Abstract: In integrated circuit packages, core vias are created to provide electrical connections between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods for forming a via in a packaging substrate and packaging substrates having core vias formed in the core substrate material. Methods for forma a core via in a packaging substrate in which a first hole is created through the core substrate and filled with a low permittivity filler material. A second co-axially aligned hole is then created in the low permittivity filler material wherein the second hole is smaller in diameter than the first hole. The second hole is then filled with conducting material to provide a conducting via through the core substrate material.

Abstract: In integrated circuit packages, core vias are created to provide electrical connections between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods for forming a via in a packaging substrate and packaging substrates having core vias formed in the core substrate material. Methods for forma a core via in a packaging substrate in which a first hole is created through the core substrate and filled with a low permittivity filler material. A second co-axially aligned hole is then created in the low permittivity filler material wherein the second hole is smaller in diameter than the first hole. The second hole is then filled with conducting material to provide a conducting via through the core substrate material.

Abstract: A package may include a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.

Abstract: A self-similar multiband reconfigurable antenna includes a planar antenna structure formed on a surface of a substrate, the antenna structure including symmetrically opposed self-similar geometry antenna arms defining a self-similar or Sierpinski gasket configuration for each arm of the antenna. MEMS type switches are provided for operatively connecting adjacent antenna patches on each arm of the antenna configuration, and a voltage source is provided for selectively actuating the switches. Selective actuation of the switches enables up to four different antenna configurations each having a different resonant frequency, and wherein each resonant frequency demonstrates a similar radiation pattern.

Abstract: A self-similar multiband reconfigurable antenna includes a planar antenna structure formed on a surface of a substrate, the antenna structure including symmetrically opposed self-similar geometry antenna arms defining a self-similar or Sierpinski gasket configuration for each arm of the antenna. MEMS type switches are provided for operatively connecting adjacent antenna patches on each arm of the antenna configuration, and a voltage source is provided for selectively actuating the switches. Selective actuation of the switches enables up to four different antenna configurations each having a different resonant frequency, and wherein each resonant frequency demonstrates a similar radiation pattern.

Abstract: Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first surface. The electronic assembly also includes at least one RF front-end module coupled to the first surface of the substrate, and a ground plane layer positioned on the second surface of the substrate. The electronic assembly also includes an insulating layer on the ground plane layer, with the ground plane layer positioned between the second surface and the insulating layer. In addition, the electronic assembly also includes an antenna layer on the insulating layer, with the insulating layer positioned between the antenna layer and the ground plane layer.

Abstract: Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first surface. The electronic assembly also includes at least one RF front-end module coupled to the first surface of the substrate, and a ground plane layer positioned on the second surface of the substrate. The electronic assembly also includes an insulating layer on the ground plane layer, with the ground plane layer positioned between the second surface and the insulating layer. In addition, the electronic assembly also includes an antenna layer on the insulating layer, with the insulating layer positioned between the antenna layer and the ground plane layer.

Abstract: A package may comprise a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.