Abstract: A procedure for producing printed circuit boards with pads for insertion of SMDs. A copper lined base plate is provided with a positive photoprotective layer with a coating thickness lesser or equal to the depth of the pads to be built up for the connection of SMD components. The positive photoprotective layer is exposed using a primary film with a window mask corresponding to the desired pad arrangement, and the exposed base plate is developed in a developing bath such that the photoprotective layer is removed in the area of the exposed windows, exposing open copper areas there. The base plate developed in this way is exposed with a secondary film with a mask for the strip conductors, whereby the strip conductors are modeled as opaque areas.

Abstract: The invention relates to an apparatus for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the apparatus is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously.

Abstract: A process for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the process is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously. An apparatus for the electrostatic lacquering of printed circuit boards is also disclosed.