Patents by Inventor Gregory R. Bettencourt
Gregory R. Bettencourt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9314854Abstract: A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 ?m.Type: GrantFiled: January 30, 2013Date of Patent: April 19, 2016Assignee: LAM RESEARCH CORPORATIONInventors: Lihua Li Huang, Duane D. Scott, Joseph P. Doench, Jamie Burns, Emily P. Stenta, Gregory R. Bettencourt, John E. Daugherty
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Patent number: 8796153Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: GrantFiled: March 11, 2013Date of Patent: August 5, 2014Assignee: Lam Research CorporationInventors: Roger Patrick, Gregory R. Bettencourt, Michael C. Kellogg
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Publication number: 20140213061Abstract: A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 ?m.Type: ApplicationFiled: January 30, 2013Publication date: July 31, 2014Applicant: LAM RESEARCH CORPORATIONInventors: Lihua Li Huang, Duane D. Scott, Joseph P. Doench, Jamie Burns, Emily P. Stenta, Gregory R. Bettencourt, John E. Daugherty
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Publication number: 20130337654Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: ApplicationFiled: March 11, 2013Publication date: December 19, 2013Applicant: LAM RESEARCH CORPORATIONInventors: Roger Patrick, Gregory R. Bettencourt, Michael C. Kellogg
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Patent number: 8536071Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: GrantFiled: August 21, 2012Date of Patent: September 17, 2013Assignee: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin, Sandy Chao
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Patent number: 8470127Abstract: A showerhead electrode and assembly useful for plasma etching includes cam locks which provide improved thermal contact between the showerhead electrode and a backing plate. The cam locks include cam shafts in the backing plate which engage enlarged heads of studs mounted on the showerhead electrode. The assembly can include an annular shroud surrounding the showerhead electrode and eight of the cam shafts in the backing plate can be operated such that each cam shaft simultaneously engages a stud on the annular shroud and a stud in an outer row of studs on the showerhead electrode. Another eight cam shafts can be operated such that each cam shaft engages a pair of studs on inner and middle rows of the studs mounted of the showerhead electrode.Type: GrantFiled: January 6, 2011Date of Patent: June 25, 2013Assignee: Lam Research CorporationInventors: Anthony de la Llera, Pratik Mankidy, Rajlnder Dhindsa, Michael C. Kellogg, Gregory R. Bettencourt, Roger Patrick
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Patent number: 8419959Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the showerhead electrode.Type: GrantFiled: September 17, 2010Date of Patent: April 16, 2013Assignee: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng., Sandy Chao, Anthony de la Llera, Pratik Mankidy
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Patent number: 8414719Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: GrantFiled: June 19, 2012Date of Patent: April 9, 2013Assignee: Lam Research CorporationInventors: Roger Patrick, Gregory R. Bettencourt, Michael C. Kellogg
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Publication number: 20130034967Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: ApplicationFiled: August 21, 2012Publication date: February 7, 2013Inventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng., Sandy Chao
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Publication number: 20120258603Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: ApplicationFiled: June 19, 2012Publication date: October 11, 2012Applicant: Lam Research CorporationInventors: Roger Patrick, Gregory R. Bettencourt, Michael C. Kellogg
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Patent number: 8272346Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: GrantFiled: April 10, 2009Date of Patent: September 25, 2012Assignee: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng, Sandy Chao
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Patent number: 8221582Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: GrantFiled: July 7, 2008Date of Patent: July 17, 2012Assignee: Lam Research CorporationInventors: Roger Patrick, Gregory R. Bettencourt, Michael C. Kellogg
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Publication number: 20120175062Abstract: A showerhead electrode and assembly useful for plasma etching includes cam locks which provide improved thermal contact between the showerhead electrode and a backing plate. The cam locks include cam shafts in the backing plate which engage enlarged heads of studs mounted on the showerhead electrode. The assembly can include an annular shroud surrounding the showerhead electrode and eight of the cam shafts in the backing plate can be operated such that each cam shaft simultaneously engages a stud on the annular shroud and a stud in an outer row of studs on the showerhead electrode. Another eight cam shafts can be operated such that each cam shaft engages a pair of studs on inner and middle rows of the studs mounted of the showerhead electrode.Type: ApplicationFiled: January 6, 2011Publication date: July 12, 2012Applicant: Lam Research CorporationInventors: Anthony de la Llera, Pratik Mankidy, Rajinder Dhindsa, Michael C. Kellogg, Gregory R. Bettencourt, Roger Patrick
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Patent number: 8084375Abstract: A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface.Type: GrantFiled: November 2, 2010Date of Patent: December 27, 2011Assignee: Lam Research CorporationInventors: Akira Koshiishi, Sathya Mani, Gautam Bhattacharyya, Gregory R. Bettencourt, Sandy Chao
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Publication number: 20110104884Abstract: A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface.Type: ApplicationFiled: November 2, 2010Publication date: May 5, 2011Applicant: Lam Research CorporationInventors: Akira Koshiishi, Sathya Mani, Gautam Bhattacharyya, Gregory R. Bettencourt, Sandy Chao
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Publication number: 20110070740Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the showerhead electrode.Type: ApplicationFiled: September 17, 2010Publication date: March 24, 2011Applicant: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng., Sandy Chao, Anthony de la Llera, Pratik Mankidy
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Publication number: 20100261354Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: ApplicationFiled: April 10, 2009Publication date: October 14, 2010Applicant: Lam Research CorporationInventors: GREGORY R. BETTENCOURT, Gautam Bhattacharyya, Simon Gosselin Eng, Sandy Chao
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Publication number: 20100003829Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: ApplicationFiled: July 7, 2008Publication date: January 7, 2010Applicant: Lam Research CorporationInventors: Roger Patrick, Gregory R. Bettencourt, Michael C. Kellogg
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Patent number: 7226055Abstract: A substrate holding apparatus is provided. The substrate holding apparatus includes a chuck yoke, a plurality of arm assemblies, and a plurality of gripper assemblies. A first end of each of the arm assemblies is connected to the chuck yoke and each of the arm assemblies has a spring. A second end of each of the arm assemblies is connected to a respective one of the plurality of grippers. The chuck yoke is capable of rotating so as to move each of the plurality of arm assemblies and respective plurality of gripper assemblies into either a closed position or an open position. A compression force from each of the springs is applied to a substrate when the grippers are moved to the closed position.Type: GrantFiled: June 30, 2003Date of Patent: June 5, 2007Assignee: Lam Research CorporationInventors: Gregory R. Bettencourt, Anthony de la Llera, Xuyen N. Pham