Abstract: An apparatus for processing a substrate includes a housing, a support unit that supports the substrate in the housing, a nozzle that dispenses a processing liquid onto the substrate, and a liquid supply unit that supplies the processing liquid to the nozzle. The liquid supply unit includes a container having a storage space in which the processing liquid is stored, a liquid supply tube through which the processing liquid flows from the container to the nozzle, and an ultrasonic-wave application member that applies ultrasonic waves to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic-wave application member includes a liquid reservoir having an interior space in which a liquid is received and an ultrasonic generator that applies ultrasonic waves to the liquid received in the liquid reservoir. Part of the liquid supply tube is immersed in the liquid received in the liquid reservoir.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a batch-type treating bath for treating a substrate in a batch-type manner; a single-type treating chamber for treating the substrate in a single-type manner; and a buffer chamber positioned on a transfer path of the substrate transferred between the batch-type treating bath and the single-type treating chamber, and supplying a liquid for maintaining a wetting state of the substrate.

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space for treating the substrate; a fluid supply unit for supplying fluid to the treatment space, wherein the fluid supply unit includes: a supply pipe connected to the treatment space to supply the fluid to the treatment space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to an outside; a relief valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point wherein the vent line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than a cross-sectional area of a portion of the supply pipe located between the pump and the branch point.

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

Abstract: An apparatus for supporting a substrate includes a rotatable spin head that supports the substrate, a hollow shaft that is connected with the spin head and that transmits torque to the spin head, a nozzle assembly that is disposed in an interior space of the spin head so as not to rotate and that supplies a treatment liquid to a backside of the substrate, and a sealing member that seals a gap between the spin head and the nozzle assembly using a magnetic fluid.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first process treating unit configured to treat a substrate in a single-type method; a second process treating unit configured to treat a substrate in a batch-type method; and a posture changing unit provided between the first process treating unit and the second process treating unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process treating unit.

Abstract: The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath having an accommodation space for accommodating a treating liquid; a support member configured to support at least one substrate in a vertical posture at the accommodation space; and a posture changing robot configured to change a posture of a substrate immersed in the treating liquid from the vertical posture to a horizontal posture, and wherein the posture changing robot comprises: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

Abstract: A method for treating a substrate is provided. The method includes supplying a first treating liquid to a treating target surface of the substrate while the substrate is rotating, and subsequently, supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the substrate while an evaporation inhibiting agent in a vapor state is present around the first treating liquid supplied to the substrate, such that the first treating liquid on the substrate is substituted with the second treating liquid. Thus, a vapor atmosphere may be formed around a cleaning liquid applied to the substrate. Thus, a liquid-film destroying phenomenon may be prevented in a procedure in which the cleaning liquid is replaced with an organic solvent.

Abstract: An apparatus for processing a substrate includes a housing, a support unit that supports the substrate in the housing, a nozzle that dispenses a processing liquid onto the substrate, and a liquid supply unit that supplies the processing liquid to the nozzle. The liquid supply unit includes a container having a storage space in which the processing liquid is stored, a liquid supply tube through which the processing liquid flows from the container to the nozzle, and an ultrasonic-wave application member that applies ultrasonic waves to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic-wave application member includes a liquid reservoir having an interior space in which a liquid is received and an ultrasonic generator that applies ultrasonic waves to the liquid received in the liquid reservoir. Part of the liquid supply tube is immersed in the liquid received in the liquid reservoir.

Abstract: The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space for treating the substrate; a fluid supply unit for supplying fluid to the treatment space, wherein the fluid supply unit includes: a supply pipe connected to the treatment space to supply the fluid to the treatment space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to an outside; a relief valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point wherein the vent line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than a cross-sectional area of a portion of the supply pipe located between the pump and the branch point.

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

Abstract: An apparatus for supporting a substrate includes a rotatable spin head that supports the substrate, a hollow shaft that is connected with the spin head and that transmits torque to the spin head, a nozzle assembly that is disposed in an interior space of the spin head so as not to rotate and that supplies a treatment liquid to a backside of the substrate, and a sealing member that seals a gap between the spin head and the nozzle assembly using a magnetic fluid.

Abstract: A substrate treatment apparatus of The present disclosure includes: a tube connecting a storage tank in which a chemical liquid is stored and an outlet through which the chemical liquid is discharged; a venturi nozzle installed in the tube and including a chemical liquid discharge part configured to discharge to an object; and a first negative pressure control valve installed between the venturi nozzle and the outlet in the tube, wherein, when the first negative pressure control valve is opened, negative pressure is generated in the venturi nozzle to limit discharge of the chemical liquid from the chemical liquid discharge part.

Abstract: A method for treating a substrate is provided. The method includes supplying a first treating liquid to a treating target surface of the substrate while the substrate is rotating, and subsequently, supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the substrate while an evaporation inhibiting agent in a vapor state is present around the first treating liquid supplied to the substrate, such that the first treating liquid on the substrate is substituted with the second treating liquid. Thus, a vapor atmosphere may be formed around a cleaning liquid applied to the substrate. Thus, a liquid-film destroying phenomenon may be prevented in a procedure in which the cleaning liquid is replaced with an organic solvent.

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.