Patents by Inventor Gregory Patrick BODI

Gregory Patrick BODI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CLUSTERED MICROVIA STRUCTURE FOR A HIGH-DENSITY INTERFACE PCB
    Publication number: 20240074053
    Abstract: According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit board and is connected to the first conductive pad; and a second conductive via that is formed through the first layer of the printed circuit board and is connected to the first conductive pad.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Mingyi YU, Gregory Patrick BODI, Ananta H. ATTALURI, Duy NGUYEN
  • ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOUT USING TIE BARS
    Publication number: 20230276578
    Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
    Type: Application
    Filed: May 8, 2023
    Publication date: August 31, 2023
    Inventors: Mingyi YU, Gregory Patrick BODI
  • Electroplating edge connector pins of printed circuit boards without using tie bars
    Patent number: 11653455
    Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: May 16, 2023
    Assignee: NVIDIA Corporation
    Inventors: Mingyi Yu, Gregory Patrick Bodi
  • Inter-layer slot for increasing printed circuit board power performance
    Patent number: 11439002
    Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: September 6, 2022
    Assignee: NVIDIA Corporation
    Inventors: Mingyi Yu, Ananta H. Attaluri, Gregory Patrick Bodi, Carmen A. Capillo, Jr., Michael James Warner
  • ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOUT USING TIE BARS
    Publication number: 20220279659
    Abstract: A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 1, 2022
    Inventors: Mingyi YU, Gregory Patrick BODI
  • INTER-LAYER SLOT FOR INCREASING PRINTED CIRCUIT BOARD POWER PERFORMANCE
    Publication number: 20210127479
    Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.
    Type: Application
    Filed: October 27, 2020
    Publication date: April 29, 2021
    Inventors: Mingyi YU, Ananta H. ATTALURI, Gregory Patrick BODI, Carmen A. CAPILLO, JR., Michael James WARNER