Abstract: The present disclosure provides systems and methods for improved bifacial solar modeling. A method may comprise measuring an albedo of a surface on which an array of bifacial solar modules is disposed and setting an albedo parameter of a bifacial gain model. The method may further comprise measuring a backside irradiance of the array and setting a backside irradiance parameter. The method may further comprise setting a shed transparency parameter using the measured backside irradiance and a geometric model of the array. The method may further comprise setting a rear shading parameter using a shading model of the array. The method may further comprise computing an expected bifacial gain of the array. The method may further comprise determining an actual bifacial gain of the array. The method may further comprise setting a rear mismatch parameter to minimize a loss function of the expected bifacial gain and the actual bifacial gain.

Abstract: The present disclosure provides systems and methods for improved bifacial solar modeling. A method may comprise measuring an albedo of a surface on which an array of bifacial solar modules is disposed and setting an albedo parameter of a bifacial gain model. The method may further comprise measuring a backside irradiance of the array and setting a backside irradiance parameter. The method may further comprise setting a shed transparency parameter using the measured backside irradiance and a geometric model of the array. The method may further comprise setting a rear shading parameter using a shading model of the array. The method may further comprise computing an expected bifacial gain of the array. The method may further comprise determining an actual bifacial gain of the array. The method may further comprise setting a rear mismatch parameter to minimize a loss function of the expected bifacial gain and the actual bifacial gain.

Abstract: The present disclosure provides systems and methods for improved bifacial solar modeling. A method may comprise measuring an albedo of a surface on which an array of bifacial solar modules is disposed and setting an albedo parameter of a bifacial gain model. The method may further comprise measuring a backside irradiance of the array and setting a backside irradiance parameter. The method may further comprise setting a shed transparency parameter using the measured backside irradiance and a geometric model of the array. The method may further comprise setting a rear shading parameter using a shading model of the array. The method may further comprise computing an expected bifacial gain of the array. The method may further comprise determining an actual bifacial gain of the array. The method may further comprise setting a rear mismatch parameter to minimize a loss function of the expected bifacial gain and the actual bifacial gain.

Abstract: A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.

Abstract: An apparatus for cleaning a substrate. A cleaning chamber contacts the substrate with a cleaning solution. The cleaning solution thereby removes contaminants from the substrate and additionally leaches material from the substrate. A gettering chamber receives the cleaning solution, and includes a surface for chemically attracting the leached material and precipitating the leached material at least in part out of the cleaning solution. By removing the leached copper from the cleaning solution In this manner, the various embodiments of the present invention reduce the amount of copper that is available for plating out of the solvent, and therefore reduces the number and size of nodules that can form on the substrate. Thus, the need for other expensive approaches, like chemical replacement or less effective cleaning solvents, is obviated.