Abstract: A digital radiographic detector includes redundant bonding pads formed on the array substrate and electrically connected to the array of photosensors. A plurality of COFs are each electrically connected to one of the bonding pads. A repair may be performed by removing a bond pad and reconnecting a corresponding COF to a redundant bond pad. A PCB including array read out electronics is electrically connected to the plurality of COFs.

Abstract: Embodiments of radiographic imaging systems and/or methods can monitor the state of calibration of a digital x-ray detector, the detector including a solid state sensor with a plurality of pixels, an optional scintillating screen and at least one embedded microprocessor. In one embodiment, a method can use a computer or the embedded microprocessor or both, for setting a calibration operating mode of the portable detector; taking a plurality of dark images in the calibration mode; determining a dark difference image between pixel readings between two of the plurality of dark images; identifying pixels in the dark difference image that differ by over a threshold amount from at least some surrounding pixels in the dark difference image as defective pixels.

Abstract: Embodiments of DR detector methods and/or apparatus for charge compensation can provide charge injection and/or at least one charge injection circuit that can temporally cancel charge injection to readout circuits resulting from positive (and/or negative) transitions of gate lines for pixel signal readout. In certain exemplary embodiments, DR detector imaging array methods and/or apparatus can provide variable charge injection levels (e.g., voltage or capacitance), variable Tau (e.g., resistance or capacitance), and/or multi-charge injection with staggered timing (e.g., using voltage and/or capacitance steps). In certain exemplary embodiments, DR detector imaging array methods and/or apparatus can provide charge injection compensation on ROIC on mask block basis. In exemplary embodiments, DR detector imaging array methods and/or apparatus can provide voltage reset off-set in readout circuits (e.g., ROICs).

Abstract: A projection radiographic imaging apparatus includes an imaging array with imaging pixels formed over an insulating substrate. A scintillator converts radiographic radiation to photoelectric radiation proximate to the imaging array. A dielectric layer disposed between the scintillator and the imaging array has a dielectric constant less than 3.0. A continuous or patterned anti-static layer disposed between the imaging array and the scintillator is connected to one or more conductive traces in the imaging array.

Abstract: Embodiments of methods and apparatus are disclosed for obtaining an imaging array or a digital radiographic system including a plurality of pixels where at least one pixel can include a scan line, a bias line, a switching element including a first terminal, a second terminal, and a control electrode where the control electrode is electrically coupled to the scan line; and a photoelectric conversion element including a first terminal electrically coupled to the bias line and a second terminal electrically coupled to the first terminal of the switching element, and a signal storage element formed in the same layers as the scan line, bias line, the data line, the switching element and the photoelectric conversion element. An area of one terminal of the signal storage element can be larger than a surface area of the pixel.

Abstract: Embodiments relate to detector imaging arrays with scintillators (e.g., scintillating phosphor screens) mounted to imaging arrays or radiographic detectors using the same. For example, the detector imaging arrays can include a scintillator, an imaging array comprising imaging pixels, where each imaging pixel comprises at least one readout element and one photosensor; and a first dielectric layer formed between the scintillator and the imaging layer, wherein the dielectric constant of the insulating layer is very low. Embodiments according to the application can include a second dielectric layer formed over at least a portion of the non-photosensitive regions of the array and/or a first dielectric layer, each with a dielectric constant.

Abstract: Embodiments of radiographic imaging systems and/or methods can monitor the state of calibration of a digital x-ray detector, the detector including a solid state sensor with a plurality of pixels, an optional scintillating screen and at least one embedded microprocessor. In one embodiment, a method can use a computer or the embedded microprocessor or both, for setting a calibration operating mode of the portable detector; taking a plurality of dark images in the calibration mode; determining a dark difference image between pixel readings between two of the plurality of dark images; identifying pixels in the dark difference image that differ by over a threshold amount from at least some surrounding pixels in the dark difference image as defective pixels.

Abstract: Exemplary embodiments provide a radiographic array, flat detector panel and/or X-ray imaging apparatus including the same and/or methods for using the same or calibrating the same. Exemplary embodiments can reduce or address noise occurring in the optically sensitive pixels that is temporally not related to image data detected by the optically sensitive pixels or dark reference frames detected by the optically sensitive pixels. Exemplary embodiments can include a capacitive element in a calibration pixel coupled between a row conductive line and a column conductive line in an imaging array.

