Abstract: BGA chip module and method for producing the BGA chip module by providing a carrier, forming holes at points at which bonding points of the BGA chip module are to be produced, forming metallization areas on an upper side of the carrier and covering the holes, connecting bonding points of a chip to the metallization areas, and introducing bonding elements into the holes.

Abstract: A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provided with at least one opening, into which the at least one semiconductor chip is inserted. The carrier layer, the intermediate layer and the coverlayer are connected one above another and form a submodule. If a plurality of submodules are installed above one another, a semiconductor component is provided in which the semiconductor chips are located in several mutually overlying planes. The semiconductor chips can be interconnected. A method for producing a semiconductor component is also provided.

Abstract: A semiconductor component has one or more semiconductor chips with contact pads, a number of substrate layers, component contacts and conductor tracks which establish the electrical connection between the contact pads of the semiconductor chip and the component contacts. The substrate layers are respectively provided with conductor tracks and at least one opening and the chip or chips are placed in the opening. A plurality of substrate layers are interconnected lying above one another. The conductor tracks of respective substrate layers end in an area in the vicinity of the at least one semiconductor chip and in an edge area of the respective substrate layer.

Abstract: A semiconductor component has a semiconductor chip, connection elements, and a housing made of a molding compound. The semiconductor chip has contact pads on a top side. The contact pads are electrically connected to the connection elements via bonding wires. The connection elements overlap the semiconductor chip and they are affixed to the semiconductor chip with an adhesive tape. The adhesive tape has a carrier sheet of aluminum oxide and an adhesive layer applied on both sides of the carrier sheet.