Abstract: The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a ? value, as defined by X-ray diffraction<0.0020, having at least 50% degree of crystallinity, and being anisotropic with respect to crystallographic direction.

Abstract: This invention is a flexible conductive ink composition comprising (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m2/g.

Abstract: The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Abstract: The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6).

Abstract: The present invention relates to a conductive coating composition comprising a polyolefin copolymer resin comprising an olefin monomer and acrylic acid comonomer or (meth)acrylic acid comonomer, a plurality of anisotropic nanoparticles and a solvent.

Abstract: The present invention relates to a composition comprising a) one or more resin; b) electrically conductive particles and/or non-conductive particles and/or thermally conductive particles; and c) from 5 to 40% of a solvent and/or a reactive diluent by weight of the total weight of the composition, wherein said solvent and/or reactive diluent has a boiling point higher than 130° C., and wherein said composition has no crossing over of the storage modulus (G?) and the loss modulus (G?), and wherein the storage modulus (G?) is lower than the loss modulus (G?). A composition according to the present invention is suitable for application with laser Induced Forward Transfer (LIFT).

Abstract: The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Abstract: Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.

Abstract: The present invention is related to an electrically conductive, hot-melt adhesive or molding composition, said composition comprising: a) a binding agent which comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide, copolyamide, polyolefins, poly(meth)acrylates, polystyrene, polyurethanes, polyesters, ethylene copolymers, ethylene vinyl copolymers, styrenic block copolymers, polylactic acid, silicones, epoxies and polyols; and, b) a conductive filler comprising particles (p1) which have a mass median diameter (D50) of ?100 microns and which are selected from the group consisting of flakes, platelets, leaf-like particles, dendritic particles, rods, tubes, fibres, needles and mixtures thereof, wherein said composition has a melt viscosity of from 2500 to 25000 mPa·s as measured at 210° C. and is further characterized in that said particles (p1) constitute from 15 to 70 wt. %, by weight of the composition.

Abstract: The present invention is directed to an electrically conductive composition for use in the preparation of an electrically conductive network, said composition comprising, based on the total weight of the composition: a) from 75 to 98 wt. % of a silver powder having a tap density of at least 4.0 g/cm3 and a specific surface area of less than 1.5 m2/g; b) from 1 to 10 wt. % of a binder resin; c) from 0 to 5 wt. % of a hardener; and, d) from 0 to 10 wt. % of solvent, wherein said composition is characterized in that, when heated to a temperature at which the silver powder starts to sinter, the binder resin is not yet fully cured or fully solidified.

Abstract: The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a ? value, as defined by X-ray diffraction <0.0020, having at least 50% degree of crystallinity, and being anisotropic with respect to crystallographic direction.

Abstract: The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 ?m to 50 ?m, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive.

Abstract: The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof. The adhesive composition of the present invention comprise at least one (co)polymer binder and at least one filler, as defined herein. The thermally conductive hotmelt adhesive composition according to the present invention is also intended to encapsulate heat generating devices such as printed circuit boards to provide better heat dissipation.

Abstract: The present invention relates to a heating element, which is integrated into the construction material. Integration of the heating element according to the present invention into the construction material limits space needed for the heating system. In addition, the used heating element provides reduced power consumption compared to conventional technologies. A construction element according to the present invention comprises a construction material, a heating element comprising a foil comprising a PTC composition layer or a PTC composition layer, at least one adhesive layer, a substrate and a connector, wherein said heating element is embedded between said construction material and said substrate, and wherein said PTC layer comprises a semi-crystalline material, at least one binder and an electronically conductive material.

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.-%, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

Abstract: The present invention relates to a positive temperature coefficient composition comprising a semi-crystalline material, at least one binder, from 0.5 to 9.5% by weight of an electronically conductive material and a solvent. Furthermore, the present invention relates to use of a positive temperature coefficient composition according to the present invention in heating elements and sensors. A positive temperature coefficient composition according to the present invention provides low and stable resistance till self-regulating temperature, which allows fast heating of the heating element. Furthermore, the positive temperature coefficient composition according to the present invention has high PTC ration and therefore, has higher safety and more power can be applied to the heating element.

Abstract: The present invention relates to a conductive coating composition comprising a polyolefin copolymer resin comprising an olefin monomer and acrylic acid comonomer or (meth)acrylic acid comonomer, a plurality of anisotropic nanoparticles and a solvent.

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesives comprise at least one resin component, micron-sized electrically conductive particles having an average particle size of 2 ?m to 50 ?m, and from 0.01 to 15 wt. % of sub-micron-sized electrically conductive particles having a average particle size of 300 nm to 900 nm.

Abstract: Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.

Abstract: Provided herein are conductive ink compositions having a good balance between adhesion to substrate, nanoparticle stability, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering nanoparticulate silver to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of nanoparticulate silver-filled formulation to a non-metallic substrate.