessible channels preferably via grooves cut in either side of a slab of wicking material at right angles to one another. The evaporator is, because of the structure of this wicking member, able to be operated in any orientation with respect to a gravitational field. The invention provides an improved evaporator for use in thermosyphons, and in particular, provides an improved mechanism for cooling electronic components.

Abstract: A method and apparatus which provide field upgradability of an electrical system's air cooling capacity. In particular, air-moving devices are disposed in an external enclosure which is mated with a base unit in such a way as to convert one of the base unit's exhaust ports to an added inlet port. Accordingly, thermal upgradability in the field is easily provided by removing lower capacity interior blowers, by providing and using an access port into the middle of the old air flow path and by attaching an exterior unit having increased air moving capacity.

Abstract: A heat sink is provided for use with stacks of integrated circuit chips. The heat sink comprises a thermally conductive body having a recess in which the chip stack is disposed. The heat sink also includes fins which extend away from the recess. In one embodiment, fins are provided inside the recess for improved cooling of higher power chips such as a microprocessor which is surrounded by less thermally demanding memory chips.

Abstract: A parallel plate heat sink, used in conjunction with an air moving device which provides an annular flow of air against the heat sink, is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures. Redirection of air flow includes passages within end fins which enhance capacity by improving the exiting flow.