Patents by Inventor Gregory Menk
Gregory Menk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9177815Abstract: Methods for chemical mechanical planarization of patterned wafers are provided herein. In some embodiments, methods of processing a substrate having a first surface and a plurality of recesses disposed within the first surface may include: depositing a first material into the plurality of recesses to predominantly fill the plurality of recesses with the first material; depositing a second material different from the first material into the plurality of recesses and atop the substrate to fill the plurality of recesses and to form a layer atop the first surface; and planarizing the second material using a first slurry in a chemical mechanical polishing tool until the first surface is reached. In some embodiments, a second slurry, different than the first slurry, is used to planarize the substrate to a first level.Type: GrantFiled: May 3, 2013Date of Patent: November 3, 2015Assignee: APPLIED MATERIALS, INC.Inventors: Yi-Chiau Huang, Gregory Menk, Errol Antonio C. Sanchez, Bingxi Wood
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Publication number: 20130295752Abstract: Methods for chemical mechanical planarization of patterned wafers are provided herein. In some embodiments, methods of processing a substrate having a first surface and a plurality of recesses disposed within the first surface may include: depositing a first material into the plurality of recesses to predominantly fill the plurality of recesses with the first material; depositing a second material different from the first material into the plurality of recesses and atop the substrate to fill the plurality of recesses and to form a layer atop the first surface; and planarizing the second material using a first slurry in a chemical mechanical polishing tool until the first surface is reached. In some embodiments, a second slurry, different than the first slurry, is used to planarize the substrate to a first level.Type: ApplicationFiled: May 3, 2013Publication date: November 7, 2013Inventors: YI-CHIAU HUANG, GREGORY MENK, ERROL ANTONIO C. SANCHEZ, BINGXI WOOD
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Publication number: 20070212976Abstract: A smart polishing media assembly is provided, along with a polishing system and a method for using the same. In one embodiment, the smart polishing media assembly includes a memory device coupled to a polishing material. The polishing material may be in pad, web or belt form. The memory device generally stores at least one material information, historical use information, and/or conditioning information of the polishing material.Type: ApplicationFiled: March 13, 2006Publication date: September 13, 2007Inventors: Peter McReynolds, Gregory Menk, Benjamin Bonner, Gopalakrishna Prabhu, Erik Rondum, Garlen Leung, Anand Iyer
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Publication number: 20070197134Abstract: A polishing article is described. The polishing article includes an elongated polishing layer, and a transparent carrier layer supporting the polishing layer, where the transparent carrier layer has a projection extending into an aperture in the polishing layer to provide a transparent window in the polishing layer.Type: ApplicationFiled: February 15, 2007Publication date: August 23, 2007Applicant: Applied Materials, Inc.Inventors: Gregory Menk, Peter McReynolds, Erik Rondum, Anand Iyer, Gopalakrishna Prabhu, Garlen Leung
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Publication number: 20070197145Abstract: A polishing article is described. The polishing article includes a linear polishing sheet having a linear transparent portion, wherein the linear transparent portion is formed from a material that has the flexibility to pass around a radius of about 2.5 inches without cracking.Type: ApplicationFiled: February 15, 2007Publication date: August 23, 2007Applicant: Applied Materials, Inc.Inventors: Gregory Menk, Peter McReynolds, Erik Rondum, Gopalakrishna Prabhu, Anand Iyer, Garlen Leung
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Publication number: 20070197132Abstract: A method is described. The method includes supporting a polishing sheet having a polishing surface on a subpad having a recess formed therein, applying a vacuum to the recess sufficient to pull portions of the polishing sheet into the recess to induce a recess in the polishing surface, positioning a substrate in a carrier head over the recess in the polishing surface, and lifting the substrate away from the polishing surface while the substrate is positioned over the recess.Type: ApplicationFiled: February 15, 2007Publication date: August 23, 2007Applicant: Applied Materials, Inc.Inventors: Gregory Menk, Steven Zuniga, Erik Rondum, Peter McReynolds, Gopalakrishna Prabhu, Garlen Leung, Anand Iyer
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Publication number: 20070197141Abstract: A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.Type: ApplicationFiled: February 15, 2007Publication date: August 23, 2007Applicant: Applied Materials, Inc.Inventors: Steven Zuniga, Peter McReynolds, Erik Rondum, Benjamin Bonner, Henry Au, Gregory Menk, Gopalakrishna Prabhu, Anand Iyer, Garlen Leung
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Publication number: 20070197133Abstract: A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.Type: ApplicationFiled: February 15, 2007Publication date: August 23, 2007Applicant: Applied Materials, Inc.Inventors: Gregory Menk, Peter McReynolds, Erik Rondum, Anand Iyer, Gopalakrishna Prabhu, Garlen Leung
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Publication number: 20070197147Abstract: A polishing system is described. The polishing system includes a polishing layer, and a subpad supporting the polishing layer, where the subpad has a spiral groove formed therein.Type: ApplicationFiled: February 15, 2007Publication date: August 23, 2007Applicant: Applied Materials, Inc.Inventors: Erik Rondum, Peter McReynolds, Benjamin Bonner, Gregory Menk, Gopalakrishna Prabhu, Garlen Leung, Anand Iyer
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Publication number: 20070117500Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.Type: ApplicationFiled: January 23, 2007Publication date: May 24, 2007Inventors: BENJAMIN BONNER, Peter Mcreynolds, Gregory Menk, Anand Iyer, Gopalakrishna Prabhu, Erik Rondum, Robert Jackson, Garlen Leung
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Publication number: 20060246831Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.Type: ApplicationFiled: May 2, 2005Publication date: November 2, 2006Inventors: Benjamin Bonner, Peter McReynolds, Gregory Menk, Anand Iyer, Gopalakrishna Prabhu, Erik Rondum, Robert Jackson, Garlen Leung