Abstract: Embodiments of methods and apparatus are disclosed for obtaining an imaging array or a digital radiographic system including a plurality of pixels where at least one pixel can include a scan line, a bias line, a switching element including a first terminal, a second terminal, and a control electrode where the control electrode is electrically coupled to the scan line; and a photoelectric conversion element including a first terminal electrically coupled to the bias line and a second terminal electrically coupled to the first terminal of the switching element, and a signal storage element formed in the same layers as the scan line, bias line, the data line, the switching element and the photoelectric conversion element. An area of one terminal of the signal storage element can be larger than a surface area of the pixel.

Abstract: Exemplary embodiments provide a radiographic array, flat detector panel and/or X-ray imaging apparatus including the same and/or methods for using the same or calibrating the same. Exemplary embodiments can reduce or address noise occurring in the optically sensitive pixels that is temporally not related to image data detected by the optically sensitive pixels or dark reference frames detected by the optically sensitive pixels. Exemplary embodiments can include a capacitive element in a calibration pixel coupled between a row conductive line and a column conductive line in an imaging array.

Abstract: A pixel comprising a scan line proximate to a first surface of a substrate and a bias line between the first surface of the substrate and a first terminal of a photosensing element, where a portion of the bias line is substantially parallel to the scan line. The pixel can also comprise a switching element proximate to the first surface of the substrate and aligned with at least a portion of the scan line. The pixel can include the photosensing element proximate to the first surface of the substrate and aligned with at least a portion of the bias line.

Abstract: A light sensing array has a plurality of electrically isolated photosensors, each photosensor having a first terminal and a second terminal, each of the terminals of each photosensor being isolated from the terminals of the other photosensors, wherein each photosensor responds to an incident light level by producing a charge difference between the first and second terminal. There is a differential circuit selectively coupled to the first and second terminals of one of the photo sensors for producing an output signal related to the charge difference between the first and second terminals.

Abstract: A photosensor array includes data and scan lines (124, 148), circuitry of each data line/scan line pair formed in a backplane (110) on a substrate (102). On a first electrode scan line (148) a switching element (112) responds to a scan signal, connecting a first terminal (106) to a second terminal (108). A front plane (120) has sensing elements (122) indicating a measure of a received stimulus and including a charge collection electrode (130). An insulating layer (140) disposed between the backplane (110) and the front plane (120) contains at least a first via (136) connecting the first terminal (108) of the switching element (112) in the backplane (110) to a charge collection electrode (130) of the sensing element (122) in the front plane (120). A second via (126) connects between the second terminal (108) of the switching element (112) and the data line (124).

Abstract: A light sensing array has a plurality of electrically isolated photosensors, each photosensor having a first terminal and a second terminal, each of the terminals of each photosensor being isolated from the terminals of the other photosensors, wherein each photosensor responds to an incident light level by producing a charge difference between the first and second terminal. There is a differential circuit selectively coupled to the first and second terminals of one of the photosensors for producing an output signal related to the charge difference between the first and second terminals.

Abstract: A photosensor array includes data and scan lines (124, 148), circuitry of each data line/scan line pair formed in a backplane (110) on a substrate (102). On a first electrode scan line (148) a switching element (112) responds to a scan signal, connecting a first terminal (106) to a second terminal (108). A front plane (120) has sensing elements (122) indicating a measure of a received stimulus and including a charge collection electrode (130). An insulating layer (140) disposed between the backplane (110) and the front plane (120) contains at least a first via (136) connecting the first terminal (108) of the switching element (112) in the backplane (110) to a charge collection electrode (130) of the sensing element (122) in the front plane (120). A second via (126) connects between the second terminal (108) of the switching element (112) and the data line (124).

Abstract: Laser apparatus containing an electrically operated laser (laser diode) is temperature stabilized so that it is able to generate a beam of laser light of sufficient intensity to be suitable for use in a laser printer without entering a failure mode due to overheating. The laser diode is integrated into a hybrid thick film integrated circuit wherein the laser diode is bonded to one side of the hybrid's substrate of thermally conductive and electrically insulating material of the hybrid. The hybrid has conductors thereon which are connected to the leads from the laser diode. A circuit containing temperature sensitive material (elements formed of positive or negative temperature co-efficient resistive material) is distributed in spaced areas on the opposite side of the hybrid's substrate from the laser diode. The distributed thermistor circuit and its close thermal coupling to the cooler and the diode laser reduce thermal mass (capacitance), which must be heated or cooled, to maintain athermal conditions.