Patents by Inventor GUANG-LI SONG
GUANG-LI SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240188375Abstract: A sensor package and a display device are provided. The sensor package is disposed inside the display device. The sensor package includes a substrate, a plurality of sensor elements, a shielding cover, a first polarizer, and a second polarizer. The plurality of sensor elements and the shielding cover are disposed on the substrate. The shielding cover covers the plurality of sensor elements. When light passes through the first polarizer, the light forms a first polarized light beam. When another light passes through the second polarizer, the another light forms a second polarized light beam. A first polarization direction of the first polarizer is different from a second polarization direction of the second polarizer.Type: ApplicationFiled: November 28, 2023Publication date: June 6, 2024Inventors: GUANG-LI SONG, WUI-PIN LEE, SIN-HENG LIM, RUI-TAO ZHENG, MON-OO WIN
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Publication number: 20240102854Abstract: A sensor package includes a substrate, a light sensor disposed on the substrate, at least one optical filter disposed on the light sensor, and an optical functional layer that is light-permeable, is disposed on the substrate, covers the light sensor and the optical filter, and includes multiple light-scattering particles. The light sensor has a light receiving region, and receives light through the light receiving region. The optical filter covers the light receiving region. When the light passes through the optical filter within an incident angle range and is received by the light receiving region, the light sensor responds to a wavelength range of the light, and a response spectrum is obtained. Within the incident angle range, an absolute value of an offset measured at a crest of a waveform of the response spectrum is less than or equal to 10 nm. An electronic device is also provided.Type: ApplicationFiled: September 27, 2023Publication date: March 28, 2024Inventors: RUI-TAO ZHENG, HENG-CHANG CHEN, GUANG-LI SONG, WUI-PIN LEE, SIN-HENG LIM
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Patent number: 11765528Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.Type: GrantFiled: September 28, 2020Date of Patent: September 19, 2023Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Guang-Li Song, Suresh Basoor Nijaguna, Qian Pang
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Patent number: 11444219Abstract: A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.Type: GrantFiled: September 30, 2020Date of Patent: September 13, 2022Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Guang-Li Song, Wei-Chee Lee, Qian Pang
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Publication number: 20220102575Abstract: A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.Type: ApplicationFiled: September 30, 2020Publication date: March 31, 2022Inventors: GUANG-LI SONG, WEI-CHEE LEE, QIAN PANG
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Publication number: 20220103954Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.Type: ApplicationFiled: September 28, 2020Publication date: March 31, 2022Inventors: GUANG-LI SONG, Suresh Basoor Nijaguna, QIAN PANG
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Patent number: 11073615Abstract: A proximity sensor module with two sensors, including a package housing, a circuit substrate, an light emitter and a sensing assembly. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure, and a second accommodation space defined by the second package structure and the partition structure. The light emitter is arranged in the first accommodating space and is disposed on the circuit substrate. The sensing assembly includes a first sensor and a second sensor. The first sensor and the second sensor are arranged in the second accommodating space, and the first sensor is farther from the light emitter than the second sensor.Type: GrantFiled: August 20, 2018Date of Patent: July 27, 2021Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Seng-Yee Chua, Arakcre Dinesh Gopalaswamy, Guang-Li Song
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Patent number: 10847672Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a sensing assembly and a transmitter unit. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing and includes a first transmitter and a second transmitter both disposed on the circuit board. One of the first transmitter and the second transmitter is closer to the sensing assembly.Type: GrantFiled: December 31, 2019Date of Patent: November 24, 2020Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Seng-Yee Chua, Guang-Li Song, Tong-Tee Tan
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Publication number: 20200150270Abstract: An infrared proximity sensor includes a substrate, an emitting unit, a receiving unit, a packaging unit and an isolating unit. The substrate has a supporting surface and the supporting surface has an emitting region and a receiving region corresponding in position to the emitting region. The emitting unit is disposed on the emitting region. The receiving unit is disposed on the receiving region. The packaging unit includes a first package body and a second package body. The first package body covers the emitting unit and the second package body covers the receiving unit. The isolating unit is disposed between the first package body and the second package body. The substrate has a first side and a second side, and the first side has a length less than 1.5 mm.Type: ApplicationFiled: June 10, 2019Publication date: May 14, 2020Inventors: TECK-CHAI GOH, Wei-Chee Lee, GUANG-LI SONG, LAY-THANT KO, SIN-HENG LIM
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Publication number: 20200152818Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a sensing assembly and a transmitter unit. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing and includes a first transmitter and a second transmitter both disposed on the circuit board. One of the first transmitter and the second transmitter is closer to the sensing assembly.Type: ApplicationFiled: December 31, 2019Publication date: May 14, 2020Inventors: SENG-YEE CHUA, GUANG-LI SONG, TONG-TEE TAN
