Abstract: An electronic device is provided to include a semiconductor memory including a variable resistance element. The variable resistance element may include a variable resistance pattern including a first electrode layer, a variable resistance layer, and a second electrode layer that are sequentially stacked; and a switching assist structure spaced from a side wall of the variable resistance pattern to surround the variable resistance pattern and including multilayered conductive structures that are vertically spaced from one another.

Abstract: Disclosed are electronic devices comprising a semiconductor memory unit capable of reducing the switching current of a variable resistance element for switching between different resistance states. One implementation of a disclosed electronic device may include a first magnetic layer having an easy magnetization axis in a first direction and having a variable magnetization direction, a third magnetic layer having a magnetization direction pinned in the first direction, a second magnetic layer interposed between the first magnetic layer and the third magnetic layer, and having a magnetization direction pinned in a second direction different from the first direction, a tunnel barrier layer interposed between the first magnetic layer and the second magnetic layer, and a non-magnetic layer interposed between the second magnetic layer and the third magnetic layer.

Abstract: An electronic device is provided to include a semiconductor memory that includes: a substrate including a first region and a second region different from the first region; an interlayer dielectric layer formed over the substrate; a first conductive pattern located over the first region and formed in the interlayer dielectric layer, the first conductive pattern including a planarized top surface with a top surface of the interlayer dielectric layer; a second conductive pattern located over the second region and formed in the interlayer dielectric layer, the second conductive pattern including at least a portion recessed below a top surface of the interlayer dielectric layer; a variable resistance pattern formed over the interlayer dielectric layer the variable resistance pattern having a bottom surface coupled to the first conductive pattern and exhibiting different resistance values; and a capping layer pattern formed over the variable resistance pattern.

Abstract: Disclosed are an electronic device comprising a semiconductor memory and a method for fabricating the same, which enable the characteristics of a variable resistance element to be improved. The electronic device includes a semiconductor memory. The semiconductor memory includes a variable resistance element including a stack of a pinned layer, a tunnel barrier layer and a variable layer. The variable layer may include a material layer having a standard electrode potential higher than that of Fe. According to the electronic device including the semiconductor memory and the method for fabricating the same according to the implementation of the disclosed technology, the characteristics of the variable resistance element may be improved.

Abstract: Provided is an electronic device including a semiconductor memory. The semiconductor memory may include: an under layer including first and second metal layers and a barrier layer having a dual phase structure of different crystal structures and interposed between the first and second metal layers; a first magnetic layer positioned over the under layer and having a variable magnetization direction; a tunnel barrier layer positioned over the first magnetic layer; and a second magnetic layer positioned over the tunnel barrier layer and having a pinned magnetization direction, and the under layer may further include a barrier layer having a dual phase structure between the first and second metal layers.

Abstract: This technology provides an electronic device and a method for fabricating the same. An electronic device in accordance with an implementation of this document includes semiconductor memory, and the semiconductor memory includes an interlayer dielectric layer formed over a substrate and having a hole; a conductive pattern filled in the hole and having a top surface located at a level substantially same as a top surface of the interlayer dielectric layer; and an MTJ (Magnetic Tunnel Junction) structure formed over the conductive pattern to be coupled to the conductive pattern and including a free layer having a variable magnetization direction, a pinned layer having a pinned magnetization direction and a tunnel barrier layer interposed between the free layer and the pinned layer, wherein an upper portion of the conductive pattern includes a first amorphous region.

Abstract: Disclosed are electronic devices comprising a semiconductor memory unit capable of reducing the switching current of a variable resistance element for switching between different resistance states. One implementation of a disclosed electronic device may include a first magnetic layer having an easy magnetization axis in a first direction and having a variable magnetization direction, a third magnetic layer having a magnetization direction pinned in the first direction, a second magnetic layer interposed between the first magnetic layer and the third magnetic layer, and having a magnetization direction pinned in a second direction different from the first direction, a tunnel barrier layer interposed between the first magnetic layer and the second magnetic layer, and a non-magnetic layer interposed between the second magnetic layer and the third magnetic layer.

Abstract: According to one embodiment, a magnetic memory includes a first magnetic layer, a second magnetic layer, a non-magnetic intermediate layer provided between the first magnetic layer and the second magnetic layer and an underlying layer provided on an opposite side of the first magnetic layer with respect to the intermediate layer, and the underlying layer contains AlN of a hcp structure.

Abstract: An electronic device includes semiconductor memory, the semiconductor memory including an under layer; a first magnetic layer located over the under layer and having a variable magnetization direction; a tunnel barrier layer located over the first magnetic layer; and a second magnetic layer located over the tunnel barrier layer and having a pinned magnetization direction, wherein the under layer includes a first metal nitride layer having a NaCl crystal structure and a second metal nitride layer containing a light metal.

Abstract: This technology provides an electronic device. An electronic device in accordance with an implementation of this document includes semiconductor memory, and the semiconductor memory includes a first magnetic layer having a variable magnetization direction; a second magnetic layer having a pinned magnetization direction; and a tunnel barrier layer interposed between the first magnetic layer and the second magnetic layer, wherein the second magnetic layer includes a ferromagnetic material with molybdenum (Mo) added thereto.

Abstract: An electronic device includes a semiconductor memory, wherein the semiconductor memory includes: a seed layer including conductive hafnium silicate; a first magnetic layer formed over the seed layer; a tunnel barrier layer formed over the first magnetic layer; and a second magnetic layer formed over the tunnel barrier layer.

Abstract: Disclosed are electronic devices comprising a semiconductor memory unit capable of reducing the switching current of a variable resistance element for switching between different resistance states. One implementation of a disclosed electronic device may include a first magnetic layer having an easy magnetization axis in a first direction and having a variable magnetization direction, a third magnetic layer having a magnetization direction pinned in the first direction, a second magnetic layer interposed between the first magnetic layer and the third magnetic layer, and having a magnetization direction pinned in a second direction different from the first direction, a tunnel barrier layer interposed between the first magnetic layer and the second magnetic layer, and a non-magnetic layer interposed between the second magnetic layer and the third magnetic layer.

Abstract: A variable resistance element includes: first and second magnetic layers having a lanthanide series element alloyed in a nickel-iron compound; and a tunnel barrier layer interposed between the first and second magnetic layers.

Abstract: A magnetic memory device includes a first fixing layer, a first tunnel barrier coupled to the first fixing layer, a free layer coupled to the first tunnel barrier and having a stacked structure including a first ferromagnetic layer, an oxide tunnel spacer, and a second ferromagnetic layer, a second tunnel barrier coupled to the free layer, and a second fixing layer coupled to the second tunnel barrier.