Patents by Inventor Guang-Sheng Lin

Guang-Sheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943877
    Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: March 26, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang, Guang-Hwa Ma, Tzyy-Jang Tseng
  • Patent number: 11935878
    Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: March 19, 2024
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Hsiu-Mei Yu, Guang-Yuan Jiang, Cheng-Yi Hsieh, Wei-Chan Chang, Chang-Sheng Lin
  • Patent number: 8037649
    Abstract: A step assembly that is specifically adapted to assist pets in reaching and/or descending from elevated surfaces is provided. The step assembly has two sidewalls having a plurality of openings in which pegs formed on the sides of individual treads and risers are engaged. The pegs are removably insertable into the openings and include protrusions which create an interference fit upon insertion. Because the treads, risers and side walls are joined by interlocking pegs and openings, the step assembly can be flat packed for shipping, and is easily assembled and disassembled for transportation and/or cleaning.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: October 18, 2011
    Assignee: Vermont Juvenile Furniture Mfg., Inc.
    Inventors: Chris Jakubowski, Scott S. Jakubowski, Todd M. Jakubowski, Guang-Sheng Lin
  • Publication number: 20080257280
    Abstract: A step assembly that is specifically adapted to assist pets in reaching and/or descending from elevated surfaces is provided. The step assembly has two sidewalls having a plurality of openings in which pegs formed on the sides of individual treads and risers are engaged. The pegs are removably insertable into the openings and include protrusions which create an interference fit upon insertion. Because the treads, risers and side walls are joined by interlocking pegs and openings, the step assembly can be flat packed for shipping, and is easily assembled and disassembled for transportation and/or cleaning.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 23, 2008
    Applicant: Vermont Juvenile Furniture Mfg., Inc. d/b/a Pet Gear, Inc.
    Inventors: Chris Jakubowski, Scott S. Jakubowski, Todd M. Jakubowski, Guang-Sheng Lin
  • Patent number: D599062
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: August 25, 2009
    Assignee: Vermont Juvenile Furniture Mfg., Inc.
    Inventors: Todd J. Jakubowski, Scott J. Jakubowski, Chris Jakubowski, Guang-Sheng Lin
  • Patent number: D611201
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: March 2, 2010
    Assignee: Vermont Juvenile Furniture Mfg. Inc.
    Inventors: Todd M. Jakubowski, Scott S. Jakubowski, Chris Jakubowski, Guang-Sheng Lin
  • Patent number: D611202
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: March 2, 2010
    Assignee: Vermont Juvenile Furniture Mfg., Inc.
    Inventors: Todd M. Jakubowski, Scott S. Jakubowski, Chris Jakubowski, Guang-Sheng Lin
  • Patent number: D622009
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: August 17, 2010
    Assignee: Vermont Juvenile Furniture Mfg., Inc.
    Inventors: Todd M. Jakubowski, Scott S. Jakubowski, Chris Jakubowski, Guang-Sheng Lin
  • Patent number: D622010
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: August 17, 2010
    Assignee: Vermont Juvenile Furniture Mfg., Inc.
    Inventors: Todd M. Jakubowski, Scott S. Jakubowski, Chris Jakubowski, Guang-Sheng Lin