Patents by Inventor Gu Won Ji
Gu Won Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20210065983Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.Type: ApplicationFiled: April 21, 2020Publication date: March 4, 2021Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Tae Hoon Kim, Gu Won Ji
-
Patent number: 10879000Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrode disposed on first and second external surfaces of the ceramic body to be electrically connected to the first and second internal electrodes, respectively, and an interposer including an insulating body having first and second recess regions and first and second terminal electrodes. The first and second recess regions are disposed in a central region of the insulating body in a width direction. A/B is within a range from 0.14 or more to 0.51 or less, where A is an area of each of the first and second recess regions, viewed in a cross-section in length and width directions, and B is an area of each of the first and second terminal electrodes, viewed in the cross-section in the length and width directions.Type: GrantFiled: December 7, 2018Date of Patent: December 29, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gu Won Ji, Ho Yoon Kim, Heung Kil Park, Sang Soo Park, Woo Chul Shin
-
Patent number: 10840022Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed in a width direction. The capacitor body has first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively. First and second external electrodes are disposed on the third and fourth surfaces and extend to portions of the first surface. A first connection terminal and a second connection terminal are disposed to be respectively connected to be connected to the first and second external electrodes, and each has a shape including at least one indentation in a rectangular outline within which the respective connection terminal is inscribed.Type: GrantFiled: November 6, 2018Date of Patent: November 17, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Gu Won Ji, Heung Kil Park, Young Ghyu Ahn, Se Hun Park
-
Patent number: 10777356Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.Type: GrantFiled: November 30, 2018Date of Patent: September 15, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji, Young Ghyu Ahn
-
Patent number: 10658118Abstract: An electronic component includes a capacitor body, and first and second external electrodes disposed and spaced apart from each other on a mounting surface of the capacitor body. The electronic component further includes first and second connection terminals respectively connected to the first and second external electrodes and having first and second cutouts, respectively. The electronic component also includes a first plating layer covering the first external electrode and the first connection terminal, and a second plating layer covering the second external electrode and the second connection terminal.Type: GrantFiled: November 16, 2018Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji
-
Patent number: 10650970Abstract: A multilayer electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed between each pair of first and second internal electrodes, the capacitor body having third and fourth surfaces opposing each other, an end of each the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; and first and second connection terminals connected to the first and second external electrodes, respectively, wherein each of the first and second connection terminals includes a vertical portion disposed to face the external electrode, a horizontal portion extended from a lower end of the vertical portion, and a cut portion formed in a portion connecting the vertical portion and the horizontal portion to each other.Type: GrantFiled: November 15, 2017Date of Patent: May 12, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Gu Won Ji
-
Publication number: 20200135402Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, having first to sixth surfaces, and including one ends of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; first and second external electrodes respectively including first and second head portions, and first and second band portions; a first connection terminal having conductive portions disposed on both ends thereof and connected to the first and second band portions, respectively; and a second connection terminal having conductive portions on both ends thereof and connected to the first and second band portions, respectively. The second connection terminal is spaced apart from the first connection terminal in a direction connecting the fifth and sixth surfaces.Type: ApplicationFiled: August 27, 2019Publication date: April 30, 2020Inventors: Se Hun Park, Heung Kil Park, Gu Won Ji
-
Publication number: 20200118745Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrode disposed on first and second external surfaces of the ceramic body to be electrically connected to the first and second internal electrodes, respectively, and an interposer including an insulating body having first and second recess regions and first and second terminal electrodes. The first and second recess regions are disposed in a central region of the insulating body in a width direction. A/B is within a range from 0.14 or more to 0.51 or less, where A is an area of each of the first and second recess regions, viewed in a cross-section in length and width directions, and B is an area of each of the first and second terminal electrodes, viewed in the cross-section in the length and width directions.Type: ApplicationFiled: December 7, 2018Publication date: April 16, 2020Inventors: Gu Won JI, Ho Yoon KIM, Heung Kil PARK, Sang Soo PARK, Woo Chul SHIN
