Patents by Inventor Gregory P. Imwalle
Gregory P. Imwalle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11116113Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.Type: GrantFiled: May 28, 2019Date of Patent: September 7, 2021Assignee: Google LLCInventors: Jerry Chiu, Abolfazl Sadeghpour, Gregory P. Imwalle
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Patent number: 11044835Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber including a housing that defines an inner volume and encloses a working fluid; and a liquid cold plate assembly that includes a top portion mounted to at least one of the vapor chamber or the motherboard assembly and including a heat transfer member that includes an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber.Type: GrantFiled: December 6, 2019Date of Patent: June 22, 2021Assignee: Google LLCInventors: Jerry Chiu, Gregory P. Imwalle, Emad Samadiani
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Publication number: 20200323100Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.Type: ApplicationFiled: May 28, 2019Publication date: October 8, 2020Inventors: Jerry Chiu, Abolfazl Sadeghpour, Gregory P. Imwalle
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Publication number: 20200315069Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber including a housing that defines an inner volume and encloses a working fluid; and a liquid cold plate assembly that includes a top portion mounted to at least one of the vapor chamber or the motherboard assembly and including a heat transfer member that includes an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber.Type: ApplicationFiled: December 6, 2019Publication date: October 1, 2020Inventors: Jerry Chiu, Gregory P. Imwalle, Emad Samadiani
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Patent number: 10542641Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: GrantFiled: April 10, 2018Date of Patent: January 21, 2020Assignee: Google LLCInventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 10130013Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and a plurality of electronic heat-generating devices at least partially immersed in the liquid phase of the non-conductive coolant to transfer a heat load to the non-conductive coolant.Type: GrantFiled: November 23, 2016Date of Patent: November 13, 2018Assignee: Google LLCInventors: Madhu Krishnan Iyengar, Christopher G. Malone, Gregory P. Imwalle
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Publication number: 20180235108Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: ApplicationFiled: April 10, 2018Publication date: August 16, 2018Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9961803Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: GrantFiled: November 22, 2016Date of Patent: May 1, 2018Assignee: Google LLCInventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9760098Abstract: Techniques for cooling a data center include circulating a first cooling medium to cool a plurality of rack-mounted computers; circulating a second cooling medium to cool the plurality of rack-mounted computers; determining that a first portion of the plurality of rack-mounted computers is operating at a power usage above a threshold power usage; adjusting at least one of a flow rate of the first or second cooling mediums to cool a second portion of the plurality of rack-mounted computers; and rerouting a portion at least one the first or second cooling mediums to cool the first portion of the plurality of rack-mounted computers.Type: GrantFiled: February 19, 2013Date of Patent: September 12, 2017Assignee: Google Inc.Inventors: Gregory P. Imwalle, Jeremy Rice
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Publication number: 20170079167Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: ApplicationFiled: November 22, 2016Publication date: March 16, 2017Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9596787Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and a plurality of electronic heat-generating devices at least partially immersed in the liquid phase of the non-conductive coolant to transfer a heat load to the non-conductive coolant.Type: GrantFiled: November 6, 2014Date of Patent: March 14, 2017Assignee: Google Inc.Inventors: Madhu Krishnan Iyengar, Christopher G. Malone, Gregory P. Imwalle
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Patent number: 9565790Abstract: A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component is received. A second measurement indicative of a temperature of a second computing component is received. A thermal value is calculated for the first computing component based on the first measurement and the second measurement. In response to determining that the calculated thermal value exceeds the threshold, an operational or physical parameter of the system is modified.Type: GrantFiled: February 10, 2014Date of Patent: February 7, 2017Assignee: Google Inc.Inventors: David W. Stiver, Gregory P. Imwalle
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Patent number: 9554491Abstract: A data center cooling system includes a cooling liquid supply conduit fluidly coupled between a cooling plant and an air-to-liquid heat exchanger positioned to receive a heated airflow from one or more racks. At least one rack supports a plurality of heat-generating electronic devices. The system further includes a cooling liquid return conduit fluidly coupled between the cooling plant and the air-to-liquid heat exchanger; and a heat transfer module thermally coupled to the cooling liquid supply and return conduits between the cooling plant and the air-to-liquid heat exchanger. The heat transfer module includes a cold side and a warm side, with the cold side thermally coupled to the cooling liquid supply conduit to transfer heat from a flow of a cooling liquid in the cooling liquid supply conduit to the warm side of the heat transfer module, and the warm side including a heat sink.Type: GrantFiled: July 1, 2014Date of Patent: January 24, 2017Assignee: Google Inc.Inventors: Eehern J. Wong, Gregory P. Imwalle, Emad Samadiani
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Patent number: 9552025Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: GrantFiled: September 23, 2014Date of Patent: January 24, 2017Assignee: Google Inc.Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9398731Abstract: A cooling apparatus for rack-mounted computing devices includes a heat sink including a thermal interface to conductively contact a computing device mounted on a printed circuit board; a cold plate including a first portion in thermal communication with the heat sink with a working fluid, and a second portion that includes a cooling coil in thermal communication with the first portion, the cooling coil including an inlet to receive chilled liquid; a fan positioned to circulate airflow over the cold plate; and a controller coupled to the fan to adjust a speed of the fan in response to an output of a sensor coupled to the computing device.Type: GrantFiled: September 23, 2014Date of Patent: July 19, 2016Assignee: Google Inc.Inventors: Gregory P. Imwalle, Eehern J. Wong, Emad Samadiani, Soheil Farshchian
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Publication number: 20160085277Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: ApplicationFiled: September 23, 2014Publication date: March 24, 2016Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9158345Abstract: Techniques for managing performance of a computing system include monitoring an operating power and an operating temperature of a rack-mounted computer in a data center; determining that the operating power is at or near a threshold operating power of the computer; and adjusting the operating frequency of the computer based on the adjusted operating temperature of the computer.Type: GrantFiled: October 15, 2012Date of Patent: October 13, 2015Assignee: Google Inc.Inventors: Jeremy Rice, Gregory P. Imwalle
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Patent number: 9091496Abstract: A data center cooling system includes a data center having electronic equipment that is supported in multiple racks; a cooling fluid source; multiple cooling units in the data center, where each cooling unit is configured to cool air warmed by a sub-set of the electronic equipment in the data center; multiple control valves, including a control valve associated with a particular cooling unit of the cooling units; and a controller arranged to modulate the control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit.Type: GrantFiled: February 27, 2013Date of Patent: July 28, 2015Assignee: Google Inc.Inventors: Gregory P. Imwalle, Thomas R. Kowalski, Andrew B. Carlson
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Patent number: 8988879Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.Type: GrantFiled: November 26, 2012Date of Patent: March 24, 2015Assignee: Google Inc.Inventors: William Hamburgen, Jimmy Clidaras, Winnie Leung, David W. Stiver, Jonathan D. Beck, Andrew B. Carlson, Steven T. Y. Chow, Gregory P. Imwalle, Amir M. Michael
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Patent number: 8694279Abstract: A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component is received. A second measurement indicative of a temperature of a second computing component is received. A thermal value is calculated for the first computing component based on the first measurement and the second measurement. In response to determining that the calculated thermal value exceeds the threshold, an operational or physical parameter of the system is modified.Type: GrantFiled: December 30, 2010Date of Patent: April 8, 2014Assignee: Exaflop LLCInventors: David W. Stiver, Gregory P. Imwalle