Abstract: The present invention relates to a radiation-sensitive resist composition comprising a radiation-sensitive acid generator and a copolymer binder formed by the reaction of (a) an acrylate or methacrylate monomer having a photogenerated acid cleavable substituent and (b) an acrylate or methacrylate monomer having a polar non photoacid cleavable substituent.

Abstract: A novel radiation-sensitive lithographic photoresist composition is provided which has improved sensitivity and resolution. The composition comprises a photosensitive acid generator and an acrylate or methacrylate copolymer. The copolymer contains first monomeric units having polar pendant groups and second monomeric units containing photoacid-cleavable ester groups. The polar pendant groups preferably comprise C.sub.6 -C.sub.12 alicyclic substituents containing a polar moiety R*, wherein the alicyclic substituents are bound through a linker moiety to the polymer backbone. Other monomeric units may be included as well. A process for using the composition to generate resist images on a substrate, i.e., in the manufacture of integrated circuits or the like.

Abstract: The invention relates to a process for forming bilayer resist images with a chemically-amplified, radiation-sensitive bilayer resist. The bilayer resist is disposed on a substrate and comprises (i) a top imaging layer comprising a radiation-sensitive acid generator and a vinyl polymer having an acid-cleavable silylethoxy group and (ii) an organic underlayer. The bilayer resist is used in the manufacture of integrated circuits.

Abstract: The present invention relates to the use of certain polyalkylphenyl silanes in photoresists to generate positive tone resist images. The polyalkylphenyl silanes have the formula: ##STR1## where R is C2-C12 alkyl and n is about 150 to 7000.

Abstract: The present invention relates to a process for generating a resist image on a substrate utilizing a resist composition comprising (a) a radiation-sensitive acid generator, (b) a substituted androstane, and (c) a copolymer acrylate binder. The resist image is made using deep ultraviolet radiation.

Abstract: An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.

Abstract: The invention relates to a process for generating a negative tone resist image comprising the steps of (1) coating a substrate with a film of a polymeric composition comprising (i) a polymer, (ii) a photosensitive acid generator, and (iii) acid labile groups; (2) imagewise exposing the film to radiation to generate free acid; and (3) developing the image with critical fluid.

Abstract: The present invention relates to a process for synthesizing on a single substrate a plurality of chemical compounds having diverse structures. The process involves the use of a bilayer photoresist to build up selected regions of the array in a step wise fashion.