Abstract: A process and a device for coating a substrate (22) are described. In a vacuum chamber (10), a first magnetron cathode (24) is provided with a sputtering target (28) of a first metal composition comprising predominantly aluminium. A second magnetron cathode (26) is provided with a sputtering target (30) of a second metal composition comprising at least 50 at-% of a second metal selected from groups IVA-VIA of the periodic table. In order to obtain coatings with improved properties, electrical power is supplied to the cathodes (24, 26) such that the targets (28, 30) are sputtered, where electrical power is supplied to the first cathode (24) as pulsed electrical power according to high power impulse magnetron sputtering with a first peak current density, and to the second cathode (26) with a second peak current density lower than the first peak current density. The substrate (22) is arranged within the vacuum chamber such that particles from the plasma deposit onto the substrate forming a coating.

Abstract: A process and a device for coating a substrate (22) are described. In a vacuum chamber (10), a first magnetron cathode (24) is provided with a sputtering target (28) of a first metal composition comprising predominantly aluminium. A second magnetron cathode (26) is provided with a sputtering target (30) of a second metal composition comprising at least 50 at-% of a second metal selected from groups IVA-VIA of the periodic table. In order to obtain coatings with improved properties, electrical power is supplied to the cathodes (24, 26) such that the targets (28, 30) are sputtered, where electrical power is supplied to the first cathode (24) as pulsed electrical power according to high power impulse magnetron sputtering with a first peak current density, and to the second cathode (26) with a second peak current density lower than the first peak current density. The substrate (22) is arranged within the vacuum chamber such that particles from the plasma deposit onto the substrate forming a coating.

Abstract: An organic electronic device consists of one or more electro-active organic or polymer materials sandwiched between electrodes. Critical in such devices is the interface between the electrode and the polymer, where degradation or chemical reaction products may develop that are deleterious to the proper functioning of the device. This is solved by introducing a functional interlayer composed of one or more materials consisting of a molecular backbone bearing phosphonate or phosphate functions, either directly attached or through side chains, said functional layer being disposed between at least one of the respective electrodes and said one or more electro-active materials in the device.

Abstract: An organic electronic device consists of one or more electro-active organic or polymer materials sandwiched between electrodes. Critical in such devices is the interface between the electrode and the polymer, where degradation or chemical reaction products may develop that are deleterious to the proper functioning of the device. This is solved by introducing a functional interlayer composed of one or more materials consisting of a molecular backbone bearing phosphonate or phosphate functions, either directly attached or through side chains, said functional layer being disposed between at least one of the respective electrodes and said one or more electro-active materials in the device.