-
Patent number: 10614960Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.Type: GrantFiled: January 30, 2019Date of Patent: April 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Se Hun Park, Gu Won Ji, Heung Kil Park
-
Patent number: 10566137Abstract: A multilayer electronic component includes: a capacitor body including an active region including first and second internal electrodes and upper and lower cover regions; first and second external electrodes including first and second connected portions connected to the first and second internal electrodes and first and second band portions, respectively; and first and second bump terminals having conductive layers and disposed on the first and second band portions, respectively, wherein BW/3?G?BW and T/5<ET<T/2, where BW is a width of each of the first and second band portions, T is a thickness of each of the first and second connected portions, G is a width of each of the first and second bump terminals, and ET is a thickness of each of the first and second bump terminals.Type: GrantFiled: December 28, 2017Date of Patent: February 18, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Se Hun Park, Gu Won Ji, Heung Kil Park
-
Publication number: 20200051746Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes, and having first to sixth surfaces; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second connection terminals disposed on the first and second band portions on the first surface of the capacitor body. The first and second connection terminals are each provided with a solder receiving portion to have a symmetrical shape in a direction connecting the third and fourth surfaces and a direction connecting the fifth and sixth surfaces.Type: ApplicationFiled: June 14, 2019Publication date: February 13, 2020Inventors: Heung Kil PARK, Se Hun PARK, Gu Won JI
-
Publication number: 20190378656Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed in a width direction. The capacitor body has first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively. First and second external electrodes are disposed on the third and fourth surfaces and extend to portions of the first surface. A first connection terminal and a second connection terminal are disposed to be respectively connected to be connected to the first and second external electrodes, and each has a shape including at least one indentation in a rectangular outline within which the respective connection terminal is inscribed.Type: ApplicationFiled: November 6, 2018Publication date: December 12, 2019Inventors: Won Chul SIM, Gu Won JI, Heung Kil PARK, Young Ghyu AHN, Se Hun PARK
-
Publication number: 20190341189Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on both ends of the capacitor body in a length direction; and first and second connection terminals disposed on a mounting surface of the capacitor body and electrically connected to the first and second external electrodes, respectively, and having first and second cut portions on surfaces facing each other in the length direction of the capacitor body, respectively.Type: ApplicationFiled: November 16, 2018Publication date: November 7, 2019Inventors: Heung Kil PARK, Gu Won JI, Se Hun PARK, Young Ghyu AHN
-
Publication number: 20190335588Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1?G/CT?0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.Type: ApplicationFiled: July 10, 2019Publication date: October 31, 2019Inventors: Heung Kil PARK, Gu Won JI, Se Hun PARK
-
Patent number: 10460875Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.Type: GrantFiled: March 21, 2019Date of Patent: October 29, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Jae Yeol Choi, Young Ghyu Ahn, Soo Hwan Son, Se Hun Park, Gu Won Ji
-
Publication number: 20190326059Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.Type: ApplicationFiled: November 30, 2018Publication date: October 24, 2019Inventors: Heung Kil PARK, Se Hun PARK, Gu Won JI, Young Ghyu AHN
-
Publication number: 20190326060Abstract: A composite electronic component includes a multilayer ceramic capacitor including a ceramic body configured by stacking a plurality of dielectric layers and configured by stacking a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween and first and second external electrodes disposed on opposing end portions of the ceramic body, and a pair of substrates spaced apart from a lower portion of the multilayer ceramic capacitor and each including, on opposing end portions, first terminal electrodes connected to the first external electrode and second terminal electrodes connected to the second external electrode.Type: ApplicationFiled: November 28, 2018Publication date: October 24, 2019Inventors: Heung Kil PARK, Se Hun PARK, Gu Won JI
-
Patent number: 10453616Abstract: A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.Type: GrantFiled: July 30, 2018Date of Patent: October 22, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Se Hun Park, Gu Won Ji, Heung Kil Park
-
Patent number: 10438748Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.Type: GrantFiled: January 15, 2019Date of Patent: October 8, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gu Won Ji, Heung Kil Park, Se Hun Park
-
Patent number: 10398030Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1?G/CT?0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.Type: GrantFiled: May 23, 2018Date of Patent: August 27, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Gu Won Ji, Se Hun Park