Abstract: A method of fabricating a micro-vertical structure is provided. The method includes bonding a second crystalline silicon (Si) substrate onto a first crystalline Si substrate by interposing an insulating layer pattern and a cavity, etching the second crystalline Si substrate using a deep reactive ion etch (DRIE) process along a [111] crystal plane vertical to the second crystalline Si substrate, and etching an etched vertical surface of the second crystalline Si substrate using a crystalline wet etching process to improve the surface roughness and flatness of the etched vertical surface. As a result, no morphological defects occur on the etched vertical surface. Also, footings do not occur at an etch end-point due to the insulating layer pattern. In addition, the micro-vertical structure does not float in the air but is fixed to the first crystalline Si substrate, thereby facilitating subsequent processes.

Abstract: Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.

Abstract: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.

Abstract: Provided is a heat uniforming device for an electronic apparatus, which improves the flow and circulation of operating fluid through evaporation and condensation using capillary attraction. The heat uniforming device for the electronic apparatus includes: an evaporation unit comprised of a planar first plate including a first multi-channel capillary region for evaporating an externally injected operating fluid due to heat transmitted from a heating source; and a condensation unit comprised of a planar second plate including a second multi-channel capillary region for condensing vapor supplied from the evaporation unit and a return region having a fluid path that communicates with all channels of the second multi-channel capillary region.

Abstract: A method of fabricating a micro-vertical structure is provided. The method includes bonding a second crystalline silicon (Si) substrate onto a first crystalline Si substrate by interposing an insulating layer pattern and a cavity, etching the second crystalline Si substrate using a deep reactive ion etch (DRIE) process along a [111] crystal plane vertical to the second crystalline Si substrate, and etching an etched vertical surface of the second crystalline Si substrate using a crystalline wet etching process to improve the surface roughness and flatness of the etched vertical surface. As a result, no morphological defects occur on the etched vertical surface. Also, footings do not occur at an etch end-point due to the insulating layer pattern. In addition, the micro-vertical structure does not float in the air but is fixed to the first crystalline Si substrate, thereby facilitating subsequent processes.

Abstract: There is provided a micromachined sensor for measuring a vibration, based on silicone micromachining technology, in which a conductor having elasticity is connected to masses moving due to a force generated by the vibration and the vibration is measured by using induced electromotive force generated due to the conductor moving in a magnetic field.

Abstract: A method for fabricating a metal micro heat pipe with a polygonal cross-section to allow working fluid to flow by capillary force generated at edges of the polygonal of the micro heat pipe. The polygonal cross-section is formed of a single metal layer via a single drawing process. The micro heat pipe is formed of a single metal plate.

Abstract: There is provided a bidirectional readout circuit for detecting direction and amplitude of an oscillation sensed at a capacitive microelectromechanical system (MEMS) accelerometer, the bidirectional readout circuit converting capacitance changes of the capacitive MEMS accelerometer into a time change amount by using high resolution capacitance-to-time conversion technology and outputting the time change amount as the direction and the amplitude of the oscillation by using time-to-digital conversion (TDC) technology, thereby detecting not only the amplitude of the oscillation but also the direction thereof, which is capable of being applied to various MEMS sensors.

Abstract: Provided is a flat plate-type heat pipe formed of a flat pipe having a predetermined through-hole formed therein and a plurality of grooves extending from an inner surface of the through-hole in a longitudinal direction so that, while the interior of the heat pipe is in a vacuum state, heat in the heat pipe is discharged to the exterior due to a phase change of between liquid and gaseous states of working fluid and the working fluid flows by a capillary force produced from the plurality of grooves, whereby it is possible to obtain a strong capillary force and an excellent cooling effect while it is manufactured through a simple process.

Abstract: Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.

Abstract: A method for fabricating a metal micro heat pipe with a polygonal cross-section to allow working fluid to flow by capillary force generated at edges of the polygonal of the micro heat pipe. The polygonal cross-section is formed of a single metal layer via a single drawing process. The micro heat pipe is formed of a single metal plate.

Abstract: A method for fabricating a metal micro heat pipe with a polygonal cross-section including at least two concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe. The concave sides are each formed of a single metal layer via a single drawing process. The polygonal cross-section is triangular, and the micro heat pipe is formed of a single metal plate.

Abstract: A micro heat pipe with a polygonal cross-section is manufactured via drawing. The micro heat pipe has flat or concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe. Another micro heat pipe is manufactured by forming a plurality of through holes with a polygonal cross-section in a metal plate via extrusion, in which each of the through holes has flat or concave sides to allow working fluid to flow by capillary force generated at the edges of each of the through holes. The micro heat pipes can be manufactured easily via drawing or extrusion, can induce strong capillary force through simple structural modifications, and provide superior cooling effects.

Abstract: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.

Abstract: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.