Patents by Inventor Guen-Ho Kim

Guen-Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device package including a substrate having at least two recessed surfaces
    Patent number: 8878229
    Abstract: Disclosed is a light emitting device package. The light emitting device package includes a substrate including a recess, a light emitting chip on the substrate and a first conductive layer electrically connected to the light emitting chip. And the first conductive layer includes at least one metal layer electrically connected to the light emitting chip on an outer circumference of the substrate.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: November 4, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Guen-Ho Kim, Yu Ho Won