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Publication number: 20200111931Abstract: A manufacturing method of wafer level sensing module includes: providing a chip substrate formed with a first receptor and a second receptor; disposing an emitter on the chip substrate; disposing a shielding assembly on the top surface of the chip substrate; and disposing a transparent shielding plate on the top surface of the chip substrate and in positional correspondence with the second receptor. The first lens is connected between the first shielding member and the second shielding member, and the emitter is arranged in a first space defined by the first shielding member, the first lens, the second shielding member, and the chip substrate. The second lens is connected between the second shielding member and the third shielding member, and the first receptor is arranged in a second space defined by the second shielding member, the second lens, the third shielding member, and the chip substrate.Type: ApplicationFiled: December 9, 2019Publication date: April 9, 2020Inventors: TECK-CHAI GOH, SIN-HENG LIM, GUANG-LI SONG
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Patent number: 10608135Abstract: The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.Type: GrantFiled: August 30, 2018Date of Patent: March 31, 2020Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Teck-Chai Goh, Sin-Heng Lim, Guang-Li Song
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Publication number: 20200057158Abstract: A proximity sensor module with two sensors, including a package housing, a circuit substrate, an light emitter and a sensing assembly. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure, and a second accommodation space defined by the second package structure and the partition structure. The light emitter is arranged in the first accommodating space and is disposed on the circuit substrate. The sensing assembly includes a first sensor and a second sensor. The first sensor and the second sensor are arranged in the second accommodating space, and the first sensor is farther from the light emitter than the second sensor.Type: ApplicationFiled: August 20, 2018Publication date: February 20, 2020Inventors: SENG-YEE CHUA, ARAKCRE DINESH GOPALASWAMY, GUANG-LI SONG
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Patent number: 10559708Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a transmitter unit and a sensing assembly. The transmitter unit includes a first transmitter and a second transmitter. The first transmitter and the second transmitter are disposed on the circuit board. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing. One of the first transmitter and the second transmitter is nearer to the sensing assembly than the other one is.Type: GrantFiled: August 20, 2018Date of Patent: February 11, 2020Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Seng-Yee Chua, Guang-Li Song, Tong-Tee Tan
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Publication number: 20190341518Abstract: A proximity sensing module with dual transmitters includes a circuit board, a package housing, a transmitter unit and a sensing assembly. The transmitter unit includes a first transmitter and a second transmitter. The first transmitter and the second transmitter are disposed on the circuit board. The sensing assembly includes a sensor disposed on the circuit board. The transmitter unit is shielded from the sensing assembly through the package housing. One of the first transmitter and the second transmitter is nearer to the sensing assembly than the other one is.Type: ApplicationFiled: August 20, 2018Publication date: November 7, 2019Inventors: SENG-YEE CHUA, GUANG-LI SONG, TONG-TEE TAN
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Publication number: 20190237612Abstract: The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.Type: ApplicationFiled: August 30, 2018Publication date: August 1, 2019Inventors: TECK-CHAI GOH, SIN-HENG LIM, GUANG-LI SONG
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Patent number: 10107911Abstract: A proximity sensor and a mobile device using the same are provided. The proximity sensor includes a circuit board, an emitter package, a receiver package, a plastic casing and a lens. The emitter package is disposed on the circuit board and includes an emitter and an emitter housing. The receiver package is disposed on the circuit board and includes a receiver and a receiver housing. The plastic casing covers the emitter package and the receiver package. The plastic casing includes a first opening corresponding to the emitter package and a second opening corresponding to the receiver package. The first opening has a first geometric centerline and the second opening has a second geometric centerline. The height of the emitter package is smaller than that of the receiver package, and the emitter is disposed between the first geometric centerline and the second geometric centerline.Type: GrantFiled: October 26, 2017Date of Patent: October 23, 2018Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Teck-Chai Goh, Sin-Heng Lim, Guang-Li Song, Arakcre Dinesh Gopalaswamy
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Patent number: 9704837Abstract: A detection device and a method of manufacturing the same are disclosed. The detection device includes a detection module and a housing module disposed on the detection module. The detection module includes a substrate, an emission unit, and a detection unit. The substrate includes an emission end area on which the emission unit is disposed, and a receiver end area on which the detection unit is disposed. The housing module includes a plastic housing unit having a receiving space and an opening, and a metallic shielding unit disposed on the plastic housing unit. The receiving space is divided into a first receiving space and a second receiving space by the metallic shielding unit, and the opening is divided into an emission hole and a detection hole by the metallic shielding unit. By the above-mentioned means, the distance between the emission hole and the detection hole is reduced.Type: GrantFiled: August 31, 2016Date of Patent: July 11, 2017Assignee: LITE-ON SINGAPORE PTE. LTD.Inventors: Teck-Chai Goh, Sin-Heng Lim, Guang-Li Song
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Publication number: 20140223734Abstract: The instant disclosure relates to a method of manufacturing proximity sensor includes the steps of providing a substrate having emitters and detectors disposed thereon. A sensor area is defined by one emitter with the adjacent detector. Wire bonding the emitters and detectors to the substrate for electrical connection. Molding a plurality of housings corresponds to each of the sensor areas and encapsulates the emitters and detectors. A shield having a plurality of apertures is provided and disposed atop the housings. After injection molding, an isolation layer is formed between the shield and substrate. Singulation is followed by injection molding to separate each of the sensor areas.Type: ApplicationFiled: February 9, 2013Publication date: August 14, 2014Applicant: LITE-ON SINGAPORE PTE. LTD.Inventors: GUANG-LI SONG, SIN-HENG LIM, TECK-CHAI GOH