Patents by Inventor Guan Keng Quah
Guan Keng Quah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080054420Abstract: In one embodiment, a semiconductor package includes a lead frame having a lead portion and pad portion that are offset with respect to each other. The lead portion includes a deep formed impression. An up-bent portion connects the lead portion to the pad portion.Type: ApplicationFiled: August 23, 2006Publication date: March 6, 2008Inventors: Guan Keng Quah, Hou Boon Tan, Qiang Hua Pan
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Patent number: 7144538Abstract: A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.Type: GrantFiled: June 26, 2003Date of Patent: December 5, 2006Assignee: Semiconductor Components Industries, LLCInventors: Yeu Wen Lee, Chuan Kiak Ng, Guan Keng Quah
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Patent number: 7098051Abstract: A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and remainder of the bond wire is removed. Locations (23) for attaching the wire bond ball are recorded with reference to fiducials (5) on the lead frame. The encapsulation covers the die, deposits and die attach flag (24) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings (17) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.Type: GrantFiled: May 25, 2004Date of Patent: August 29, 2006Assignee: Semiconductor Components Industries, L.L.C.Inventor: Guan Keng Quah
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Patent number: 6852574Abstract: A method of forming a leadframe (10) provides blocking fulcrums (21,23) adjacent to the leads (12,13,14, and 15). During the process of encapsulating the leadframe (10), the blocking fulcrums (21,23) restrict encapsulating material from exiting the mold cavity and from attaching to the leads (12,13,14, and 15).Type: GrantFiled: August 11, 2003Date of Patent: February 8, 2005Assignee: Semiconductor Components Industries, L.L.C.Inventors: Guan Keng Quah, Darrell D. Truhitte
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Publication number: 20040262811Abstract: A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.Type: ApplicationFiled: June 26, 2003Publication date: December 30, 2004Applicant: Semiconductor Components Industries, LLCInventors: Yeu Wen Lee, Chuan Kiak Ng, Guan Keng Quah
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Publication number: 20040266037Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).Type: ApplicationFiled: June 26, 2003Publication date: December 30, 2004Applicant: Semiconductor Components Industries, LLC.Inventors: James Knapp, Kok Yang Lau, Beng Lian Lim, Guan Keng Quah
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Patent number: 6835580Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).Type: GrantFiled: June 26, 2003Date of Patent: December 28, 2004Assignee: Semiconductor Components Industries, L.L.C.Inventors: James Knapp, Kok Yang Lau, Beng Lian Lim, Guan Keng Quah
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Publication number: 20040219718Abstract: A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and remainder of the bond wire is removed. Locations (23) for attaching the wire bond ball are recorded with reference to fiducials (5) on the lead frame. The encapsulation covers the die, deposits and die attach flag (24) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings (17) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.Type: ApplicationFiled: May 25, 2004Publication date: November 4, 2004Inventor: Guan Keng Quah
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Patent number: 6787392Abstract: A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and remainder of the bond wire is removed. Locations (23) for attaching the wire bond ball are recorded with reference to fiducials (5) on the lead frame. The encapsulation covers the die, deposits and die attach flag (24) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings (17) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.Type: GrantFiled: September 9, 2002Date of Patent: September 7, 2004Assignee: Semiconductor Components Industries, L.L.C.Inventor: Guan Keng Quah
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Publication number: 20040048413Abstract: A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and remainder of the bond wire is removed. Locations (23) for attaching the wire bond ball are recorded with reference to fiducials (5) on the lead frame. The encapsulation covers the die, deposits and die attach flag (24) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings (17) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.Type: ApplicationFiled: September 9, 2002Publication date: March 11, 2004Applicant: Semiconductor Components Industries, LLC.Inventor: Guan Keng Quah